All items tagged with SoC (136)
Nordic Semiconductor-Powered Bluetooth Low Energy Remote Module Provides High Quality Audio Streaming Solution for OEMs
September 7, 2017 by audioXpress Staff

Nordic Semiconductor-Powered Bluetooth Low Energy Remote Module Provides High Quality Audio Streaming Solution for OEMs

Nordic Semiconductor announced that Shanghai, China-based RFsen has selected Nordic’s Bluetooth 5-compatible low energy nRF52832 System-on-Chip (SoC) for its ‘BT5 Bi-Direction Audio Remote Module’. The module allows OEM manufacturers to provide bi-directional wireless audio streaming between, for example, a smart TV, set-top box, sound box or sound bar, and a user’s Bluetooth 4.0 (and later) Android smartphone or tablet.
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Libre Wireless Technologies Introduces Mic-to-Cloud Voice Module with Integrated Far Field Voice Interface/Control Based on DSP Group’s SmartVoice Technology
September 6, 2017 by audioXpress Staff

Libre Wireless Technologies Introduces Mic-to-Cloud Voice Module with Integrated Far Field Voice Interface/Control Based on DSP Group’s SmartVoice Technology

Libre Wireless Technologies announced the launch of their new LS5BV LibreSync module featuring fully integrated and optimized far field voice interface capabilities as well as extensive music streaming and multiroom audio features. This small and low power mic-to-cloud module uses DSP Group’s SmartVoice technology and HDClear SoC with sophisticated algorithms for detecting and processing far field voice, including advanced noise reduction, echo cancellation, music barge-in and audio processing features.
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Qualcomm Releases Next-Generation DDFA Audio Amplifier Technology
June 21, 2017 by audioXpress Staff

Qualcomm Releases Next-Generation DDFA Audio Amplifier Technology

Qualcomm Technologies International made exciting audio announcements in platforms and technologies for the development of next-generation audio products during its voice and music developer conference, held recently in Shenzhen, China. At the event, the company announced its new Smart Audio Platform for smart and networked speakers. Additionally, Qualcomm introduced its next generation Qualcomm DDFA audio amplifier technology for high-resolution audio devices including wireless speakers, soundbars, networked audio and headphone amplifiers.
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Qualcomm Announces Multiple New Audio Platforms to Support New Use Cases for Next Generation of Wireless Speakers, Headphones and Hearables
June 21, 2017 by audioXpress Staff

Qualcomm Announces Multiple New Audio Platforms to Support New Use Cases for Next Generation of Wireless Speakers, Headphones and Hearables

During its voice and music developer conference held recently in Shenzhen, China, Qualcomm made two exciting audio announcements. The company announced its new Smart Audio Platform to help manufacturers accelerate the development and commercialization of smart and networked speakers. Qualcomm also announced multiple new audio platforms for next-gen wireless speakers, headphones and hearables, each one uniquely tailored to support new market demands, particularly as consumers rapidly adopt wireless audio devices.
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Nordic Semiconductor Shows Development Kit and Other Solutions for Bluetooth 5 Implementation
March 28, 2017 by audioXpress Staff

Nordic Semiconductor Shows Development Kit and Other Solutions for Bluetooth 5 Implementation

Following the announcement at CES 2017 of its Bluetooth 5-compatible nRF52 Series SoCs (nRF52832 and nRF52840 devices), Nordic Semiconductor is showing new development tools for Bluetooth 5 at Bluetooth World, the official event of Bluetooth SIG, taking place at Santa Clara Convention Center, 28-29 March, 2017. Demonstrations include the new Preview Development Kit (nRF52840-PDK) and its first Thread networking SDK.
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Dialog Semiconductor Introduces Bluetooth 5 Low Power SoC with Integrated Microphone Interface
March 27, 2017 by audioXpress Staff

Dialog Semiconductor Introduces Bluetooth 5 Low Power SoC with Integrated Microphone Interface

As the connected devices market enters a new era of connectivity with Bluetooth 5.0, Dialog Semiconductor announced the next generation in its SmartBond family – DA14586. The all-new System-on-Chip (SoC) is the company’s first standalone device that is qualified to support the latest Bluetooth 5.0 specification, delivering the lowest power consumption and unrivalled functionality for advanced use cases.
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New Wireless Gecko Bluetooth 5-Compliant SoCs Help Developers Tackle Multiprotocol Design Challenges
March 16, 2017 by audioXpress Staff

New Wireless Gecko Bluetooth 5-Compliant SoCs Help Developers Tackle Multiprotocol Design Challenges

Silicon Labs announced a major expansion of its Wireless Gecko system-on-chip (SoC) portfolio, making it easier for developers of all skill levels to add versatile multiprotocol switching capabilities to increasingly complex applications. The new EFR32xG12 SoCs support a broader range of multiprotocol, multiband use cases for home automation, connected lighting, wearables and industrial applications.
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DSP Concepts Announces Multicore Support for Audio Weaver DSP Programming Software
December 15, 2016 by audioXpress Staff

DSP Concepts Announces Multicore Support for Audio Weaver DSP Programming Software

DSP Concepts has announced multicore support for its Audio Weaver modular programming software. Audio Weaver can now operate in heterogeneous SoC (System on a Chip) devices that employ multiple cores of different types. The new capability extends Audio Weaver’s user-friendly programming environment into more applications, including complex signal processing chains in automotive environments.
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STMicroelectronics Powers Lower Power Projects with New BlueNRG-1 System-on-Chip
July 5, 2016 by audioXpress Staff

STMicroelectronics Powers Lower Power Projects with New BlueNRG-1 System-on-Chip

STMicroelectronics revealed its first Bluetooth (4.2) Low Energy wireless System-on-Chip (SoC). The BlueNRG-1 is optimized to satisfy high-volume opportunities in the fast-growing Bluetooth Low Energy market, combining energy efficiency, and strong radio performance. Featuring a dedicated digital-microphone input that simplifies voice-enabled applications, the new SoC responds to multiple applications including retail, wearables, connected home, automotive, industrial and medical devices.
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Texas Instruments Introduces New TAS2555 Smart Amp with Integrated Speaker Protection
December 8, 2015 by audioXpress Staff

Texas Instruments Introduces New TAS2555 Smart Amp with Integrated Speaker Protection

Texas Instruments (TI) introduced a low-power smart amplifier that allows designers to develop next-generation smartphones, tablets, portable audio docks or Bluetooth speakers with industry-leading audio quality at peak volumes while maximizing battery efficiency. The TAS2555 audio amplifier with integrated speaker protection uses back electromotive force and low power of 5.7 W to produce bigger sound from small devices.
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