All items tagged with smart speakers (248)
CEVA Delivers Bluetooth 5 Dual Mode IP to ASR Micro
March 8, 2018 by audioXpress Staff

CEVA Delivers Bluetooth 5 Dual Mode IP to ASR Micro

CEVA, a licensor of signal processing platforms and artificial intelligence processors for connected devices, reinforced its leadership in the Bluetooth IP market with delivery of its RivieraWaves Bluetooth 5 dual mode IP to multiple licensees, including ASR Microelectronics, a fabless semiconductor company. ASR Micro adopted RivieraWaves Bluetooth 5 Dual Mode IP for smartphones, smart speakers, headsets and IoT Devices.
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Vesper and Unisem Announce Assembly Partnership to Deliver Piezoelectric MEMS Microphones at Scale
March 7, 2018 by audioXpress Staff

Vesper and Unisem Announce Assembly Partnership to Deliver Piezoelectric MEMS Microphones at Scale

Vesper announced a partnership with Unisem, a global provider of semiconductor assembly and test services, to manufacture and produce high volumes of Vesper piezoelectric MEMS microphones at scale. The partnership will allow Vesper to seamlessly produce and deliver millions of units. Unisem currently assembles all products from Vesper’s product line, including the new VM1010 for low power applications.
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MWC 2018 First Impressions: A Connected World Congress
March 3, 2018 by Joao Martins

MWC 2018 First Impressions: A Connected World Congress

A strange week we had, with most of the technology world focused on another edition of GSMA's Mobile World Congress (MWC), with the usual gush of new iPhone-clone announcements and most of the key semiconductor giants dividing their announcements with embedded world 2018, taking place at the same time in Nuremberg, Germany. Still, neither was much affected by the clash. MWC is more and more consumer electronics, autonomous cars, cloud solutions, and software developers pitching their latest ideas on social-engineered apps.
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Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems
March 1, 2018 by Joao Martins

Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems

Following earlier demonstrations at CES 2018, Qualcomm introduced a series of new platforms, SoC and development kits targeting new advanced audio applications and smart speakers, including the support of key wireless technologies, voice and cloud ecosystems. Solutions include its Smart Audio Platform optimized for smart speakers, a 6-microphone far field voice platform qualified for Amazon AVS, Dolby Audio implementations for wireless speakers and much more.
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Speakers and Voice Development - A Conversation with NXP
February 22, 2018 by Joao Martins

Speakers and Voice Development - A Conversation with NXP

After reviewing my notes from CES 2018 and the announcements from NXP, I decided it was fitting to share some parts of my interview with Martyn Humphries, vice president and general manager Media IoT and i.MX Applications Processors at NXP (and former Freescale executive). Basically, we discussed the environment that lead NXP to create its i.MX 8M single-chip media application processors, currently the most advanced integrated platform available for audio manufacturers.
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Infineon Acquires Denmark-based Merus Audio
February 20, 2018 by audioXpress Staff

Infineon Acquires Denmark-based Merus Audio

Infineon Technologies announced the acquisition of Merus Audio. The Copenhagen-based start-up, founded in 2010 by Hans Hasselby-Andersen and Mikkel Hoyerby, has developed a new generation of energy-efficient integrated Class D amplifier solutions. Merus Audio amplifiers maximize audio performance and battery playback time for smart home and battery-powered speakers while minimizing heat and design space. Following the company's presentation at CES 2018, Merus generated significant interest in the audio and CE industry in general.
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Harman Implements DSP Group’s SmartVoice Technology for their Sonique Total Voice Solution
February 20, 2018 by Joao Martins

Harman Implements DSP Group’s SmartVoice Technology for their Sonique Total Voice Solution

Voice UI chipset specialist DSP Group, and Harman International, a wholly-owned subsidiary of Samsung Electronics, announced their cooperation implementing voice input technology, based on DSP Group’s SmartVoice Audio/voice SoC and HDClear far-field multi-mic algorithms. The cooperation will enable expanding Harman's Sonique Total Voice Solution platform into a new generation of voice-enabled products.
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It's Test and Measurement Time! audioXpress March 2018 Now Available!
February 12, 2018 by audioXpress Staff

It's Test and Measurement Time! audioXpress March 2018 Now Available!

The March 2018 edition of audioXpress explores the latest advancements on Test and Measurement solutions and technologies. In this issue, we review G.R.A.S. Sound & Vibration's new RA040X ear simulators, and the IK Multimedia ARC 2.5 room correction system, with its included MEMS-based measurement microphone. We also discuss Measurement Microphones and Measurements for Smart Speakers, and conduct an interview Steve Temme, President of Listen, Inc. Gary Galo and Chuck Hansen pay tribute to the life and accomplishments of Victor Campos (1933-2017), and there is much more in this edition you don't want to miss!
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Xiaomi Teams Up with Dirac Research on its Xiaomi Mi AI Smart Speaker
February 7, 2018 by audioXpress Staff

Xiaomi Teams Up with Dirac Research on its Xiaomi Mi AI Smart Speaker

Marking Dirac’s debut in the smart speaker market segment, the Swedish company has teamed up with Chinese consumer electronics giant Xiaomi to provide the Mi AI smart speaker with an improved listening experience – complete with louder audio, a wider soundstage, clearer and improved vocal separation, and richer acoustical details. This upgrade - which Xiaomi describes as “extraordinary” - has been delivered through a software update made available worldwide on January 26th, 2018.
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The GSMA Mobile World Congress 2018 Returns to Discuss the Future of Personal Technologies and Wearables
February 3, 2018 by Joao Martins

The GSMA Mobile World Congress 2018 Returns to Discuss the Future of Personal Technologies and Wearables

The Mobile World Congress returns in 2018, held 26 February – 1 March at Fira Gran Via in Barcelona, Spain. The event brings more than 100,000 attendees from over 200 countries and 2,300 exhibitors together in one place, creating a dynamic environment of collaboration, innovation and education that will advance the mobile industry. Front and center in this year's edition will be once again the future of personal mobile technologies, wearables, and many innovations that will affect the audio industry.
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