All items tagged with SoC (136)

Wireless Audio and Bluetooth LE Audio - Assistance, Hearables, and Headphones 3.0

February 16, 2023 by Joao Martins

Wireless Audio and Bluetooth LE Audio - Assistance, Hearables, and Headphones 3.0

What happened at CES 2023 related to wireless audio and Bluetooth LE Audio. And what might happen at MWC 2023. And why there's lots more happening in assistance, hearables, and Headphones 3.0. This article discusses Bluetooth LE Audio and Android 13. Bluetooth 5.4 updates. Sennheiser's MobileConnect Assistive Listening app that actually works over Wi-Fi. Sonical, Antennaware, et all, Headphone 3.0. UWB, and high-quality wireless audio. Originally published in The Audio Voice 410, February 16 2023.

February 6, 2023 by Joao Martins

WiSA Technologies Begins Shipping WiSA E Multichannel Audio Development Kits to Initial Beta Customers

WiSA Technologies, a leading provider of wireless audio technologies for home theater already adopted by Bang & Olufsen, Harman, Klipsch, Savant, LG Electronics and many others, announced its first shipments of WiSA E development kits to leading audio brands developing multichannel audio systems. Using the 5GHz portion of the Wi-Fi band, WiSA E offers high-performance, high-quality wireless audio transmission and reception at an affordable price.

Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers

January 19, 2023 by audioXpress Staff

Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers

Swedish digital audio processing pioneer Dirac and leading multinational chipset maker BES announced a partnership to pre-integrate the Dirac Virtuo and Dirac Opteo software onto BES chipsets to be used by leading headphone manufacturers to deliver optimized performance in any headphone type. The announcement was made at CES 2023, where it was confirmed that boAt, Monoprice, and Sudio are the first headphone brands to leverage these Dirac-enabled BES chipsets in their devices.

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

January 3, 2023 by Joao Martins

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

Packetcraft, a leading provider of Bluetooth embedded stacks and software solutions, announced their Bluetooth Qualified LE Controller is shipping with Nordic Semiconductor’s flagship nRF5340 dual-core Bluetooth 5.3 SoC enabling LE Audio in commercial products. At CES 2023, Packetcraft is already showcasing Bluetooth LE Audio and Auracast broadcast audio applications using Nordic’s nRF5340 SoC, including from Sonical, EMSi and Fanstel.

Synaptics Launches KatanaConnect Miniature Wireless AI Vision and Audio Module

November 25, 2022 by audioXpress Staff

Synaptics Launches KatanaConnect Miniature Wireless AI Vision and Audio Module

Synaptics launched an interesting new AI System on Module (SoM) at electronica 2022. KatanaConnect combines the Katana low-power Edge AI SoC with Wi-Fi / Bluetooth wireless connectivity in an ultra-small-form-factor package to deliver AI-enabled computer vision and audio sensing capabilities. The SoM, developed with leading module vendor AMPAK, is a ready-to-use solution that enables rapid implementation of AI sensing features for connected designs targeting a range of applications, including smart home and security, and many others.

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

November 9, 2022 by audioXpress Staff

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

MediaTek launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe. Most importantly for the audio industry, this new solution will bring Bluetooth LE Audio support to many smartphones in 2023.

Highly Anticipated Return for electronica 2022, November 15 to 18

November 8, 2022 by audioXpress Staff

Highly Anticipated Return for electronica 2022, November 15 to 18

electronica, the world’s leading trade fair and conference for electronics, will take place in 14 halls on the Munich exhibition grounds from November 15 to 18, 2022. This is a highly-anticipated return for a show that promises to reengage multiple critical sectors in development and manufacturing, after four years of absence. This year’s highlights in the electronica Conference will deal with Automotive, Embedded Platforms, Sensors, and Wireless Systems and Applications.

WiSA Technologies Announces Program to License its Wireless Multichannel Audio Technology

October 26, 2022 by Joao Martins

WiSA Technologies Announces Program to License its Wireless Multichannel Audio Technology

WiSA Technologies announced a licensing program for its high-quality, multichannel wireless WiSA E software. Expanding from its original, hardware-based module approach, the new software licensing program is targeted towards HDTV platforms and speaker manufacturers. WiSA E is an interoperable audio software/IP solution designed for wireless sound technology on TV and Wi-Fi SoC platforms, enabling built-in transmission capabilities of high-quality multichannel audio streams.

Ubilite Introduces Wi-Fi SoC With Less-Than-Bluetooth Power Consumption

September 14, 2022 by Joao Martins

Ubilite Introduces Wi-Fi SoC With Less-Than-Bluetooth Power Consumption

Ubilite announced the immediate availability of its UBI206 platform and SoC, targeted specifically for ultra-low power wireless applications. The UBI206 is a highly integrated single device that enables a vast number of connected products with a minimal number of external components. Although originally designed targeting industrial IoT applications, the chip enables truly ultra-low power Wi-Fi audio streaming solutions with a 10-fold improvement in power consumption.

Exeger and Atmosic Technologies Partner to Create Energy Harvesting Solutions

September 12, 2022 by Joao Martins

Exeger and Atmosic Technologies Partner to Create Energy Harvesting Solutions

Exeger, the innovative Swedish company that created a unique solar cell flexible membrane that converts all forms of light into electrical energy continues to establish strategic partnerships and expand its proof-of-concept use cases. Exeger and US-based semiconductor company Atmosic Technologies are now working together to create attractive energy harvesting solutions for connected devices. Meanwhile, Exeger attended the IBC show in Amsterdam, to demonstrate a new TV remote control from Omni Remotes that will remain perpetually charged.

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