Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

April 9 2021, 00:45
Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.
 

Already a visible result of the Cypress acquisition, the new Infineon AIROC CYW5557x Wi-Fi 6/6E combo solutions operate in the 2.4 GHz, 5 GHz, and the new, greenfield 6 GHz spectrum to deliver robust performance and minimal latency. Combined with and support for the latest Bluetooth 5.2 specification, this makes them ideal for high-quality video and audio streaming applications like gaming consoles, AR/VR, smart speakers, media-streaming devices and automotive infotainment. Applications that require an instant response – like security systems and industrial automation – will also benefit from Infineon’s new products.

Digitalization is accelerating in all areas of life. From home entertainment to health tech to in-car entertainment, the number of connected consumer devices used in homes or on-the-go continues to accelerate, increasing the demand for wireless connectivity. With the new AIROC Wi-Fi 6/6E and Bluetooth 5.2 product series, Infineon is responding to consumers’ demand for secured and convenient wireless connectivity and helping to reduce congestion of home networks.

"In view of the accelerated growth of connected consumer devices in smart homes, Wi-Fi 6 has the power to enable robust and reliable data connections and the best user experience," says Thomas Rosteck, president of Infineon’s division Connected Secure Systems. "Infineon empowers device manufacturers to easily develop smart and trusted solutions that make IoT work: from sensors and microcontrollers to power to secured connectivity and software – we now provide all required components from one source."

Wi-Fi 6, the latest generation of Wi-Fi to hit the market, is specifically built to improve reliability and performance, even in high device density environments. Driven by the Covid-19 pandemic, more and more people are increasingly working, studying and entertaining at home. Online gaming devices with virtual reality capabilities, sports devices that stream work-outs live or connected kitchen gadgets are increasingly congesting the home network environment.

Unlike previous generations of Wi-Fi that focused on peak device speeds, Wi-Fi 6 includes advancements to relieve network congestion, and to improve network efficiency, device battery life, latency and range in addition to peak speeds. Building on the success of previous generations of Wi-Fi and the advancements brought by Wi-Fi 6/6E, the Wi-Fi Alliance predicts that Wi-Fi will add five trillion US-dollars to the global economy by 2025.

According to Infineon, the new AIROC Wi-Fi 6/6E-certified solutions go above and beyond the standard requirements to elevate user experience with advanced wireless technology and architectural innovations that result in double the wireless coverage range compared to Wi-Fi 5 and Wi-Fi 4, 40 percent more coverage than typical Wi-Fi 6/6E solutions, and improved connection robustness with enhanced interference mitigation. The new devices also ensure lower latency and better Wi-Fi/BT coexistence that improves multimedia streaming and gaming responsiveness in overlapping network environments.

Another focus of improvement for manufacturers adopting the new AIROC combo devices is in over 20 percent power savings, enabling longer battery life. And improved security is another factor, with multi-layer security protections with secured boot, firmware authentication and encryption, and lifecycle management, enabling a higher level of security for all connected applications.

"AIROC Wi-Fi 6/6E combo solutions address the challenges of congested 2.4 GHz and 5 GHz channels, and bring extraordinary audio and video quality for media applications and robust, long-range connections for IoT applications," says Vikram Gupta, Senior Vice President of Infineon’s IoT Compute and Wireless Business Unit.

Infineon's AIROC Wi-Fi 6/6E solutions are also equipped with the latest Bluetooth 5.2 technology, enabling high-quality audio with LC3, and enabling new BLE audio use cases such as audio sharing and audio broadcast. The unique low-power Wake-on-Bluetooth LE mode allows the host CPU to conserve power while the Bluetooth core autonomously "listens" for incoming connection requests. Advanced wireless technology innovations have been added to improve BT/BLE range, robustness, latency and power savings above and beyond standard BT5.2. Infineon’s unique Smart Coex maximizes Wi-Fi throughput when used concurrently with Bluetooth, and optimizes for demanding multi-media use cases.
 

Infineon’s module partners are already building Wi-Fi 6/6E integrated solutions that allow for rapid development, reduced test costs, and product certification. "Collaborating with Infineon allows us to leverage our combined expertise to develop innovative Wi-Fi solutions which further build upon our market-leading position," says Akira Sasaki, General Manager of Murata. "Our most recent collaboration is a Wi-Fi 6/6E CYW5557x module that delivers advanced technology integration, superb network quality, and enables fast time-to-market. Further, it can be delivered through Murata’s extensive sales and distribution channel."

"LG Innotek is excited to partner with Infineon on the new Wi-Fi 6E communication module which carries the CYW89570 chip," says Insoo Ryu, Vice President Automotive Components & Electronics Business Division, LG Innotek. "This module extends LGIT’s automotive/industrial product family into the next generation and brings the latest Wi-Fi 6E and Bluetooth 5.2 standards to automotive platforms."

For automotive applications, u-blox builds AECQ100 qualified and industrial modules with Infineon’s Wi-Fi 6E combo solution. "At u-blox, we are excited to work with Infineon on the new CYW89570," adds Hakan Svegerud, Senior Director Product Strategy, u-blox. "Based on these solutions, we will extend our successful JODY module family with global automotive and industrial grade modules, providing cutting edge technologies including Wi-Fi 6, Wi-Fi 6E and Bluetooth 5.2 to our customers."

"nFore’s NF3327PQ Combo module has Infineon’s CYW89570 chipset inside. Infineon’s CYW89570 chipset is the perfect chipset for enabling Wi-Fi 6 and Bluetooth 5.2 technologies for automotive customers," confirms Yu Zongyuan, CEO of nFore Technology.

The AIROC Wi-Fi 6/6E and Bluetooth 5.2 combo devices are currently sampling.
www.cypress.com/products/cyw5557x
www.infineon.com
 
Infineon’s AIROC CYW5557x devices support Wi-Fi 6/6E features and are Tri-band capable (2.4G, 5G, 6G), available in both 2x2 or 1x1 configurations. The devices have enhancements to improve range, power efficiency, network robustness , and security. All are highly integrated with an on-chip power management unit, power amplifiers and low noise amplifiers to reduce total BOM cost and board space.
 
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