All items tagged with SoC (136)
WiSA E Development Kits Start Shipping Worldwide
July 31, 2023 by audioXpress Staff

WiSA E Development Kits Start Shipping Worldwide

WiSA Technologies is starting to ship WiSA E development kits to key tier 1 TV and audio customers in major markets, including Korea, Japan, United States and China. WiSA E enables HDTV/soundbar brands to transmit high-quality, multichannel audio, wirelessly. Creating an ecosystem of interoperable products using standard 5GHz and 2.4GHz Wi-Fi, WiSA E offers high-performance, high-quality wireless audio transmission and reception at an affordable price.
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Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%
June 27, 2023 by audioXpress Staff

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

Dolphin Design, a semiconductor designer of power management, audio, and processing devices with in-house ASIC design services, announced the launch of WhisperExtractor, a mixed-signal technology for voice and audio-enabled SoCs, enabling voice and sound classification at a record µW level power budget. The new technology paves the way to breakthrough always-on voice user interface, real time speech-to-text, and always-on sound detection.
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Sunplus and WiSA Technologies Partner to Enable Cost-Effective Atmos Soundbar Applications up to 7.1.4 Configurations
June 16, 2023 by Joao Martins

Sunplus and WiSA Technologies Partner to Enable Cost-Effective Atmos Soundbar Applications up to 7.1.4 Configurations

WiSA Technologies and Sunplus Technology a leading chip provider for multimedia and automotive applications from Taiwan, have partnered to bring to market a multichannel immersive audio System-on-a-Chip (SoC) targeting the Atmos soundbar market. The collaboration sees WiSA licensing and porting its embeddable multichannel audio software technology for high-quality wireless audio on the Sunplus SPA300 audio processor and multi-core DSP.
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WiSA Technologies Begins Taking Pre-Orders for WiSA E Multichannel Audio Development Kits
June 12, 2023 by audioXpress Staff

WiSA Technologies Begins Taking Pre-Orders for WiSA E Multichannel Audio Development Kits

Following previous announcements and demonstrations, WiSA Technologies is now taking pre-orders for its WiSA E development kits and production-ready modules. Using the 5GHz portion of the Wi-Fi band, WiSA E offers high-performance, high-quality wireless audio transmission and reception at an affordable price. WiSA E supports multichannel audio configurations transmitting uncompressed 24-bit/48kHz audio with a fixed latency of 20 milliseconds and tight channel synchronization.
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MediaTek Partners With NVIDIA to Provide Platform Roadmap to the Automotive Industry
May 29, 2023 by Cristina Costa

MediaTek Partners With NVIDIA to Provide Platform Roadmap to the Automotive Industry

MediaTek announced a partnership with NVIDIA to deliver a complete range of in-vehicle computing and advanced AI cabin solutions for the next generation of software-defined vehicles. The collaboration combines the strength of each company's automotive portfolios to deliver solutions for state-of-the-art connected cars integrating NVIDIA GPU chiplets into the MediaTek Dimensity Auto platform.
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Synaptics Launches Triple Combo 16nm Ultra-Low-Power SoC to Drive New Automotive and Multimedia Use Cases
March 24, 2023 by Joao Martins

Synaptics Launches Triple Combo 16nm Ultra-Low-Power SoC to Drive New Automotive and Multimedia Use Cases

Offering enhanced connectivity and streaming features, Synaptics latest SYN4382 Triple Combo offers Matter-compliant Wi-Fi 2.4/5/6/6E, Bluetooth 5.3, and IEEE 802.15.4 wireless, with the ability for simultaneous operation of two radios and multiple Bluetooth channels to stream multimedia content. This state-of-the-art system-on-chip enables new exciting audio and video experiences, while lowering power consumption, cost, and system complexity.
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Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices
March 16, 2023 by audioXpress Staff

Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices

Silicon Labs continues to expand its range of wireless solutions for connected devices, and during Embedded World 2023 in Germany, the company introduced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).
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EM Microelectronic Licenses Packetcraft Host and Controller Software with Support for Bluetooth 5.4 PAwR, LE Audio and Auracast
March 13, 2023 by audioXpress Staff

EM Microelectronic Licenses Packetcraft Host and Controller Software with Support for Bluetooth 5.4 PAwR, LE Audio and Auracast

At Embedded World 2023, Packetcraft announced their latest Bluetooth 5.4 host and controller software is enabling EM Microelectronic’s flagship em | bleu (EM9305). The em | bleu single chip is a small form factor and ultra-low energy consuming Bluetooth LE SoC or companion IC solution supporting the very latest Bluetooth technology including PAwR, LE Audio and Auracast broadcast audio.
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Realtek Semiconductor and Alango Technologies Partner to Offer Joint Solution for Hearables
March 13, 2023 by Joao Martins

Realtek Semiconductor and Alango Technologies Partner to Offer Joint Solution for Hearables

Realtek Semiconductor (Taiwan) and Alango Technologies (Israel) have announced a collaboration to provide a joint solution that delivers the Alango PersonaSound suite of software technologies, ported and optimized for the latest Realtek Bluetooth SoCs. This collaboration aims to address the global problem of hearing loss, which affects 1.5 billion people worldwide.
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OPPO Unveils 12Mbps Data Rate Bluetooth Wireless Audio SoC at MWC 2023
March 2, 2023 by Joao Martins

OPPO Unveils 12Mbps Data Rate Bluetooth Wireless Audio SoC at MWC 2023

On the opening day of Mobile World Congress (MWC) 2023 in Barcelona, OPPO announced a selection of flagship devices, new core connectivity products and technologies, as well as its latest R&D breakthroughs in chip technology. On the audio domain, OPPO promised to revolutionize the industry and leave Bluetooth limitations behind with its MariSilicon Y flagship audio SoC. A world first for Bluetooth wireless audio, the new SoC promises a 12Mbps data rate.
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