All items tagged with product development (919)
New AES70-2018 Features and Expanded Alliance Development Tools Widen Scope for AV Control Standard Implementation
March 13, 2019 by audioXpress Staff

New AES70-2018 Features and Expanded Alliance Development Tools Widen Scope for AV Control Standard Implementation

Centre stage on the OCA Alliance booth at the recent ISE show was the expanded feature set of the new AES70-2018 revision of the open control and monitoring standard for professional audio and AV media networks. The result of several years of collaborative work within the OCA Alliance and the AES, AES70-2018 is an evolutionary upgrade providing numerous new and improved features.
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Dialog Semiconductor Provides Audio and Configurable Mixed Signal Chipset for Huawei Honor FlyPods
March 12, 2019 by audioXpress Staff

Dialog Semiconductor Provides Audio and Configurable Mixed Signal Chipset for Huawei Honor FlyPods

Dialog Semiconductor announced that its audio and Configurable Mixed Signal ICs (CMICs) have been adopted by Huawei for their Honor FlyPods, the company’s latest True Wireless Stereo (TWS) earbuds. Five Dialog ICs provide voice control and power to Huawei’s recently announced TWS earbuds. A Dialog’s SmartBeat DA14195 System-on-Chip (SoC) is integrated into each FlyPod earbud and is connected to a pair of Voice Pick Up (VPU) sensors.
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Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers
February 27, 2019 by audioXpress Staff

Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers

Qualcomm Technologies International, a subsidiary of Qualcomm Incorporated, showcased at MWC 2019 in Barcelona the most recent wireless earbuds and hearables using the latest Qualcomm QCC5100 and QCC302x series, ultra-low power Bluetooth audio SoCs. Now available in more than 10 products, Qualcomm is finding increased traction from audio, mobile and consumer electronics manufacturers for these SoCs, allowing for a robust, low-latency and high-quality wireless audio experiences, in compact, feature-rich wireless earbuds, headsets and speakers.
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Analog Devices Unveils New SHARC Audio Module Platform for Rapid Audio DSP Project Development
February 27, 2019 by audioXpress Staff

Analog Devices Unveils New SHARC Audio Module Platform for Rapid Audio DSP Project Development

Analog Devices announced the availability of its new SHARC Audio Module (ADZS-SC589-MINI), a hardware/software platform that facilitates efficient product prototyping, development, and production of a variety of digital audio products. Delivering an innovative combination of high-performance audio signal processing components and a comprehensive software development environment, the SHARC Audio Module is ideal for effects processors, multi-channel audio systems, MIDI synthesizers, and many other DSP-based audio projects.
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ISE 2019: Networks Expanded. Audio, Video, Control, and More.
February 22, 2019 by Joao Martins

ISE 2019: Networks Expanded. Audio, Video, Control, and More.

During my time at the Integrated Systems Europe (ISE) 2019 show, I looked closely at how companies are dealing with the transition to IP networks, how prevalent some proprietary technologies still are in commercial installation and AV in particular (e.g., HDBaseT), and how manufacturers are introducing new products and concepts to integrate those networked systems, in particular those protocols that support AES67 audio and the latest SMPTE ST-2110 suite of standards in general.
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Cypress USB-C with Power Delivery Making Universal Power Adapters a Reality
February 22, 2019 by Cristina Costa

Cypress USB-C with Power Delivery Making Universal Power Adapters a Reality

Cypress Semiconductor introduced a USB-C Power Delivery (PD) solution designed to replace the myriad of barrel connectors used in power adapters that consumers are currently burdened by. It can also replace all legacy USB micro-B connectors that provide only 7.5 Watts, which is not nearly enough to power most consumer electronic devices.
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DesignSpark Engineering Community Surpasses 750,000 Members
February 21, 2019 by audioXpress Staff

DesignSpark Engineering Community Surpasses 750,000 Members

RS Components (RS), the trading brand of Electrocomponents plc, a global multi-channel provider of industrial and electronic products and solutions, and Allied Electronics & Automation multi-channel industrial distributor in the Americas, announced that its DesignSpark online engineering community has grown to more than 750,000 members. The DesignSpark family of free tools for electrical, PCB, mechanical design, and connectivity software are a valuable resource for product development and its popularity continues to grow.
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Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%
February 20, 2019 by audioXpress Staff

Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%

Nanusens, a research venture working on nano-sensors built inside CMOS devices, has announced that its proprietary technology can significantly increase the operational life of earbuds by up to 20%. This can be achieved by replacing the MEMS sensors in an earbud with a single multi-sensor chip solution that is up to ten times smaller, freeing up space for larger batteries. The company will be announcing this technology solution at MWC 2019 in Barcelona, Spain.
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Cirrus Logic Introduces Industry’s Smallest, Low-Power Boosted Smart Audio Amplifier to Support Global Shift to Mobile Stereo
February 19, 2019 by audioXpress Staff

Cirrus Logic Introduces Industry’s Smallest, Low-Power Boosted Smart Audio Amplifier to Support Global Shift to Mobile Stereo

To support the growing trend toward stereo audio in smartphones and portable devices, Cirrus Logic announced the new Cirrus Logic CS35L41 boosted smart power amplifier, based on 55nm process design. The new Class D amp delivers on the “big three” OEM requirements for mobile applications: enriched audio sound, efficient low-power management and a space-saving package. Featuring predictive algorithms, the power amp increases the audio volume when in speakerphone mode, while reducing noise and power consumption.
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NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution
February 18, 2019 by audioXpress Staff

NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution

Following a showcase at CES 2019, NXP Semiconductors announced its Immersiv3D audio solution, combining NXP software on its i.MX 8M Mini applications processor with support both Dolby Atmos and DTS:X immersive audio technologies. The i.MX 8M Mini SoC also brings smart capabilities like voice control to a broader range of consumer devices including soundbars, smart speakers, and AV receivers with the option for adding additional speakers to distribute smart voice control and immersive audio throughout the home.
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