All items tagged with wireless earbuds and product development (102)

USound Introduces Ultra-Compact MEMS Audio Module for Hearables

August 4, 2022 by Joao Martins

USound Introduces Ultra-Compact MEMS Audio Module for Hearables

USound, the Austrian pioneer of MEMS speakers, announced the release of an audio module designed to enhance the performance of true wireless earbuds and hearing aids, enabling new degrees of design freedom. As USound underscores, with this new integrated solution, manufacturers can create more ergonomic and comfortable designs, with extended battery life and audio quality, while the form factor of hearing aids and TWS earbuds can be considerably reduced.

The Acoustical Challenges of Designing True Wireless Earphones

June 28, 2022 by Andrew Bellavia

The Acoustical Challenges of Designing True Wireless Earphones

Expanding the perspective on the evolution toward hearables, this article explores the current trends as well as the acoustical challenges and solutions for designing true wireless earphones. The article explains the enabling technologies currently converging as the TWS market continues to grow and use cases multiply, with more consumers using wireless earbuds for a diverse and varied set of applications, from listening to podcasts and audiobooks to Internet meetings and interacting with voice assistants. This article was originally published in audioXpress, April 2022.

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

June 27, 2022 by Joao Martins

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

Nordic Semiconductor has used the latest trade shows globally to showcase its latest low power wireless solutions, and introduced a series of new development solutions targeting Bluetooth LE Audio. At the Embedded World Exhibition that took place in Nuremberg, Germany, Nordic offered demonstrations of its new nRF5340 Audio Development Kit (DK), a design platform for rapid development of LE Audio products, and the Nordic Thingy:53 a rapid prototyping solution, both based on Nordic’s nRF5340 SoC.

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

June 10, 2022 by Cristina Costa

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

CEVA announced an expansion to its family of sensor fusion products with the introduction of the FSP201, a high-performance and low-power sensor hub MCU that delivers precise, accurate sensor fusion for motion tracking, heading and orientation detection. The FSP201 is ideal for consumer robotics and other emerging smart devices employing sensor fusion technologies, including XR glasses, 3D audio headsets and the wide range of 6-axis motion use cases across IoT and the metaverse.

CEVA Bluetooth 5.3 Platform IP Supports New Auracast Broadcast Audio

June 8, 2022 by audioXpress Staff

CEVA Bluetooth 5.3 Platform IP Supports New Auracast Broadcast Audio

CEVA announced that its latest RivieraWaves Bluetooth 5.3 IP family now supports Auracast broadcast audio, the new audio sharing standard, based on the Bluetooth LE Audio broadcasting specification, unveiled by the Bluetooth Special Interest Group (SIG). According to CEVA, Auracast broadcast audio is set to transform the shared audio experience, enabling an unlimited number of Auracast receiver-compliant devices such as TWS earbuds, headphones, hearing aids and wireless speakers to simultaneously receive audio broadcast from one or several Auracast transmitter devices.

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

May 20, 2022 by Cristina Costa

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

The next generation of wireless audio projects is now getting on the bench, as developers get access to the first Bluetooth LE Audio evaluation platforms. Nordic Semiconductor has long been a reference in Bluetooth development platforms and has now released its nRF5340 Bluetooth LE Audio DK board, which includes everything required for developers to take advantage of the latest Bluetooth standard, including LC3 codec, low power consumption, and wireless stereo enhancements.

Vesper Launches 2nd Generation Smart Piezoelectric Voice Accelerometer with ZeroPower Sensing

March 28, 2022 by Joao Martins

Vesper Launches 2nd Generation Smart Piezoelectric Voice Accelerometer with ZeroPower Sensing

Vesper continues to redefine its range of MEMS solutions for voice applications with the launch of the VA1210, Vesper’s 2nd generation analog piezoelectric smart voice accelerometer. The VA1210 offers higher sensitivity (+17 dB) and higher (+6 dB) SNR than the 1st generation VA1200 in voice pickup. Additionally, new intelligent features of Wake-on-Voice (WoV) and hardware voice activity detection (HVAD), introduced into the VA1210, enable a drastic improvement of voice quality True Wireless Stereo (TWS) earbuds.

Designed for Growth: Enabling Product Differentiation for TWS Development

March 23, 2022 by Raj Senguttuvan

Designed for Growth: Enabling Product Differentiation for TWS Development

Knowles announced the availability of a new development kit for true wireless stereo (TWS) earbuds, centered on the capabilities of its AISonic family of audio edge-AI processors and expanded by key partnerships in voice and audio processing algorithms for TWS products. This article details the opportunities for TWS development and helping manufacturers to differentiate their newest designs. This article was originally published in audioXpress, January 2022.

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

March 4, 2022 by Joao Martins

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

DSP Concepts announced the availability of a new toolkit for True Wireless Stereo (TWS) earbuds powered by its Audio Weaver development platform. The toolkit features a reference design optimized to run on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary and manufacturer of low-power TWS Systems on Chip (SoCs). The development kit also includes a reference design with a fully operational earbud prototype designed by Knowles.

Qualcomm Redefines True Wireless with Two New Snapdragon Sound Platforms

February 28, 2022 by Joao Martins

Qualcomm Redefines True Wireless with Two New Snapdragon Sound Platforms

At Mobile World Congress 2022 in Barcelona, Qualcomm announced new options for brands and developers to offer the latest technologies in wireless audio. Qualcomm announced the latest S5 and S3 Sound Platforms with support for new Snapdragon Sound experiences, featuring lossless CD-quality streaming over Bluetooth, stereo recording, ultra-low latency sound with in-game chat, and adaptive active noise cancellation. Both new platforms already offer support for Bluetooth LE Audio.

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