All items tagged with product development (920)
TDK Announces T3902 Lowest-Power PDM MEMS Microphone
June 29, 2020 by audioXpress Staff

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

TDK Corporation introduced the InvenSense T3902, which the company touts as the world’s lowest power Pulse Density Modulation (PDM) microphone for consumer devices. The new T3902 offers a high SNR of 64.5 dB, and high Acoustic Overload Point (AOP) of 120 dB in a very small package, optimized for mobile devices, wearables, headsets, TV remotes and more, supporting far-field communications, enabling clear audio capture in loud conditions, and ideal for voice recognition.
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Resonado Announces Flat Core Speaker Licensing Partnership with Zylux
June 26, 2020 by audioXpress Staff

Resonado Announces Flat Core Speaker Licensing Partnership with Zylux

Audio technology startup Resonado just revealed its first major technology licensing partnership with original equipment and design manufacturing audio company, Zylux. Resonado's innovative and proprietary Flat Core Speaker (FCS) technology will be manufactured and initially incorporated into a range of Zylux designs within the soundbar category, with the expectation to expand into other Zylux produced audio products in the near future. This marks Resonado’s first integration of FCS technology into a wide range of consumer-facing audio-specific products.
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Sound Semiconductor Expands IC Range with New Single and Dual VCA Chips
June 24, 2020 by audioXpress Staff

Sound Semiconductor Expands IC Range with New Single and Dual VCA Chips

Sound Semiconductor announced single and dual channel VCA additions to its product lineup, the ProCircuit SSI2161 and FatKeys SSI2162.The ICs are part of a family of affordable high-performance VCAs from the company, now offering a single, dual and quad versions. The SSI2164 offers four VCAs in a compact SOP package with lowest cost-per VCA, while the new SSI2162 is a versatile building block for high-performance audio applications, and the single-channel SSI2161 provides lowest noise.
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Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products
June 19, 2020 by audioXpress Staff

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

Nordic Semiconductor announced the nRF52805 Bluetooth 5.2 System-on-Chip (SoC), the seventh addition to its popular and proven nRF52 Series. The new nRF52805 SoC offers Bluetooth LE high-throughput 2 Mbps and enhanced Channel Selection Algorithm #2 for improved coexistence, and 2.4 GHz proprietary protocols for cost-constrained applications. This SoC is an ideal Bluetooth LE solution for high-volume, compact wireless applications.
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Mvoid Technologies Expands Methodology for Acoustical Virtual Product Development
June 18, 2020 by audioXpress Staff

Mvoid Technologies Expands Methodology for Acoustical Virtual Product Development

Mvoid Technologies GmbH, the German company specializing in virtual audio product development, has released the latest Mvoid Methodology version 2.3. Mvoid Acoustical Virtual Product Development methods use a combination of physical and acoustical modeling, simulation and measurement software, combined with virtual reality and 3D visualization and binaural auralization tools for Automotive, and Professional Audio applications.
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Audio Engineering Society Introduces Audio Product Education Institute and First Interactive Voice Con Online Event
June 16, 2020 by audioXpress Staff

Audio Engineering Society Introduces Audio Product Education Institute and First Interactive Voice Con Online Event

The Audio Product Education Institute (APEI) is an initiative of the Audio Engineering Society (AES) that is committed to furthering the knowledge and skills of professionals involved in the development of audio products. The new entity will present Interactive Voice Con, an online program designed to address real-world experiences in Voice Integrated Product Development. The first presentation will take place July 9, 2020 and registration is now open.
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Voice Commands on The Edge: How Syntiant Is Solving the Power Problem
June 11, 2020 by David Lindberg

Voice Commands on The Edge: How Syntiant Is Solving the Power Problem

Alexa! OK Google! Hey Siri! Did we get your attention? If we were to have read that aloud most of us would have our favorite robot voice asking us what we want. Whether it is Amazon Alexa, Google Home, or another assistant, voice commands are the logical next step in user interfaces (UI). The uptake in the market has been extremely good for these devices. However, deployment has exposed some major issues with this technology. In this article I'm going to discuss the Syntiant NDP 10x processor and how it solves the aforementioned challenges.
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DSP Concepts TalkTo Audio Front End Qualified by Amazon for Alexa Built-In Devices
June 11, 2020 by audioXpress Staff

DSP Concepts TalkTo Audio Front End Qualified by Amazon for Alexa Built-In Devices

DSP Concepts announced that TalkTo, its suite of proprietary microphone processing algorithms that use adaptive learning technology to deliver a quiet-room experience in noisy and unpredictable environments, has been qualified by Amazon for Alexa built-in devices using Alexa Voice Service (AVS). This enables more hardware brands to easily build Alexa built-in devices that will perform well even in noisy situations, thanks to TalkTo’s leading sound cancellation technology.
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Synopsys Introduces First Complete DesignWare USB4 IP Solution With Support for All Features in the USB4 Specification
June 5, 2020 by audioXpress Staff

Synopsys Introduces First Complete DesignWare USB4 IP Solution With Support for All Features in the USB4 Specification

Start the USB4 roll out! Synopsys, introduced the industry's first complete DesignWare USB4 IP solution consisting of controllers, routers, PHYs, and verification IP. The DesignWare USB4 IP operates at up to 40 Gbps, which is twice the maximum data rate of USB 3.2 and is backwards compatible with USB 3.x and USB 2.0 systems. The DesignWare USB4 IP supports multiple high-speed interface protocols, including USB4, DisplayPort 1.4a TX, PCI Express, and Thunderbolt 3 for efficient data transfer and simultaneous delivery of data, power, and high-resolution video through a single USB Type-C cable.
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Murata Develops Compact Multilayer Ceramic Capacitor
June 5, 2020 by audioXpress Staff

Murata Develops Compact Multilayer Ceramic Capacitor

Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M multi-layer ceramic capacitor, which the company claims is the world’s first to feature a maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020. Applications can be valuable in wearables devices and compact audio players, among many other products that require large numbers of more compact capacitors.
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