The FSP201 combines CEVA’s proprietary MotionEngine sensor processing software - that has powered more than 250 million devices to date - into a low-power 32-bit Arm Cortex M23 MCU and offers a high performance, high quality and low-cost solution optimized for consumer applications. It delivers superior orientation and heading accuracy, providing a high quality, low cost, sensor-agnostic solution for robotics, 3D audio, metaverse hardware and general 6-axis motion applications.
The FSP201 provides manufacturers the flexibility to choose from a pre-qualified list of external 6-axis IMU sensors (accelerometer plus gyroscope) - from different sensor suppliers - to ensure supply chain flexibility, and provide the performance and features required for motion tracking, heading and orientation detection, including Correction Smoothing that corrects orientation drift slowly and transparently to the user for head and body tracking to maintain an immersive XR or 3D audio experience.
Auto-Centering dynamically recenters the soundstage in 3D audio applications based on a user’s gaze to maintain immersion in dynamic conditions and eliminate drift, while Tilt Independent Heading allows for proper heading output even when a driving surface is uneven, enabling rapid adjustment to obstacles or changes in flooring types. Inclination Detection provides full 3DOF robot orientation allowing detection of surface and device issues that could cause the robot to become stuck or damaged. Dynamic Calibration uses proprietary algorithms to monitor changes in sensor performance and temperature during live operation to deliver the highest performance.
Several low-cost MEMS sensors from leading suppliers are pre-qualified and have drivers pre-integrated to accelerate development and ensure supply chain flexibility.
The FSP201 fits simply into any design and uses I2C and UART industry interfaces for chip connectivity. It can be placed directly on the target product’s main circuit board or designed into a separate module, providing manufacturers with ultimate flexibility. The turnkey sensor hub MCU benefits developers and integrators through faster time-to-market, reductions in development time, reduced BOM cost, with the highest precision.
Crucially, the FSP201 is code-compatible with the BNO08X series of 9-axis sensor System-in-Package (SIP) products, facilitating developers to easily migrate to a 6-axis FSP201 based solution or take advantage of CEVA’s sensor fusion technologies in new product lines that do not require 9-axis sensor fusion.
Due to supply chain constraints and component shortages, many MCU and IMU sensor devices continue to experience long wait times. CEVA has secured supply of the FSP201 MCU and IMU sensors to enable fast time-to-market, which makes FSP201 an ideal solution for near- and long-term production requirements. The FSP201 is available for immediate sampling along with documentation and evaluation tools via our designated distributors.
www.ceva-dsp.com
