All items tagged with product development (919)

XMOS Announces All-New Software Development Kit for Artificial Intelligence Development

October 7, 2020 by audioXpress Staff

XMOS Announces All-New Software Development Kit for Artificial Intelligence Development

XMOS announced its all-new software development kit (SDK) for the artificial intelligence of things (AIoT). Designed to harness xcore.ai, the company's latest crossover processor, combining high performance AI, DSP, I/O and control in a single economical device, the new AIoT SDK makes it easier for engineers to develop connected products that can sense, think, decide and act. The XMOS SDK incorporates TensorFlowLite for Microcontroller development tools.

Microchip Unveils First Low-Power Digital-to-Analog Converter to Simplify Handheld Designs by Including Nonvolatile Memory

October 7, 2020 by audioXpress Staff

Microchip Unveils First Low-Power Digital-to-Analog Converter to Simplify Handheld Designs by Including Nonvolatile Memory

Implementing multi-channel system control or signal outputs using Digital-to-Analog Converters (DACs) in today’s portable and handheld consumer, communications, and medical systems has been difficult to do without significant processor overhead for device configuration during power-up. Microchip Technology announced a solution to this problem with its MCP47/48FxBx8 family of octal 12-bit DACs, the first of their kind to include nonvolatile memory and an integrated Voltage Reference (Vref) source so they can be pre-configured for safe and efficient power-up without relying on the system processor.

R&D Stories: How Virtual Product Development Improves the Quality of Consumer and Pro Audio Products

October 1, 2020 by Alfred Svobodnik

R&D Stories: How Virtual Product Development Improves the Quality of Consumer and Pro Audio Products

This article addresses how modern methods of acoustical virtual product development make it possible to assess and optimize quality and performance problems throughout the entire product development process. Using a combination of modeling, simulation, and measurement tools, everything can be analyzed in-depth before building the physical product, the two authors explain. This article was originally published in audioXpress, September 2020.

Audio Product Education Institute Hosts Product Development Symposium During AES Show Fall 2020

September 24, 2020 by Audio Engineering_Society

Audio Product Education Institute Hosts Product Development Symposium During AES Show Fall 2020

The newly formed Audio Product Education Institute (APEI), an initiative of the Audio Engineering Society (AES), will host a three-day Product Development Symposium as part of the online events of AES Show Fall 2020. The sessions are scheduled for October 14, 15 and 16. All Access registration for AES Show Fall 2020 is required to attend the Product Development Symposium, available now at AESShow.com.

CEVA and VisiSonics Offer 3D Spatial Audio Development for True Wireless Earbuds and Headphones

September 24, 2020 by audioXpress Staff

CEVA and VisiSonics Offer 3D Spatial Audio Development for True Wireless Earbuds and Headphones

CEVA and VisiSonics, a developer of patented 3D spatial audio technologies, announced that the companies have collaborated closely together to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones and other hearables. The collaboration combines VisiSonics' RealSpace 3D audio software optimized for CEVA’s low power audio and sensor hub DSPs together with CEVA’s MotionEngine head tracking algorithms running on its BNO080 9-axis System in Package (SiP).

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

September 22, 2020 by audioXpress Staff

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

In the wake of the acquisition of the Hillcrest Laboratories (Hillcrest Labs) business from InterDigital in mid-2019, CEVA now introduced the Hillcrest Labs MotionEngine Hear, a sensor and processor agnostic embedded software solution for hearable devices. The new solution allows SoC vendors, OEMs and ODMs to take advantage of a configurable sensor fusion platform to add intuitive user interface, gesture control, activity tracking and spatial audio capabilities to hearable devices.

AKM Launches Low Power Solution for True Wireless Stereo (TWS) Development with ANC and Promotes Complete Solution Portfolio

September 18, 2020 by Joao Martins

AKM Launches Low Power Solution for True Wireless Stereo (TWS) Development with ANC and Promotes Complete Solution Portfolio

Demand for True Wireless Stereo (TWS) products reflect the growing demand for multi-function, health care, and connected wearable solutions, all requiring smaller and longer battery life devices. Asahi Kasei Microdevices (AKM) has recently introduced the AKM AK4336ECB ultra low power audio codec, a 4-channel ADC and one channel DAC that supports active noise cancelling designs, complementing its complete portfolio of audio systems and sensors for TWS development.

Microchip Launches Industry’s First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture

September 18, 2020 by audioXpress Staff

Microchip Launches Industry’s First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture

The rising adoption of the free and open RISC-V Instruction Set Architecture (ISA) is driving the need for an affordable, standardized development platform that embeds RISC-V technology and leverages the diverse RISC-V ecosystem. To meet this need, Microchip Technology is offering the industry’s first RISC-V based System-on-Chip (SoC) Field-Programmable Gate Array (FPGA) development kit for its own low-power, low-cost, PolarFire SoC FPGA.

CEVA Partners With Fluent.ai to Offer Multilingual Speech Support on Edge Devices

September 16, 2020 by audioXpress Staff

CEVA Partners With Fluent.ai to Offer Multilingual Speech Support on Edge Devices

CEVA and Fluent.ai, a leading provider of on-device, multilingual speech understanding solutions, announced a partnership to offer ultra-low power speech-to-intent solutions for intelligent edge devices. Fluent.ai’s suite of speech-to-intent technologies has been ported and optimized for CEVA’s low power audio and sensor hub DSPs, providing a high performance, robust solution for OEMs and ODMs looking to integrate intelligent voice activation and control into their wearables, consumer devices and IoT products.

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

September 14, 2020 by audioXpress Staff

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

Ambiq unveiled its latest Apollo4 SoC family, enabling next generation endpoint devices with record-setting energy efficiency - running as low as 3µA/MHz - and new levels of performance. The new Apollo4 systems enable manufacturers to create leading-edge endpoint devices leveraging the unique SPOT platform with Ambiq’s easy-to-use, rich peripheral set. The Apollo4 is available now with CSP and BGA package offerings, as well as an Apollo4 Blue SoC with Bluetooth LE.

«
1
2
...
41
42
43
44
45
46
47
...
91
92
»