All items tagged with product development (919)

Bragi and CEVA Collaborate to Drive New Class of Hearable and Personal Audio Devices

March 17, 2020 by Joao Martins

Bragi and CEVA Collaborate to Drive New Class of Hearable and Personal Audio Devices

CEVA, the leading licensor of wireless connectivity and smart sensing technologies, and Bragi GmbH, the hearables pioneer from Munich, Germany, announced a strategic collaboration to drive a new class of hearable devices where the user experience is customizable via the industry’s first hearable app store and the new Bragi 4 operating system. Target devices include headsets, hearing aids, True Wireless Stereo (TWS) earbuds and a host of other smart audio devices for the consumer and the smart home.

AKM Proposes Two-Chip D/A Solution for High-End Audio Product Development

March 11, 2020 by audioXpress Staff

AKM Proposes Two-Chip D/A Solution for High-End Audio Product Development

Asahi Kasei Microdevices Corporation (AKM) has expanded its lineup of premium audio Digital-to-Analog converters (DACs) with the development of a two-chip solution that separates the digital aspect from the analog. While conventional DACs use a single chip to convert signals from digital to analog, the new AKM approach splits the conversion process between the AK4191 delta-sigma modulator and the AK4498 DAC. This results in an improvement in sound quality that is easily perceptible while listening to music, the company states.

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

March 11, 2020 by audioXpress Staff

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

CEVA announced that Ambiq Micro has licensed CEVA’s RivieraWaves Bluetooth low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity. CEVA’s Bluetooth low energy (BLE) IP is already powering Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC), used in applications requiring intelligence everywhere, from wearables to animal trackers to smart home devices.

Waves Expands Collaboration With Qualcomm to Enhance Audio on Next Generation Mobile Devices

March 9, 2020 by audioXpress Staff

Waves Expands Collaboration With Qualcomm to Enhance Audio on Next Generation Mobile Devices

Waves MaxxAudio and Nx 3D audio processing technologies are now compatible with the new Qualcomm Snapdragon 865, 765 and 765G mobile processors targeting the latest smartphones and powering augmented experiences, gaming, and more. These Waves technologies have been until now mainly available on Intel and ARM processor-based platforms. This new combination will allow manufacturers implementing Snapdragon processors in premium smartphones and smart peripherals to also support expanded audio experiences.

FTDI Launches Dual & Quad Channel USB-to-UART/MPSSE Bridge ICs with Built-in Type-C/PD Controllers

March 5, 2020 by Cristina Costa

FTDI Launches Dual & Quad Channel USB-to-UART/MPSSE Bridge ICs with Built-in Type-C/PD Controllers

At the forefront of embedded connectivity innovations, FTDI Chip’s latest series of multi-channel USB interface ICs have the capacity to deal with next generation power requirements, as larger items of hardware start to make use of the protocol. Available in both 2-channel (FT2233HP) and 4-channel (FT4233HP) versions, the new Hi-Speed (480Mbits/s) devices have serial UART (RS232, RS422 or RS485) and MPSSE (JTAG, I2C, SPI or Bit-Bang) interfacing capabilities.

ESS Expands its USB DAC Portfolio with New ES9260 Low-Power Solution

March 4, 2020 by audioXpress Staff

ESS Expands its USB DAC Portfolio with New ES9260 Low-Power Solution

ESS Technology announced the ES9260, a new USB DAC solution with integrated PLL and regulator, optimized for low-power consumption. Intended for use in USB-C headsets and audio adaptors that demand high-quality sound and long play times, the new SoC offers lower power consumption than existing solutions while still delivering the highest-quality sound in its class.

ReDrivers from Diodes Incorporated Boost Signal Quality of High-Speed USB 3.2, 10Gbps Interfaces

March 3, 2020 by Cristina Costa

ReDrivers from Diodes Incorporated Boost Signal Quality of High-Speed USB 3.2, 10Gbps Interfaces

Diodes introduced a series of USB ReDrivers for application in industrial, embedded, and consumer electronics products. The PI3EQX1004E and PI3EQX1002E are USB 3.2 compliant, 5Gbps to 10Gbps, 2-Port/1-Port, linear ReDrivers. The devices are backwards compatible with USB 3.1 Gen 1, 5Gbps and offer ultra-small and thin package types to reduce PCB size and total BOM cost. They have adjustable linear equalization, output swing, and flat gain to optimize performance over a variety of physical media by reducing intersymbol interference.

Fraunhofer IIS Licenses Comprehensive MPEG Audio Codec Suite to NXP Semiconductors

March 2, 2020 by Joao Martins

Fraunhofer IIS Licenses Comprehensive MPEG Audio Codec Suite to NXP Semiconductors

Fraunhofer Institute for Integrated Circuits IIS, the inventor of mp3 and primary developer of the xHE-AAC and MPEG-H Audio standards, announced that NXP Semiconductors has licensed Fraunhofer’s MPEG audio SDK. The complete software package covers four generations of audio codecs, from legacy MPEG Layer-1/2/3 to the next-generation MPEG-H 3D Audio standard and the AAC codec family, including xHE-AAC. NXP will incorporate these codecs in home entertainment product development, from set-top boxes and soundbars to smart speakers.

ON Semiconductor Announces Innovative New USB-C Power Delivery 3.0 Controllers

February 28, 2020 by Cristina Costa

ON Semiconductor Announces Innovative New USB-C Power Delivery 3.0 Controllers

ON Semiconductor announced a pair of novel devices that are fully compliant with the USB-C Power Delivery (PD) 3.0 standard. New USB-C PD 3.0 Devices provide an advanced solution for power adapter and battery charger applications. The FAN6390 adaptive charging controller brings ease of integration of the USB-C PD 3.0 programmable power supply (PPS) standard into systems, while the NCP12601 is a highly integrated multi-mode flyback controller for rugged, high-performance, offline power supplies such as adapters.

Cadence Announces Industry’s First Verification IP for PHY Covering Multiple Protocols

February 28, 2020 by audioXpress Staff

Cadence Announces Industry’s First Verification IP for PHY Covering Multiple Protocols

Cadence Design Systems announced the availability of the industry’s first Verification IP (VIP) that enables comprehensive and fast verification of the physical layer (PHY) for complex protocols such as PCIe 5.0, USB3/4, DDR5, LPDDR5, HBM and MIPI CSI-2 and DSI 2.0. This allows companies to thoroughly test and optimize their PHY designs, accelerating development.

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