All items tagged with product development (920)
NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution
February 18, 2019 by audioXpress Staff

NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution

Following a showcase at CES 2019, NXP Semiconductors announced its Immersiv3D audio solution, combining NXP software on its i.MX 8M Mini applications processor with support both Dolby Atmos and DTS:X immersive audio technologies. The i.MX 8M Mini SoC also brings smart capabilities like voice control to a broader range of consumer devices including soundbars, smart speakers, and AV receivers with the option for adding additional speakers to distribute smart voice control and immersive audio throughout the home.
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DECT Forum Introduces openD for Wireless Software Development
February 14, 2019 by audioXpress Staff

DECT Forum Introduces openD for Wireless Software Development

DECT Forum, the worldwide association focused on promoting the wireless home and enterprise communication industry, announced the market launch of openD, a new platform for software development using the DECT air interface for wireless applications. The launch conference will take place in Nuremberg, Fraunhofer IIS, on February 25, 2019. The initiative marks an important moment for wireless developers as the strengths of DECT and ULE (Ultra Low Energy) will become more accessible to developers and product managers alike.
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Libre Wireless MAVID Device and Software Now with Amazon Alexa Built-in
February 8, 2019 by audioXpress Staff

Libre Wireless MAVID Device and Software Now with Amazon Alexa Built-in

Leading embedded wireless voice/AI solutions provider Libre Wireless Technologies announced that its MAVID (Multiprotocol, Audio, Voice, IoT Device) super compact, ultra-low power mic-to-cloud platform and software SDK, now supports the Alexa Voice Service (AVS) built-in. The breakthrough platform incorporates a complete hardware and software solution for embedded voice, IoT, audio and wireless connectivity, and now features integrated AVS.
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OCA Alliance Promotes AES70 Control Standard Upgrade at ISE 2019
February 1, 2019 by audioXpress Staff

OCA Alliance Promotes AES70 Control Standard Upgrade at ISE 2019

The OCA Alliance – the AV trade association formed to promote awareness, implementation and development of the AES70 open network control standard – has announced the release of the latest revision of the AES70-2018 standard with new developer tools and resources, making implementation “easier than ever before”. The result of several years of collaborative work within the OCA Alliance and the AES, AES70-2018 is an evolutionary upgrade to the original AES70-2015 standard.
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CEVA Announces Availability of RivieraWaves Bluetooth 5.1 IP
January 30, 2019 by audioXpress Staff

CEVA Announces Availability of RivieraWaves Bluetooth 5.1 IP

CEVA announced the general release of its RivieraWaves Bluetooth 5.1 IP and multiple license agreements already signed with leading semiconductor companies. Supporting the headline new feature of Direction Finding via Angle of Arrival (AoA) and Angle of Departure (AoD) for enhanced location services, the RW-Bluetooth 5.1 IP is available in both Bluetooth Dual Mode and Bluetooth Low Energy flavors.
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CEVA Introduces WhisPro, Neural Network-Based Speech Recognition Technology For Voice Assistants and Connected Devices
January 17, 2019 by audioXpress Staff

CEVA Introduces WhisPro, Neural Network-Based Speech Recognition Technology For Voice Assistants and Connected Devices

During CES 2019, CEVA, a leading licensor of signal processing platforms and artificial intelligence processors, introduced WhisPro, a Neural Network based speech recognition technology targeting the rapidly growing use of voice as a primary human interface for intelligent cloud-based services and edge devices. WhisPro provides Trigger Phrase SDKit for always-on devices, extending CEVA's intelligent sound IP portfolio, and offering developers a holistic solution for cloud-based or edge voice-controlled devices.
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Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC
January 17, 2019 by audioXpress Staff

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

Cadence Design Systems announced that Optek has selected the Cadence Tensilica HiFi 3 DSP for its latest OTK528X Bluetooth 5 dual-mode audio/voice system on chip (SoC). Optek’s customers can now take advantage of the HiFi DSP ecosystem for optimized audio, voice and artificial intelligence (AI) speech-based recognition processing software utilized in applications including hearables, wireless speakers, soundbars, on/in ear headphones, multi-channel AVRs, musical instruments, and voice user interface (VUI) devices.
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Skyworks Powers Wireless Audio Connectivity Applications on Sonos New Amp
January 17, 2019 by audioXpress Staff

Skyworks Powers Wireless Audio Connectivity Applications on Sonos New Amp

Skyworks Solutions announced that its wireless engines are delivering connectivity in Sonos’ new versatile digital amplifier, the Amp. Specifically, Sonos is leveraging several of Skyworks’ front-end solutions to facilitate robust Wi-Fi communications allowing users to effortlessly transmit high-quality sound throughout the home with their mobile phones. With the surge in connected devices across the Internet of Things (IoT), wireless capability has become the critical link for many applications.
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Turning Up the Innovation on Smart Speaker Designs
January 16, 2019 by Benwei Xin and Wenchau Albert Lo

Turning Up the Innovation on Smart Speaker Designs

For its December 2018 edition, audioXpress compiled a Voice Market Update that explores some of the latest developments and platforms for voice processing, with contributed articles from world-renowned experts in voice. In this article, Benwei Xin and Wenchau Albert Lo explain where designers should focus to Turn Up the Innovation on Smart Speaker Designs. This article was originally published in audioxpress, December 2018.
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Analogix Announces Second Generation ANX74xx Family of 10 Gbps USB 3.2 Single-Chip Re-Timers
January 14, 2019 by Cristina Costa

Analogix Announces Second Generation ANX74xx Family of 10 Gbps USB 3.2 Single-Chip Re-Timers

Analogix Semiconductor announced the availability of its second generation ANX74xx family of 10 Gbps USB-C re-timers capable of switching DisplayPort and USB 3.2 Gen2 signals to support a single USB-C port for next generation high-performance, low-power notebooks, 2-in-1 convertible laptops, desktop PCs, mobile devices, and servers. Built on a market proven architecture, the ANX74xx family complies with USB Repeater Specification for USB Gen 1 (5G) and Gen 2 (10G).
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