Cristiano Amon, Qualcomm President and CEO took the stage at IFA 2022 in Berlin, Germany to deliver the opening keynote sharing the key trends and technologies that are enabling users to enjoy extraordinary experiences, powered by the company's Snapdragon platforms and technologies. Amon announced several partnerships with multiple companies, including inviting Lila Snyder, Bose CEO on stage to discuss the two company's longstanding relationship and close development cooperation. Snyder confirmed that Bose will incorporate Qualcomm Voice and Music Platforms into future connected devices.
Broadened collaboration will see Qualcomm continuing to support Bose as they develop audio devices for a new age of wireless audio – on the go, in the home, and in the car. The latest Qualcomm S5 Audio SoC will provide robust connectivity, ultra-low power and advance processing for Bose audio products, enabling key voice and seamless sound experiences, for music, calls, gaming, and more.
"Bose is undoubtedly one of the most iconic brands in audio and I’m proud to see our long-standing relationship continue to grow," said Cristiano Amon. "Bose has an incredibly robust and competitive product roadmap that will leverage our most premium audio and connectivity platforms to bring to market their most innovative audio devices ever."
"Bose and Qualcomm Technologies have collaborated closely for many years to implement solutions that raise the bar for consumer audio experiences,” said Lila Snyder. "And as we build on this important relationship, we’ll continue working together to push the limits of what’s possible for our products and technologies to bring people more enjoyment from their music and content than ever before."
S5 Sound Platform
Qualcomm S3 and S5 SoCs have been announced by the company at Mobile World Congress 2022. The two new platforms marked the expansion of the Snapdragon Sound solution announced by the company in 2021. These new audio platforms combine Bluetooth Classic and LE Audio, aiming to significantly improve audio quality in wireless earbuds, headphones, and mobile device applications by leveraging Qualcomm Snapdragon mobile, and the new FastConnect 6900, and 7800 subsystems. A premium-tier, DSP and application-programmable platform – supporting Lossless and high-resolution audio, adaptive active noise cancellation, low latency audio for gaming, and premium connectivity.
The Qualcomm S5 Sound Platform is the most advanced, optimized for AI, and ultra-low power performance with double the compute compared of its predecessor. It is based on a dual core 32-bit processor application subsystem (up to 80MHz) and dual core 240Mhz programmable DSP audio subsystem (runs from ROM). Built on a Bluetooth 5.3 dual mode radio, this platform already enables the full range of LE Audio features, delivering on the Snapdragon Sound strategy that supports the full suite of aptX Adaptive codecs, Qualcomm TrueWireless Mirroring, and other technologies.
Snapdragon Sound allows for ultra-low latency wireless audio, at just 68ms, to fully synchronize audio with screen content, together with a wireless voice back channel for in-game chat. Content creators can record the left and right external audio streams from their true wireless earbuds, and there is support for wake-word and/or button activated digital assistants including Amazon Alexa Voice Service and Google Assistant, as well as support for Google Fast Pair.
Qualcomm's third-generation Adaptive Active Noise Cancellation (ANC) delivers sophisticated filters pushed to the max, seamlessly adapting to wind noise, and adjust transparency depending on the users' environment, regardless of the earbuds fit. For communications, Qualcomm aptX Voice Audio and Snapdragon Sound deliver super wideband voice quality with 32kHz sampled audio and a flat 16kHz frequency response. Support for up to 3-microphone Qualcomm cVc Echo Cancelling and Noise Suppression (ECNS) is also built-in.
www.bose.com
https://www.qualcomm.com/products/application/audio/qualcomm-s5-sound-platform
