All items tagged with SoC (136)

Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers

February 27, 2019 by audioXpress Staff

Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers

Qualcomm Technologies International, a subsidiary of Qualcomm Incorporated, showcased at MWC 2019 in Barcelona the most recent wireless earbuds and hearables using the latest Qualcomm QCC5100 and QCC302x series, ultra-low power Bluetooth audio SoCs. Now available in more than 10 products, Qualcomm is finding increased traction from audio, mobile and consumer electronics manufacturers for these SoCs, allowing for a robust, low-latency and high-quality wireless audio experiences, in compact, feature-rich wireless earbuds, headsets and speakers.

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

February 26, 2019 by audioXpress Staff

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

DSP Group and Snips, the European pioneer in embedded voice recognition software, announced a technology partnership which combines Snips’ voice software with DSP Group’s Ultra Low Energy (ULE) system-on-chip (SoC) and modules. According to the announcement, this combination of software and hardware running over the ULE network extends the reach of natural voice-controlled edge devices and could become a natural choice for multi-room smart home and smart building applications.

Xperi Corporation to Showcase Latest DTS Audio Technologies at MWC 2019

February 25, 2019 by audioXpress Staff

Xperi Corporation to Showcase Latest DTS Audio Technologies at MWC 2019

Xperi Corporation will showcase its latest mobile imaging, audio and semiconductor solutions from its brands, FotoNation, DTS and Invensas at MWC 2019 (February 25-28), in Barcelona. Xperi will showcase DTS audio solutions specifically targeted at the gaming market, including DTS Headphone:X 2.0 (for Gaming Headphones); DTS:X Ultra (for Windows and Android); DTS:X Game Audio; and DTS:X Premium.

NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution

February 18, 2019 by audioXpress Staff

NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution

Following a showcase at CES 2019, NXP Semiconductors announced its Immersiv3D audio solution, combining NXP software on its i.MX 8M Mini applications processor with support both Dolby Atmos and DTS:X immersive audio technologies. The i.MX 8M Mini SoC also brings smart capabilities like voice control to a broader range of consumer devices including soundbars, smart speakers, and AV receivers with the option for adding additional speakers to distribute smart voice control and immersive audio throughout the home.

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

January 17, 2019 by audioXpress Staff

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

Cadence Design Systems announced that Optek has selected the Cadence Tensilica HiFi 3 DSP for its latest OTK528X Bluetooth 5 dual-mode audio/voice system on chip (SoC). Optek’s customers can now take advantage of the HiFi DSP ecosystem for optimized audio, voice and artificial intelligence (AI) speech-based recognition processing software utilized in applications including hearables, wireless speakers, soundbars, on/in ear headphones, multi-channel AVRs, musical instruments, and voice user interface (VUI) devices.

Optek Licenses and Deploys CEVA Bluetooth IP for Next-Generation Bluetooth 5 Wireless Audio Applications

January 2, 2019 by audioXpress Staff

Optek Licenses and Deploys CEVA Bluetooth IP for Next-Generation Bluetooth 5 Wireless Audio Applications

CEVA, a leading licensor of signal processing platforms and artificial intelligence processors for connected devices, announced that Optek Digital Technology, a fabless semiconductor company of advanced multimedia SoCs, has licensed and deployed CEVA’s RivieraWaves Bluetooth 5 Dual Mode IP in its latest OTK528X multimedia System-on-Chip (SoC), targeting artificial intelligence (AI), voice and music market segments and applications including hearables, wireless speakers, on/in ear headphone, multi-channel AVR, musical instruments and voice user interface (VUI).

ResearchAndMarkets.com Publishes Bluetooth 5: System-on-Chip Comparisons 2018 - Complete Teardown Report

November 6, 2018 by audioXpress Staff

ResearchAndMarkets.com Publishes Bluetooth 5: System-on-Chip Comparisons 2018 - Complete Teardown Report

The "Bluetooth 5: System-on-Chip Comparison 2018 Complete Teardown Report" report has just been added to ResearchAndMarkets.com's offering. The report presents a technological and economical comparison of four of the newest and most competitive systems-on-chips (SoCs) available on the market today from four different manufacturers. They are: the QN9080 from NXP; the QCC5121 from Qualcomm; the DA14585 from Dialog Semiconductor; and the nRF52810 from Nordic Semiconductor.

Atmosic Technologies Introduces Innovative Bluetooth 5 Solution for Very Low-Power Wireless Devices

October 24, 2018 by Cristina Costa

Atmosic Technologies Introduces Innovative Bluetooth 5 Solution for Very Low-Power Wireless Devices

Atmosic Technologies, a startup company from Saratoga, California, announced what the company claims to be the industry’s lowest power wireless Bluetooth 5 platform, allowing manufacturers to deliver extended battery life and battery-free connected devices. Atmosic's inaugural M2 and M3 series SoC's will be able to power all sorts of low-power designs and deliver energy harvesting for connected devices.

STMicroelectronics Combines NFC Controller, Secure Element, and eSIM in a Single-Chip

September 28, 2018 by Joao Martins

STMicroelectronics Combines NFC Controller, Secure Element, and eSIM in a Single-Chip

STMicroelectronics revealed its highly integrated mobile-security solution, the ST54J, a system-on-chip (SoC) containing an NFC (Near-Field Communication) controller, Secure Element, and eSIM. The SoC delivers performance-boosting integration for mobile and IoT devices, with the added benefit of ST's software-partner ecosystem for smoother user experiences in mobile payments and e-ticketing transactions, as well as more convenient, remote, mobile provisioning to support multiple operator subscriptions.

Mavin Introduces Air-X True Wireless Earbuds with 10 Hour Battery Life and 100ft Connection Based on Qualcomm QCC3026 Platform

September 24, 2018 by audioXpress Staff

Mavin Introduces Air-X True Wireless Earbuds with 10 Hour Battery Life and 100ft Connection Based on Qualcomm QCC3026 Platform

Mavin, a Californian brand of wireless and digital audio solutions, announced the Air-X true wireless earbuds, , which claims to be the first to last 10-hours with one standalone charge, and up to 50 hours with its included charging case. The brand, winners of the German iF Design Award, the Red Dot Design Award and the CES Innovation Product Design Award, implemented Qualcomm’s latest chipset for premium wireless headphones. Air-X is available on Indiegogo with Super Early Bird specials starting at $99 (44% off regular price of $179).

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