All items tagged with product development (919)

SEGGER Introduces Microcontroller-Based Dual USB Development Platform

December 7, 2018 by audioXpress Staff

SEGGER Introduces Microcontroller-Based Dual USB Development Platform

SEGGER announced emPower-USB-Host, a compact low-cost development board with two USB host ports, where many applications using USB peripherals can be realized with little effort and in a cost efficient way. Precompiled applications for barcode and smartcard readers, as well as POS displays, LTE sticks, and USB to LAN adapters are available for download, including complete projects for Embedded Studio with source code of these applications. Applications using SEGGER's emUSB-Host software API can easily access different types of USB devices.

AgigA Tech Awarded Patent for Adaptive Management of Supercapacitors

December 5, 2018 by Cristina Costa

AgigA Tech Awarded Patent for Adaptive Management of Supercapacitors

AgigA Tech, a provider of high-speed, high-density, battery-free non-volatile memory solutions and a subsidiary of Cypress Semiconductor, announced the issuance of United States Patent No. 10,134,451 relating to the adaptive training and adjustment to changing capacitor values based upon age and usage behavior. The patent brings AgigA Tech’s portfolio total to 22 granted. Having focused on the development of non-volatile DIMM, or NVDIMM, and related technology for more than 10 years, many of the patents in AgigA Tech’s portfolio are fundamental to this increasingly pervasive product category.

New RISC-V SoC FPGA Architecture Supports Real-Time Linux Development

December 5, 2018 by audioXpress Staff

New RISC-V SoC FPGA Architecture Supports Real-Time Linux Development

Microchip Technology, via its Microsemi Corporation subsidiary, extended its Mi-V ecosystem by unveiling the architecture for a new class of SoC FPGAs that combine the industry's lowest power mid-range PolarFire FPGA family with a complete microprocessor subsystem based on the open, royalty-free RISC-V instruction set architecture (ISA). Demonstrations took place during RISC-V Summit (Dec. 4-5) to show size, power and performance benefits of integrating PolarFire SoC's Hard CPU Subsystem with Programmable Logic.

Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds

November 29, 2018 by audioXpress Staff

Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds

CEVA, the leading licensor of signal processing platforms for connected devices, along with French wireless audio pioneer Tempow, unveiled a collaboration to bring next-generation True Wireless Stereo (TWS) to the Bluetooth earbud mass market. As mentioned in a recent article by CEVA's Marketing Director, Franz Dugand, the resulting joint IP solution delivers synchronized left/right audio over standard Bluetooth dual mode connected links with short latency and without the power consumption penalty associated with many of today’s TWS implementations.

Sonova Announces SWORD 3.0 Wireless Chip for Hearing Aids with CEVA Bluetooth IP

November 27, 2018 by audioXpress Staff

Sonova Announces SWORD 3.0 Wireless Chip for Hearing Aids with CEVA Bluetooth IP

CEVA announced that Sonova Holding AG, a leading provider of hearing solutions, has licensed and deployed CEVA’s RivieraWaves Bluetooth IP in its latest SWORD 3.0 wireless chip for hearing aids and other smart hearing devices. The latest generation wireless chip leverages RivieraWaves’ Bluetooth dual mode IP and Sonova’s ultra-low power communication technology to enable true stereo audio streaming to hearing aids.

Renesas Extreme Low-Power SOTB Process Technology Uses Energy Harvesting and Very Low Current Levels to Power Connected Devices

November 16, 2018 by Cristina Costa

Renesas Extreme Low-Power SOTB Process Technology Uses Energy Harvesting and Very Low Current Levels to Power Connected Devices

Renesas Electronics unveiled an innovative energy-harvesting embedded controller that can eliminate the need to use or replace batteries in connected devices. Developed based on Renesas' breakthrough SOTB (silicon-on-thin-buried-oxide) process technology, the new embedded controller achieves extreme reduction in both active and standby current consumption, a combination that was not previously possible to achieve in conventional microcontrollers (MCUs).

Foxconn, Innovo Audio Designs, and System Audio Join Wireless Speaker and Audio Association

November 8, 2018 by audioXpress Staff

Foxconn, Innovo Audio Designs, and System Audio Join Wireless Speaker and Audio Association

The Wireless Speaker and Audio Association (WiSA), an industry group comprised of over 40 leading brands including founding member Summit Wireless Technologies, announced Foxconn Technology Group, Innovo Audio Designs and System Audio as its newest members. The strong and growing list of WiSA members is largely driven by the Association’s WiSA Ready platform and its recently revitalized leadership.

Microchip Announces Industry’s Smallest Multi-output MEMS Clock Generator

November 6, 2018 by audioXpress Staff

Microchip Announces Industry’s Smallest Multi-output MEMS Clock Generator

Microchip Technology announced the industry’s smallest MEMS clock generator, ideal for the development of connected devices and mobile/portable applications. This new device can replace up to three crystals and oscillators on a board, reducing timing component board space by up to 80 percent. The DSC613 clock family eliminates the need for an external crystal by integrating a low-power and high-stability Micro-Electro-Mechanical Systems (MEMS) resonator.

Cadence Introduces Tensilica HiFi 5 DSP Optimized for AI Speech and Audio Processing

November 1, 2018 by audioXpress Staff

Cadence Introduces Tensilica HiFi 5 DSP Optimized for AI Speech and Audio Processing

Cadence Design Systems announced the Cadence Tensilica HiFi 5 DSP for audio and voice, the company's first IP core optimized for high-performance far-field processing and artificial intelligence (AI)-based speech recognition processing. This fifth-generation HiFi DSP offers 2X audio processing and 4X neural network (NN) processing improvements versus the HiFi 4 DSP, making it ideal for voice-controlled user interfaces in digital home assistants and automotive infotainment.

Atmosic Technologies Introduces Innovative Bluetooth 5 Solution for Very Low-Power Wireless Devices

October 24, 2018 by Cristina Costa

Atmosic Technologies Introduces Innovative Bluetooth 5 Solution for Very Low-Power Wireless Devices

Atmosic Technologies, a startup company from Saratoga, California, announced what the company claims to be the industry’s lowest power wireless Bluetooth 5 platform, allowing manufacturers to deliver extended battery life and battery-free connected devices. Atmosic's inaugural M2 and M3 series SoC's will be able to power all sorts of low-power designs and deliver energy harvesting for connected devices.

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