All items tagged with product development (920)
Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options
January 10, 2019 by audioXpress Staff

Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options

Microchip Technology, via its Microsemi Corporation subsidiary, announced that its AcuEdge ZLK38AVS Development Kit for Amazon Alexa Voice Service (AVS) now introduces far-field voice pick up and the flexibility to build devices with multiple mic array configurations. The audio front-end solution with one, two and three mic configurations reduces bill of materials costs while addressing the requirements of small-form-factor designs.
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ESS Technology Introduces Suite of High-Quality USB-C Audio CODECs Featuring Sabre DACs
January 4, 2019 by audioXpress Staff

ESS Technology Introduces Suite of High-Quality USB-C Audio CODECs Featuring Sabre DACs

ESS Technology announced a series of USB Low-Power Audiophile CODECs that feature QUAD DAC Technology. Intended for use in headsets and audio adaptors that demand high-quality sound, the new line of CODECs can support end-to-end high-resolution audio quality. An ideal platform for USB-C audio products, the new CODECs include the flagship ES9281PRO model, which also offers an integrated hardware MQA (Master Quality Authenticated) renderer.
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CEVA Announces New CEVA-BX All-Purpose Hybrid DSP / Controller Architecture
January 4, 2019 by audioXpress Staff

CEVA Announces New CEVA-BX All-Purpose Hybrid DSP / Controller Architecture

CEVA announced its new all-purpose, hybrid DSP / Controller architecture to address new algorithms of digital signal processing in voice, video, communication, sensing and digital signal control applications. Offering general purpose DSP capabilities required for motor control and electrification, the new CEVA-BX architecture extends CEVA's market reach into the burgeoning automotive and industrial markets currently underserved by legacy DSPs or MPU/MCUs with low performance DSP co-processing.
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Universal Electronics and Microsoft Collaborate on a Turnkey Digital Assistant Platform for Smart Home Hub
January 4, 2019 by audioXpress Staff

Universal Electronics and Microsoft Collaborate on a Turnkey Digital Assistant Platform for Smart Home Hub

Universal Electronics (UEI), a company specializing in universal control and sensing technologies for the smart home, announced a collaboration with Microsoft to launch a new digital assistant platform for the home built on the Microsoft Azure cloud platform using AI and IoT services. The UEI’s Nevo Butler turnkey smart home hub with nevo.ai built-in digital assistant will be launched at CES 2019 and will be available as a white-label solution for other manufacturers.
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Optek Licenses and Deploys CEVA Bluetooth IP for Next-Generation Bluetooth 5 Wireless Audio Applications
January 2, 2019 by audioXpress Staff

Optek Licenses and Deploys CEVA Bluetooth IP for Next-Generation Bluetooth 5 Wireless Audio Applications

CEVA, a leading licensor of signal processing platforms and artificial intelligence processors for connected devices, announced that Optek Digital Technology, a fabless semiconductor company of advanced multimedia SoCs, has licensed and deployed CEVA’s RivieraWaves Bluetooth 5 Dual Mode IP in its latest OTK528X multimedia System-on-Chip (SoC), targeting artificial intelligence (AI), voice and music market segments and applications including hearables, wireless speakers, on/in ear headphone, multi-channel AVR, musical instruments and voice user interface (VUI).
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Voice Coil January 2019 is Here and Ready for Another Year!
December 28, 2018 by audioXpress Staff

Voice Coil January 2019 is Here and Ready for Another Year!

Voice Coil January 2019 is now available. This edition focuses on New Materials for Earphones and Headphones and also includes a valuable listing of Earphone and Headphone Manufacturers and a schedule of headphone-centric events for the year. In Acoustic Patents, James Croft looks at a new patent of a multilayer voice coil plate and flat speaker based on the same, while in this month's Test Bench Vance Dickason features a 1" compression driver from Radian Audio Engineering, and a 1" soft dome tweeter from Eminence. This is much more, now available in print and download.
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Airgain Collaborates with Quantenna on New Wi-Fi 6 Reference Design
December 20, 2018 by audioXpress Staff

Airgain Collaborates with Quantenna on New Wi-Fi 6 Reference Design

Airgain, a leading provider of advanced antenna technologies, announced the development of a Wi-Fi 6 reference design with Quantenna Communications. The new design will enable swift development of high performance IEEE 802.11ax (Wi-Fi 6) devices incorporating Airgain’s Wi-Fi 6 antenna solution and Quantenna’s high-performance Wi-Fi 6 chipset, the QSR10GU-AX PLUS.
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WiSA Introduces “WiSA Endorsed” Designation for Amplifiers
December 19, 2018 by audioXpress Staff

WiSA Introduces “WiSA Endorsed” Designation for Amplifiers

WiSA, the (Wireless Speaker and Audio) Association, an industry group composed of over 40 leading brands including founding member Summit Wireless Technologies, introduces "WiSA Endorsed" for audio amplifiers designed for use in today’s powered home audio speakers. This new designation coincides with the launch of member brand Infineon Technologies MERUS MA12070 4-26V ultra-efficient audio amplifier which is the first amplifier to receive the endorsement.
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Snips Offers Offline Options for Voice Control and Voice Assistants to OEM's at CES 2019
December 14, 2018 by Joao Martins

Snips Offers Offline Options for Voice Control and Voice Assistants to OEM's at CES 2019

Original equipment manufacturers (OEM) interested in implementing voice control in their new products without depending on Alexa or Google Assistant should visit Snips at CES 2019. Snips.ai is a French company that provides embedded voice assistants and interfaces for connected devices that run locally and offline. This year the company won a CES 2019 Best of Innovation Awards in the Embedded Technology category and will be demonstrating its technology at CES in the Eureka Park.
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Tempow Unveils New Technology for True Wireless Earbuds Compatible with Any Bluetooth Chipset
December 13, 2018 by audioXpress Staff

Tempow Unveils New Technology for True Wireless Earbuds Compatible with Any Bluetooth Chipset

As audioXpress previously anticipated, French wireless audio pioneer Tempow has been developing a new technology approach to bring next-generation True Wireless Stereo (TWS) to the Bluetooth earbud mass market. Tempow's hardware-agnostic solution lets any smartphone manufacturer create wireless earbuds with near-zero latency, increased battery, and high fidelity, in alternative to proprietary or non-standard Bluetooth solutions.
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