All items tagged with product development (505)
NXP Introduces i.MX 8M Processor to Transform IoT Audio, Voice and Video Interactions
January 13, 2017 by audioXpress Staff

NXP Introduces i.MX 8M Processor to Transform IoT Audio, Voice and Video Interactions

At CES 2017, NXP Semiconductors (now part of Qualcomm) introduced its new i.MX 8M family of applications processors specifically designed to meet increasing audio and video system requirements for smart home and smart mobility applications such as over-the-top (OTT) set-top boxes, digital media adapters, surround sound, sound bars, A/V receivers, voice control, voice assistance, digital signage and general purpose human machine interface (HMI) solutions.
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Knowles Launches New RAF Series Balanced Armature Drivers, Delivering Premium Sound in a New Design
January 4, 2017 by audioXpress Staff

Knowles Launches New RAF Series Balanced Armature Drivers, Delivering Premium Sound in a New Design

Knowles Corporation launched the new RAF Series balanced armature drivers to improve how hearable and earphone designers create the next generation of premium headsets. Developed for wireless products, the receiver’s small dimensions and high efficiency make it ideal for a number of applications. The new RAF Series, including IPx7 models, enables greater flexibility to improve critical features such as audio quality, connectivity, battery life, and water resistance without sacrificing size or comfort.
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Conexant Showcases Next-Gen Voice as an Interface and USB-C Headset Solutions at CES 2017
January 4, 2017 by audioXpress Staff

Conexant Showcases Next-Gen Voice as an Interface and USB-C Headset Solutions at CES 2017

In line with market trends, at CES 2017 Conexant is showing new hardware and software solutions designed to enable new voice-enabled AI assistant devices and next-gen USB-C type headphones. Conexant is showcasing its latest embedded hardware and software solutions designed to make it easy for CE manufacturers to develop new high-performance voice-enabled products and USB-C digital headphones.
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Ambiq Micro’s Latest Apollo 2 Platform Offers Lowest Power-Consumption Performance for Consumer Electronics Devices
December 29, 2016 by audioXpress Staff

Ambiq Micro’s Latest Apollo 2 Platform Offers Lowest Power-Consumption Performance for Consumer Electronics Devices

Ambiq Micro released the Apollo 2 Wearables and IoT Platform, offering breakthrough power consumption of under 10 μA/MHz, which allows for double the battery life in wearable devices. Apollo 2’s performance provides longer battery life, enhanced intelligence and improved functionality in wearables and IoT consumer electronics products through its patented Subthreshold Power Optimized Technology (SPOT) technology.
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Nordic Semiconductor to Demonstrate Bluetooth 5 Enhancements at CES 2017
December 27, 2016 by Cristina Costa

Nordic Semiconductor to Demonstrate Bluetooth 5 Enhancements at CES 2017

Nordic Semiconductor in collaboration with its design partners are unveiling latest Bluetooth low energy and IEEE 802.15.4-enabled innovations at International CES 2017 in Las Vegas. The Norwegian company will demonstrate the capabilities of its Bluetooth 5-compatible nRF52 Series SoCs. Product demonstrations include contactless payment, wearables wireless charging, thread networking, voice-activated remote control, educational platforms, home automation and Bluetooth 5 enhancements.
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Bluetooth 5 and Audio Applications
December 22, 2016 by Joao Martins

Bluetooth 5 and Audio Applications

Following the announcement made earlier, on December 7, 2016, the Bluetooth Special Interest Group (SIG) officially adopted Bluetooth 5 as the latest version of the Bluetooth core specification. Key updates to Bluetooth 5 include longer range, faster speed, and larger broadcast message capacity, as well as improved interoperability and coexistence with other wireless technologies.
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New NFC Forum Specifications Enable Near Field Communication Devices to Communicate with Broader Range of Devices and Tags
December 20, 2016 by audioXpress Staff

New NFC Forum Specifications Enable Near Field Communication Devices to Communicate with Broader Range of Devices and Tags

The NFC Forum announced the availability of three adopted and one candidate technical specifications, following approval by the Board of Directors. Significant enhancements to these specifications include the addition of Active Communication Mode (ACM) for Peer-to-Peer Mode (P2P) communication, support of NFC-V Technology compatible to ISO/IEC 15693 and the introduction of the NFC-V based Type 5 Tag allowing NFC devices to communicate with a broader range of devices and tags.
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ams Expands its Active Noise Cancellation (ANC) Technology Portfolio with Incus Laboratories Acquisition
December 20, 2016 by audioXpress Staff

ams Expands its Active Noise Cancellation (ANC) Technology Portfolio with Incus Laboratories Acquisition

ams is closing out the year with another acquisition to boost its leadership in audio sensors and active noise cancellation (ANC). The company will acquire Incus Laboratories Ltd, a UK-based privately-held provider of intellectual property (IP) for digital active noise cancellation in headphones and earphones. Incus’ design tool suite and acoustic characterization technology, allows ams to offer easier OEM implementations.
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Arrow Electronics and Conexant Systems Collaboration on Development of Amazon Alexa-Enabled Smart Home Products
December 15, 2016 by audioXpress Staff

Arrow Electronics and Conexant Systems Collaboration on Development of Amazon Alexa-Enabled Smart Home Products

Arrow Electronics has entered into a preferred global agreement regarding Conexant Systems’ audio and voice technology solutions. Arrow is not only distributing, but also sourcing components and providing technical design support for Conexant’s AudioSmart 2-Mic Development Kit for Amazon Alexa Voice Service (AVS).
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DSP Concepts Announces Multicore Support for Audio Weaver DSP Programming Software
December 15, 2016 by audioXpress Staff

DSP Concepts Announces Multicore Support for Audio Weaver DSP Programming Software

DSP Concepts has announced multicore support for its Audio Weaver modular programming software. Audio Weaver can now operate in heterogeneous SoC (System on a Chip) devices that employ multiple cores of different types. The new capability extends Audio Weaver’s user-friendly programming environment into more applications, including complex signal processing chains in automotive environments.
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