All items tagged with SoC (137)
ON Semiconductor to Demonstrate Advanced Audio Processing at CES 2020
December 18, 2019 by Cristina Costa

ON Semiconductor to Demonstrate Advanced Audio Processing at CES 2020

ON Semiconductor will showcase a wide range of innovative technologies for smart home, connected buildings and personal connected devices at CES 2020. Powering portable voice-controlled applications will be the latest LC823455 ultra-low-power audio processor, supporting high-resolution audio processing. This highly integrated SoC, featuring an Arm Cortex−M3 Dual Core CPU and proprietary 32−bit DSP Core (LPDSP32) wit support for high−resolution 32−bit/192kHz audio.
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Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility
October 21, 2019 by audioXpress Staff

Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility

Sonion, the manufacturer of components and solutions for hearing aids and in-ear headphones, announced that it is now a member of the Qualcomm Extension Program and will offer the Sonion Voice Pick Up Bone Sensor on the Qualcomm Ultra-Low Power QCC5100 Bluetooth SoC series in Q1 2020. The combination will allow other audio manufacturers to implement reliable voice quality and voice recognition applications that are not hindered by surrounding noise.
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Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support
October 8, 2019 by Joao Martins

Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support

Microchip introduced the new BM83 SoC, a Bluetooth 5.0 certified dual-mode audio module that contains an on-board Bluetooth stack and audio profiles and supports 24-bit/96kHz high-resolution audio formats to enable high-fidelity wireless audio, including support for Sony’s high fidelity LDAC codec. The combined solution is intended for both new speaker and headphone designs, offering differentiated features.
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Bowers & Wilkins Introduces 2019 Line of Wireless Headphones with Cutting-Edge Specifications
September 20, 2019 by audioXpress Staff

Bowers & Wilkins Introduces 2019 Line of Wireless Headphones with Cutting-Edge Specifications

With consumers increasingly aware of active noise cancellation (ANC) technology, more robust Bluetooth wireless connectivity, and fast charging via USB-C, manufacturers are feeling the need to upgrade their existing models. And Bowers & Wilkins decided to do it all at once with two new in-ear, one over-ear, and one on-ear model, adopting the latest available platform and technologies from Qualcomm, including the latest aptX Adaptive Bluetooth transmission.
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Sogou Portable Smart Recorder C1 Leverages Nordic’s nRF52810 Bluetooth 5 SoC
August 7, 2019 by audioXpress Staff

Sogou Portable Smart Recorder C1 Leverages Nordic’s nRF52810 Bluetooth 5 SoC

Sogou, a Beijing, China-based technology company, has selected Nordic Semiconductor’s nRF52810 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the wireless connectivity for its Smart Recorder C1. Unveiled in Marc 2019 and now available, this Bluetooth LE portable voice recorder employs Nordic’s nRF52810 SoC to wirelessly transfer voice recordings to a smartphone app for transcription. According to Sogou, the device is able to achieve up to 95 percent speech-to-text accuracy in Chinese language.
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u-blox Acquires Rigado’s Bluetooth Modules Business
August 2, 2019 by audioXpress Staff

u-blox Acquires Rigado’s Bluetooth Modules Business

Swiss company u‑blox, a global provider of positioning and wireless communication technologies, announced it acquired Rigado’s Bluetooth modules business in an Asset Purchase Agreement. Rigado is an Oregon-based provider of Edge‑as‑a-Service gateway solutions for Commercial IoT applications, and began offering certified wireless modules in 2015, implementing Nordic Semiconductor’s nRF52840 Bluetooth Low Energy (Bluetooth LE) SoC.
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Audinate Announces Dante Reference Design for Popular NXP i.MX 8M Mini ARM-based Applications Processor
July 23, 2019 by audioXpress Staff

Audinate Announces Dante Reference Design for Popular NXP i.MX 8M Mini ARM-based Applications Processor

Audinate and NXP Semiconductors have collaborated to introduce a new reference design kit for the popular NXP i.MX 8M Mini QuadLite SoC – providing Dante audio-over-IP to OEMs as on-chip software. Following the announced shift from purpose-built hardware to software-based solutions running on standardized hardware, and a similar agreement to supply software running on Linux for x86 and ARM processors, Audinate now extends the support to NXP’s i.MX 8M processors.
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StreamUnlimited Announces StreamSDK availability on MediaTek MT8516 SOC
April 19, 2019 by audioXpress Staff

StreamUnlimited Announces StreamSDK availability on MediaTek MT8516 SOC

StreamSDK, acknowledged in the audio industry for its feature-rich wireless audio streaming software stack, is now available on the MT8516 chipset from MediaTek. StreamUnlimited developed StreamSDK to be flexible enough to run on multiple hardware configurations, allowing manufacturers to remain with their chosen SoC supplier or to select the best hardware module for the product feature set, price point and target market. StreamUnlimited also confirmed AirPlay 2 is now available in StreamSDK, and hardware platforms across major SOC suppliers.
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Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform
March 19, 2019 by audioXpress Staff

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

Qualcomm made two important announcements for audio developers, both bound to significantly impact the fast-growing market of smart speakers and new generation whole-home audio systems. The San Diego company announced the new QCS400 family of audio SoCs and the Smart Audio Platform 400 development kit, bringing smart speakers high-performance processing, Qualcomm AI Engine, superior connectivity, and multiple advanced audio and visual display capabilities in a single, power-optimized chip architecture.
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Cadence Announces Industry’s First Verification IP for USB4
March 15, 2019 by audioXpress Staff

Cadence Announces Industry’s First Verification IP for USB4

Cadence Design Systems announced the availability of the industry’s first Verification IP (VIP) in support of the recently announced USB4 standard. The Cadence VIP for USB4 enables engineers to develop standard-compliant system-on-chip (SoC) designs, completing functional verification of the design with less effort and greater assurance that the SoC will operate as expected, enabling early adoption of the next-generation USB standard protocol.
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