All items tagged with SoC (136)

Sonical Partners With Dolphin Design to Develop the Silicon for Open Hearables

September 5, 2022 by Joao Martins

Sonical Partners With Dolphin Design to Develop the Silicon for Open Hearables

Sonical, the Silicon Valley company developing an open software platform for hearables, announced a partnership with Dolphin Design, a leading edge computing and embedded AI silicon IP company, and a subsidiary of Soitec, an industry leader in designing and manufacturing innovative semiconductor materials. Together, the two companies are working on a heterogeneous computing platform to design ASIC/SoCs with an innovative operating system that will change the end-user experience with hearables.

Bose to Launch New Wireless Earbuds Powered by Qualcomm S5 Audio SoC

September 2, 2022 by Joao Martins

Bose to Launch New Wireless Earbuds Powered by Qualcomm S5 Audio SoC

At IFA 2022 in Berlin, Qualcomm Technologies and Bose highlighted their continued collaboration during Cristiano Amon’s opening keynote. Bose is integrating Qualcomm wireless voice and music platforms across their portfolio of premium earbuds, headphones, speakers and soundbars. Qualcomm also confirmed that the new Bose QuietComfort Earbuds II, which are scheduled to be unveiled September 7, will be Powered by the new Qualcomm S5 Sound Platform.

Jabra Introduces Mainstream Elite 5 True Wireless Earbuds

September 2, 2022 by Joao Martins

Jabra Introduces Mainstream Elite 5 True Wireless Earbuds

Among the many products introduced in the true wireless earbuds category at IFA 2022, GN stands out with the Jabra Elite 5 announcement. The newest addition to Jabra’s TWS earbuds lineup, the Elite 5 are engineered to provide advanced features for both phone calls and audio listening, at a consumer-friendly price of $149.99. Key features include hybrid Active Noise Cancellation (ANC) powered by a Qualcomm QCC3050 Bluetooth SoC, 6 microphones with wind noise suppression and powerful 6mm drivers with AAC and aptX Bluetooth support.

StreamUnlimited and GrAI Matter Labs Demonstrate Real-Time Sound Source Separation AI Platform at IFA-2022

September 1, 2022 by Joao Martins

StreamUnlimited and GrAI Matter Labs Demonstrate Real-Time Sound Source Separation AI Platform at IFA-2022

GrAI Matter Labs (GML) and StreamUnlimited announced a partnership to demonstrate multiple novel applications using Artificial Intelligence (AI) in music and consumer audio. The companies will promote their expertise in product development for consumer devices in connected audio and AI, creating new reference platforms to deliver new experiences in speech, music and multimedia for portable speakers, soundbars, TVs and more.

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

July 21, 2022 by Cristina Costa

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

Dolphin Design, an advanced chip design company and leading specialist in Edge Computing and AI platforms, and Big Fish Semiconductor have entered into a long-term partnership. Big Fish Semiconductor’s U2 BLE 5.2 Audio AI SoC (TSMC 40nm uLP process ultra-low power audio chip), now in mass fabrication, is the first outcome of this partnership. The high-performance recording capabilities of the U2 BLE 5.2 Audio AI SoC are made possible by Dolphin Design's 24-bit delta-sigma audio ADC, which combines superior audio performance, small area and ultra-low power consumption.

Synaptics’ Triple Combo Wireless System-on-Chip Wins "2022 Best of Sensors" Award

June 29, 2022 by audioXpress Staff

Synaptics’ Triple Combo Wireless System-on-Chip Wins "2022 Best of Sensors" Award

Synaptics received the "2022 Best of Sensors” Award for Connectivity with its SYN4381 Triple Combo, the industry’s first Matter-compliant SoC with integrated Wi-Fi 6/6E, Bluetooth 5.2, and 802.15.4/Thread. The award was presented at Sensors Converge 2022 in a ceremony that honors the best technologies in the large and growing ecosystem. Synaptics’ FlexSense 4-in-1 sensor fusion processor was also recognized as a Finalist in the “Best of Sensors” Awards’ for wearables.

Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA

June 27, 2022 by Joao Martins

Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA

Flex Logix Technologies and CEVA, have announced the world’s first successful silicon implementation using Flex Logix’s EFLX embedded FPGA (eFPGA) connected to a CEVA-X2 DSP instruction extension interface. Enabling flexible and changeable instruction sets to meet demanding and changing processing workloads, the ASIC, known as SOC2, was designed and taped out in a TSMC 16nm technology by Bar-Ilan University SoC Lab, as part of the HiPer Consortium, backed by the Israeli Innovation Authority (IIA).

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

June 27, 2022 by Joao Martins

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

Nordic Semiconductor has used the latest trade shows globally to showcase its latest low power wireless solutions, and introduced a series of new development solutions targeting Bluetooth LE Audio. At the Embedded World Exhibition that took place in Nuremberg, Germany, Nordic offered demonstrations of its new nRF5340 Audio Development Kit (DK), a design platform for rapid development of LE Audio products, and the Nordic Thingy:53 a rapid prototyping solution, both based on Nordic’s nRF5340 SoC.

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

Merging Technologies Creates Scalable, High Performance AES67 Solution Based on Analog Devices SHARC SoCs

May 9, 2022 by audioXpress Staff

Merging Technologies Creates Scalable, High Performance AES67 Solution Based on Analog Devices SHARC SoCs

Merging Technologies announced the availability of its AES67 embedded solution for the ADSP-SC5xx SHARC series of System on Chips (SoCs) from Analog Devices. Merging Technologies’ experience in the audio over IP (AoIP) field (Ravenna/AES67) and Analog Device's experience in unified communications and pro-audio applications, has led to a collaboration that broadens the range of AoIP solutions for manufacturers of electronics and ultimately integrators.

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