All items tagged with SoC (136)

Ceva Brings Bluetooth Audio to Sunplus airlyra SoC Family

January 15, 2024 by audioXpress Staff

Ceva Brings Bluetooth Audio to Sunplus airlyra SoC Family

Ceva and Sunplus Technology, a leading chip provider for multimedia and automotive applications, have expanded their collaboration to integrate Ceva's latest generation RivieraWaves Bluetooth audio solution into the Sunplus airlyra family of HD audio processors targeting wireless speakers, soundbars and other premium wireless audio devices. The first wireless airlyra processors are already shipping with some of the world's premium audio brands.

Rayson Technology Launches Nordic-Powered Bluetooth LE Audio Module for Headphones, Speakers, and Audio Systems

January 4, 2024 by Joao Martins

Rayson Technology Launches Nordic-Powered Bluetooth LE Audio Module for Headphones, Speakers, and Audio Systems

Wireless communications company Rayson Technology has released a multiprotocol module based on Nordic Semiconductor’s nRF5340 System-on-Chip (SoC). The solution is designed for advanced Bluetooth LE Audio applications in consumer electronics as well as smart home. Measuring just 16.5 by 13.0 by 2.5mm, the BTM-N340X module supports LE Audio and its Low Complexity Communication Codec (LC3) for lower power wireless audio streaming applications.

December 20, 2023 by Joao Martins

WiSA Technologies Confirms Philips and Hisense TVs Transmitting WiSA E Multichannel Wireless Audio at CES 2024

Following the confirmation that Hisense would be introducing WiSA E wireless audio software on their TVs, WiSA Technologies announced an implementation of WiSA E direct from a Philips HDTV to external speakers. Transmitting high-quality multichannel audio direct from a TV enables a low-cost and flexible path for consumers to enhance the quality of their audio system. The 2024 Philips and Hisense TV models demonstrate the ease of implementing onboard high-quality multichannel wireless audio.

Feasycom and Nordic Semiconductor Unveil Dual-Mode Module Supporting Bluetooth Classic and LE Audio

December 14, 2023 by Joao Martins

Feasycom and Nordic Semiconductor Unveil Dual-Mode Module Supporting Bluetooth Classic and LE Audio

Nordic Semiconductor says it is shipping more than 1 million Bluetooth LE System-On-Chips (SoCs) every day, claiming market leadership in the emerging category. Expanding on the range of complete solutions for building LE Audio products, Nordic's nRF5340 dual-core SoC was designed to meet all requirements of LE Audio development. Using this SoC, Shenzhen Feasycom launched its FSC-BT631D advanced wireless audio module for dual-mode Bluetooth Classic audio and LE Audio product designs.

December 8, 2023 by audioXpress Staff

WiSA Technologies Reports Progress in Industry Support for WiSA E

WiSA Technologies, the multichannel wireless audio technology pioneer, announced the integration of WiSA E software technology onto the Amlogic S905X4 application processor. This advanced embedded SoC design is ideal for the OTT/IP streaming Set-Top Box market, and its availability follows the announcement that WiSA just confirmed the first WiSA E software licensing with a major global TV brand.

Airoha Works with Intel to Facilitate the Development of New Bluetooth LE Audio Devices

December 6, 2023 by Joao Martins

Airoha Works with Intel to Facilitate the Development of New Bluetooth LE Audio Devices

Airoha Technology, a subsidiary of Mediatek and one of the world's top designers of Bluetooth audio ICs, announced a collaboration with Intel and Engineered for Intel Evo laptop accessory program, which is the first of its kind to fully embrace Bluetooth LE Audio support. Airoha will supply its SoCs and Software Development Kit (SDK) to support development of new Bluetooth LE Audio devices.

Nordic Semiconductor Offers Wireless Audio Solution for Battery-Powered High Quality Designs

November 20, 2023 by audioXpress Staff

Nordic Semiconductor Offers Wireless Audio Solution for Battery-Powered High Quality Designs

Nordic Semiconductor has revealed that Yinzida Technology, a consumer electronics manufacturer, has designed a 2.4GHz wireless audio transmission module that enables high fidelity wireless audio in applications such as microphones, musical instruments or audio headsets. This out-of-the-box, lossless and stable wireless audio solution is ideal for battery-powered designs with zero-delay DSP pipeline, using Nordic's nRF52832 SoC in both transmitter and receiver.

Synaptics Introduces Wi-Fi 6E and Bluetooth 5.3 Wireless SoC Ideal for Auracast

November 9, 2023 by Joao Martins

Synaptics Introduces Wi-Fi 6E and Bluetooth 5.3 Wireless SoC Ideal for Auracast

Synaptics announced the expansion of its wireless connectivity family with the introduction of the SYN43711. This Wi-Fi 6E and Bluetooth 5.3 tri-band combo system on chip (SoC) is ready to support Bluetooth 5.3 with LE Audio for multiple concurrent Bluetooth connections and audio streams, including Auracast. Delivering best-in-class rate-over-range and interoperability in a cost-effective form factor, the SYN43711 targets high-performance applications with audio and video streaming.

Synaptics Introduces World's First AI SoC Optimized for Unified Communication and Collaboration Products

October 31, 2023 by audioXpress Staff

Synaptics Introduces World's First AI SoC Optimized for Unified Communication and Collaboration Products

Synaptics announced the availability of the DVF120, a power-efficient and cost-optimized system on chip (SoC) that is optimized for advanced Unified Communication and Collaboration (UC&C) products, and leverages the company's experience to integrate all major features required for such applications. The SoC extends its range of compute engines with a field-proven Linux and Android SDK, enterprise-grade security, and native support of popular collaboration platforms.

GlobalScale Launches Energy Harvesting Bluetooth LE 5.3 Module with SoC from Atmosic Technologies

October 12, 2023 by Cristina Costa

GlobalScale Launches Energy Harvesting Bluetooth LE 5.3 Module with SoC from Atmosic Technologies

GlobalScale has once again partnered with Atmosic Technologies, an innovator in extreme-low-power wireless communication platforms, to create a new Bluetooth 5.3 module with integrated energy harvesting capabilities. The new module leverages Atmosic's energy harvesting technology, enabling developers to create battery-free applications, including sensors, electronic shelf labels, and connected devices. GlobalScale has chosen the ATM3330e, which is part of Atmosic's ATM33/e series of SoCs, as the core silicon used in the newest member of the RistrettoBin family of Bluetooth LE modules.

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