The new audio modules are an extension of the existing long-term partnership between USound and AT&S that began in 2015. AT&S currently produces the circuit board which mounts USound’s Ganymede and Conamara MEMS micro-speakers in its reference designs.
"Having a fully integrated audio module will take True Wireless Earbuds to the next level. It’ll reduce the form factor of earbuds dramatically, allowing them to be more ergonomic and opens the possibility of adding more embedded technology, such as sensors,” says Ferruccio Bottoni, CEO of USound. “AT&S offers high-end advanced packaging solutions for high-volume products enabling us to deliver this new audio solution already within 2022."
USound expects to be able to offer this new TWS audio module option for developers and manufacturers within the second quarter of 2022. USound continues to expand its range of high-performance silicon speakers and high-quality sound solutions based on MEMS technology, safeguarded by over 300 filed patents. With its offices in Graz, Vienna, San Francisco, and Shenzhen, USound is able to support international brands and OEMs on its audio applications with MEMS drivers.
At its locations in Europe and Asia, AT&S develops and produces printed circuit boards and IC substrates for its global partners, especially for applications in the areas of communication, computer and consumer electronics, mobility, industry, and medical technology. The company is headquartered in Leoben, Austria, and employs more than 13,000 people across the globe.
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