All items tagged with product development (878)

LoudSoft Updates FINECone 2020 Simulation Software

April 17, 2020 by audioXpress Staff

LoudSoft Updates FINECone 2020 Simulation Software

The new release of LoudSoft's FINECone 2020 software is a welcome and important update for the loudspeaker industry. LoudSoft seems to have listened to its customers and added a new Geometry Modeler, which makes simulating cone frequency response much easier for engineers using FINECone. FINECone is an acoustic Finite Element dome/cone simulation application to assist on the design of new drivers, calculating frequency responses and detecting problems in existing designs.

Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications

April 16, 2020 by audioXpress Staff

Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications

According to data from the GSMA, the world will see 3.2 billion cellular Internet-of-Things (IoT) connections in 2024. That is, billions of connected devices of all types in homes, companies, and cities. Qualcomm Technologies is already a leading supplier of wireless connectivity chipsets and they now announced a breakthrough new product to drive the growth of cellular IoT: the Qualcomm 212 LTE IoT Modem, introduced as the world’s most power-efficient single-mode NB2 (NB-IoT) chipset.

Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables

April 7, 2020 by audioXpress Staff

Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables

Designers of compact consumer devices like hearables can now slash solution size by half and extend battery life by 20 percent with the MAX77654 single inductor, multiple output (SIMO) power management IC (PMIC) from Maxim Integrated Products. The breakthrough new SIMO technology replaces traditional power management architectures for the most demanding designs in wearables and personal audio devices, reducing BOM count by up to 40 percent, with 23 percent lower BOM cost compared to discrete solutions.

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

April 7, 2020 by audioXpress Staff

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

CEVA announced a new high performance sensor hub DSP architecture designed to handle the broad range of sensor processing and sensor fusion workloads for contextually-aware devices. The new SensPro device family serves as a hub for processing and fusing of data from multiple sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units. This highly-configurable and self-contained architecture brings together scalar and parallel processing for floating point and integer data types, as well as deep learning training and inferencing.

USB Type-C Linear Mux/DeMux ReDriver with Integrated USB-C Detector from Diodes Restores Signal Integrity and Reduces Latency

April 3, 2020 by audioXpress Staff

USB Type-C Linear Mux/DeMux ReDriver with Integrated USB-C Detector from Diodes Restores Signal Integrity and Reduces Latency

Diodes announced the PI3EQX10612/PI3EQX10312 2-port 10Gbps linear ReDriver devices with integrated USB-C detection for equipment implementing a USB Type-C interface. Offering 1:2/2:1 mux/demux functionality, the ReDrivers can be used to extend the reach of USB signals running across rigid or flexible PCBs in gaming consoles, laptops, desktop computers, tablets, and other consumer applications.

Challenges to Building Voice-Enabled Products

April 2, 2020 by Chin Beckmann

Challenges to Building Voice-Enabled Products

Voice-enabled devices are quickly becoming commonplace in nearly every region and for every consumer demographic. Whether making cloud-connected or offline products, OEMs need to understand what’s driving this demand for voice. Unlike some new product features, adding a voice interface requires product architects to make a number of highly-impactful, interconnected design decisions. Development teams don’t have it easy either, as integrating microphones in a product introduces another layer of complexity.

Micro Loudspeaker Innovator Arioso Systems GmbH Ready To Enter the Market

April 2, 2020 by audioXpress Staff

Micro Loudspeaker Innovator Arioso Systems GmbH Ready To Enter the Market

The Fraunhofer IPMS spin-off company Arioso Systems GmbH has successfully completed its first round of financing. The company is launching an innovative sound transducer principle for miniaturized headphones, in-ears and hearables to the market. The company's new micro loudspeaker technology made from 100% silicon, is based on the patented Nanoscopic Electrostatic Drive (NED) principle developed by Fraunhofer IPMS. The technology can considerably extend the functional scope for true wireless earbuds and revolutionize the industry, Arioso believes.

Qualcomm Offers New Ultra-Low Power Bluetooth Audio SoCs for Truly Wireless ANC Development

March 26, 2020 by audioXpress Staff

Qualcomm Offers New Ultra-Low Power Bluetooth Audio SoCs for Truly Wireless ANC Development

With its previous generation of QCC SoCs for Bluetooth true wireless earbuds development, Qualcomm enabled virtually every single mobile and CE brand to finally create products able to compete with Apple's massively successful AirPods, still the market leader by a wide margin. Then Apple introduced its AirPods Pro with ANC and its market share expanded even more. Now Qualcomm launched a new generation of SoCs combining hybrid ANC and other technologies to enable brands to design new competitive TWS products.

Efficient Power Conversion Releases New GaN IC Family for High Performance Class-D Designs

March 18, 2020 by audioXpress Staff

Efficient Power Conversion Releases New GaN IC Family for High Performance Class-D Designs

Efficient Power Conversion (EPC) introduced the first of a new integrated circuit (IC) product family offering higher performance and smaller solution size for high power density applications including DC-DC conversion, motor drive, and Class-D audio amplifiers. EPC announced an 80 V, 12.5 A power stage integrated circuit designed for 48 V DC-DC conversion. The EPC2152 is a single-chip driver plus eGaN FET half-bridge power stage using EPC’s proprietary GaN IC technology.

Bragi and CEVA Collaborate to Drive New Class of Hearable and Personal Audio Devices

March 17, 2020 by Joao Martins

Bragi and CEVA Collaborate to Drive New Class of Hearable and Personal Audio Devices

CEVA, the leading licensor of wireless connectivity and smart sensing technologies, and Bragi GmbH, the hearables pioneer from Munich, Germany, announced a strategic collaboration to drive a new class of hearable devices where the user experience is customizable via the industry’s first hearable app store and the new Bragi 4 operating system. Target devices include headsets, hearing aids, True Wireless Stereo (TWS) earbuds and a host of other smart audio devices for the consumer and the smart home.

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