All items tagged with wireless earbuds and product development (102)

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

March 7, 2023 by audioXpress Staff

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.

HEAD acoustics Introduces ViBRIDGE Holistic In-Ear Headset Testing Solution

February 14, 2023 by Joao Martins

HEAD acoustics Introduces ViBRIDGE Holistic In-Ear Headset Testing Solution

As many audioXpress readers already learned from reading the article by Hans W. Gierlich on the Benefits of Using Structure-Borne Sound in Headset Signal Processing, HEAD acoustics created a complete test solution for in-ear and headset devices using bone-conduction sensors. There are good reasons for developers and manufacturers to explore the use of bone-conduction sensors and test them with the new ViBRIDGE solution.

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

January 23, 2023 by audioXpress Staff

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

Fluent.ai announced an embedded voice recognition solution for True Wireless Stereo (TWS) and other hearable products running on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary. The solution is part of an integration available on DSP Concepts’ Audio Weaver platform, which provides OEMs a rapid way to design and prototype audio features and capabilities.

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

January 13, 2023 by Joao Martins

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

Knowles introduced its latest series of SiSonic MEMS microphones at CES 2023. The new Titan (Digital), Falcon (Differential Analog), and Robin (Single Ended Analog) are a new trio of microphones providing advanced performance capabilities for space constrained ear and wearable applications like True Wireless Stereo (TWS) earbuds, smart watches, Augmented Reality (AR) glasses and Virtual Reality (VR) headsets.

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

January 9, 2023 by Joao Martins

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

Part of xMEMS Labs announcements at CES 2023, the innovative MEMS speaker company introduced Skyline, the world’s first discrete solid-state MEMS DynamicVent, a specific design with a valve that opens or closes by sensor fusion input from the earbud DSP and enables the benefits of both an open-fit (spatially aware) and closed-fit (occluded) earbud design. This enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences in the same product.

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

November 17, 2022 by Joao Martins

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.

Why Buy Four Chips if You Only Need One?

November 1, 2022 by Special Content

Why Buy Four Chips if You Only Need One?

Azoteq recently expanded its offering to the TWS market with the release of the IQS323. The IQS323 offers capacitive and inductive sensing as user interface and in-ear-detection, whilst the IQS7222A IC is a multifunctional capacitive, inductive, and Hall-effect sensor with additional temperature sensing for reference tracking. The IQS7222A is offered in a 1.62 x 1.62mm WLCSP and allows you to add a touch-and-swipe interface, wear detection, docking detection and your choice of an inductive waterproof button or the inductive force-sensing features.

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

September 19, 2022 by Joao Martins

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

Taiwan-based Airoha Technology announced that its new series of Bluetooth audio chips have successfully completed the latest Bluetooth Low Energy Audio Qualification Process and will be "widely available" to manufacturers in the first half of 2023. Airoha is one of the most important suppliers of chips for true wireless earbuds and the LE Audio certification is also an important R&D achievement for its Bluetooth audio R&D team consisted of hundreds of engineers.

A Computer in Every Ear. The Rise of Headphone 3.0

September 1, 2022 by Joao Martins

A Computer in Every Ear. The Rise of Headphone 3.0

Enter Sonical Headphone 3.0. A fully integrated approach for the product development of headphones and earbuds that allows consumers to load their own apps. audioXpress talked to Gary Spittle, the CEO and founder of Sonical, a young company that developed a chip and a real-time operating system for headphones and hearables. "Hearables should not be defined by the functions of a chip or the Bluetooth profiles, there is a lot more that product makers want to do," says Gary Spittle, the CEO and founder of Sonical.

Unmute the World With Auracast Broadcast Audio

August 18, 2022 by Franz Dugand

Unmute the World With Auracast Broadcast Audio

Following the publication of the full set of LE Audio specifications by the Bluetooth Special Interest Group (SIG), the industry is now putting together the building blocks that will enabling bringing products supporting the next generation of Bluetooth audio to market. This article explains what is needed and how to support Auracast broadcast audio, a new Bluetooth capability that enables an audio transmitter to broadcast to an unlimited number of nearby Bluetooth audio receivers.

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