All items tagged with SoC (136)

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

February 22, 2021 by Joao Martins

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

CEVA unveiled Bluebud, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for fast-growing applications, including True Wireless Stereo (TWS) earbuds, hearables, gaming headsets, smartwatches and other wearable devices. The solution fully supports Bluetooth 5.2 and LE Audio design and is ready to support brands in the transition from Bluetooth Classic.

SEGGER Embedded Studio Now Available With Apple M1-Optimized Build

February 16, 2021 by audioXpress Staff

SEGGER Embedded Studio Now Available With Apple M1-Optimized Build

SEGGER announced its Embedded Studio build for the newly released Apple M1, Apple’s first ARM-based system-on-chip (SoC) designed specifically for Mac. Embedded Studio is SEGGER’s cross-platform Integrated Development Environment (IDE) for ARM/Cortex and RISC-V. According to the company, the build for the Apple M1 platform - the first commercial embedded system IDE optimized for the M1 - allows very impressive results.

Devialet Introduces Improved Phantom I All-in-One Speaker

February 4, 2021 by Joao Martins

Devialet Introduces Improved Phantom I All-in-One Speaker

Since its release, Devialet’s flagship compact speaker Phantom established a new reference in home audio. By combining a radical design with a series of innovative, proprietary technologies, Phantom consistently shattered expectations in terms of sound reproduction, while establishing a whole new business model for the French brand. Now, for 2021, Devialet updated the original Phantom with a new audio processing SoC, new matte finishes, and all the latest wireless audio technologies.

Jieli Joins TempowOS Chipset Partner Program for TWS Designs

February 1, 2021 by audioXpress Staff

Jieli Joins TempowOS Chipset Partner Program for TWS Designs

Tempow, the Bluetooth-specialist, Paris-based startup, announced a new partnership with Zhuhai Jieli Technology, a leading chipset manufacturer in the TWS Bluetooth SoC segment. Jieli Technology is joining Tempow's chipset partner program to deploy TempowOS, an operating system for True Wireless Earbuds, on its flagship AC897N and AD697N extreme low power Bluetooth TWS solutions.

Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform

January 27, 2021 by Joao Martins

Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform

Qualcomm Technologies and Amazon announced new joint efforts to pre-integrate the Alexa Custom Assistant with the Qualcomm Snapdragon Automotive Cockpit Platforms - the new-generation of automotive-optimized SoCs from Qualcomm. This new system is designed to support automotive OEMs and Tier-1 suppliers to build customizable, in-vehicle intelligent assistants and is offered as an extension module to the Alexa Automotive Software Development Kit (SDK).

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

January 7, 2021 by audioXpress Staff

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

December 4, 2020 by audioXpress Staff

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

Nordic Semiconductor has announced that its nRF5340 high-end multiprotocol Bluetooth 5.2 System-on-Chip (SoC) has entered volume production. The world’s first dual Arm Cortex-M33 wireless SoC is now available and offers all the advanced features and security required for the next-generation of connected audio applications including LE Audio and advanced wearables. The new SoC is now widely commercially available through Nordic’s distribution network.

ams Helps Differentiate New PaMu Quiet True Wireless Earbuds with Best-In-Class ANC and Augmented Hearing

November 4, 2020 by Joao Martins

ams Helps Differentiate New PaMu Quiet True Wireless Earbuds with Best-In-Class ANC and Augmented Hearing

Austrian high performance sensor manufacturer ams announced it provided an optimized digital Active Noise Cancellation (ANC) solution as a differentiating component to Padmate’s PaMu Quiet earbuds. The new cutting-edge TWS earbuds from the Chinese brand feature the latest ams AS3460 Digital Augmented Hearing combined with a Qualcomm Bluetooth SoC to deliver advanced ANC in a competitively priced, comfortable design with a design similar to the AirPods Pro.

Dirac Introduces Spatial Audio Solution for Direct Chipset Integration Into Next-Generation Wireless Headphones

September 30, 2020 by audioXpress Staff

Dirac Introduces Spatial Audio Solution for Direct Chipset Integration Into Next-Generation Wireless Headphones

Swedish digital audio pioneer Dirac announced that its latest spatial audio solution, which leverages the company's patented Dynamic HRTF technology, is now available for direct integration into the digital signal processors (DSP) of Bluetooth wireless headphones. The solution is now compatible with chipsets from Qualcomm, BES, and MediaTek and allows headphone manufacturers to deliver spatial audio to consumers, independent of playback devices or media players.

Microchip Launches Industry’s First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture

September 18, 2020 by audioXpress Staff

Microchip Launches Industry’s First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture

The rising adoption of the free and open RISC-V Instruction Set Architecture (ISA) is driving the need for an affordable, standardized development platform that embeds RISC-V technology and leverages the diverse RISC-V ecosystem. To meet this need, Microchip Technology is offering the industry’s first RISC-V based System-on-Chip (SoC) Field-Programmable Gate Array (FPGA) development kit for its own low-power, low-cost, PolarFire SoC FPGA.

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