All items tagged with SoC (137)

Merging Technologies Creates Scalable, High Performance AES67 Solution Based on Analog Devices SHARC SoCs

May 9, 2022 by audioXpress Staff

Merging Technologies Creates Scalable, High Performance AES67 Solution Based on Analog Devices SHARC SoCs

Merging Technologies announced the availability of its AES67 embedded solution for the ADSP-SC5xx SHARC series of System on Chips (SoCs) from Analog Devices. Merging Technologies’ experience in the audio over IP (AoIP) field (Ravenna/AES67) and Analog Device's experience in unified communications and pro-audio applications, has led to a collaboration that broadens the range of AoIP solutions for manufacturers of electronics and ultimately integrators.

DSP Concepts and StreamUnlimited Announce Reference Design for Advanced Voice Control Development

April 21, 2022 by Adam Levenson

DSP Concepts and StreamUnlimited Announce Reference Design for Advanced Voice Control Development

DSP Concepts and StreamUnlimited are working together to support audio product development with a new reference design that offers advanced voice control features. DSP Concepts offers its Audio Weaver and TalkTo software development tools for StreamUnlimited's established range of hardware modules, including the latest Stream1955 next generation System-On-Module based on the latest NXP Quad Core SoC. The platform offers support for all major voice assistants.

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

February 3, 2022 by Joao Martins

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

Synaptics announced the SYN4381 Triple Combo system-on-chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The solution simplifies product development while supporting 600 Mbps video and data, low-power Thread communication, and platform-agnostic device setup and interoperability.

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

January 28, 2022 by audioXpress Staff

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

Wireless connectivity specialists Telit announced the launch of their new WE310G4 module, which enables manufacturers to add dual-band Wi-Fi and Bluetooth Low Energy (BLE) 5.0 connectivity quickly and cost-effectively to their products. Based on Realtek's Ameba system on chip (SoC), the WE310G4 is ideal for a wide variety of embedded designs, including smart home devices and appliances, wearables, fitness trackers, smart city sensors, aftermarket telematics and industrial automation sensors.

WiSA Partners with Realtek to Develop and Launch a 5GHz Multichannel Immersive Audio Module

January 20, 2022 by Joao Martins

WiSA Partners with Realtek to Develop and Launch a 5GHz Multichannel Immersive Audio Module

WiSA, the Wireless Speaker and Audio Association, a wholly-owned subsidiary of Summit Wireless Technologies, announced plans to integrate WiSA’s multichannel wireless audio capabilities - and its latest high-performance Spatial Audio Software - into Realtek’s 5GHz IoT chipsets. The partnership will culminate in a cost-effective module capable of delivering uncompressed, high-definition spatial audio streams for an unparalleled immersive audio experience.

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

December 17, 2021 by audioXpress Staff

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

Infineon announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s new AIROC CYW30739 Bluetooth LE and 802.15.4 system on chip (SoC) is offered as a reliable, secure and scalable solution to connect low-power devices in the smart home. To further demonstrate the company’s commitment to Matter, Infineon expanded its role with the Connectivity Standards Alliance (CSA) by joining the Alliance’s Board of Directors as a Promoter Member.

AONDevices Announces Ultra-Low Power AON1100 Always-On Edge AI Processor and Development Kit

December 17, 2021 by audioXpress Staff

AONDevices Announces Ultra-Low Power AON1100 Always-On Edge AI Processor and Development Kit

AONDevices, a Californian startup provider of ultra-low power, high-performance processors for edge AI applications, announced that engineering samples of its new AON1100 processor are now available. The AON1100 enables sensing capabilities in battery-powered always-on devices that need to support local wake words, voice commands, sound recognition, context recognition, and sensor fusion at high accuracy.

Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform

October 18, 2021 by audioXpress Staff

Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform

Synaptics announced its newest AudioSmart AS33970 headset platform SoC, directly targeting the fastest growing product categories, from work-from-anywhere TWS earbuds to hearables. As the San Jose, California-based company details, the new SoC offers the world’s first highly integrated AI-enabled ENC (Environmental Noise Cancellation) and hybrid ANC (Active Noise Cancellation) single-chip solution integrating neural and voice processing engines for optimal audio performance.

CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds

September 30, 2021 by audioXpress Staff

CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds

CEVA, together with Beken Corporation, a key player in wireless communication solutions, and VisiSonics, the 3D spatial audio technologies specialists, announced the availability of a complete 3D audio reference design for the rapid deployment of headsets and True Wireless Stereo (TWS) earbuds supporting spatial audio for use in gaming, multimedia and conferencing. The integration delivers a complete 3D spatial audio hardware and software solution to consumer electronics OEMs and ODMs.

Novatek Announces Turnkey SoC Solution With Support for DTS Play-Fi

September 29, 2021 by audioXpress Staff

Novatek Announces Turnkey SoC Solution With Support for DTS Play-Fi

DTS, now a wholly owned subsidiary of Xperi Holding Corporation, announced that Novatek Microelectronics, a major chip supplier for TVs, will be supporting DTS Play-Fi on its line of SoCs targeting the TV market. This turnkey solution from Novatek will enable manufacturers to build TVs that seamlessly connect to other DTS Play-Fi compatible products, including speakers and amplifiers.

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