The USound Micro-Electro-Mechanical Systems (MEMS) Speaker module design uses physical frequency crossover technology, with finished parts of acoustic design including sound chamber and pipes. This module is a ready-to-use solution for hearing aids and true wireless earbuds, which manufacturers in this market can easily integrate in their designs by changing the venting volume to achieve a different sound experience.
The audio module is available in two versions: a two-way audio system and a full-range ultra-compact audio module. The two-way audio system includes a USound’s MEMS speaker from the Conamara series as a tweeter and an electrodynamic speaker as a woofer. This combination allows for increased playtime, better sound quality, and performance.
"Hearables manufacturers can now create more ergonomic and comfortable hearables, with extended battery life and audio quality. With this module, the form factor of hearing aids and TWS is considerably reduced, and the performance surpasses market standards,” adds Andrea Rusconi, CTO at USound.
USound has been collaborating with the Chinese company Luxshare-ICT on the development of this audio module as well as AT&S (Austria Technologie & Systemtechnik,) a manufacturer of high-end printed circuit boards and integrated circuit substrates. AT&S already produces the circuit board which mounts USound’s Ganymede and Conamara microspeakers. USound also co-developed TWS prototypes with the Chinese company Innovation, which successfully integrates USound’s MEMS speakers from the Ganymede series and can be used as a blueprint to design true wireless stereo (TWS) earbuds.
USound offers high-performance silicon speakers and high-quality sound solutions based on MEMS technology, safeguarded by over 300 filed patents. The company is headquartered in Vienna, Austria and has offices in San Francisco and Shenzhen.
www.usound.com
