All items tagged with embedded development (128)

Libre Wireless Technologies Single Chip MAVID Solution is Now Amazon AWS IoT Core Certified

April 28, 2020 by audioXpress Staff

Libre Wireless Technologies Single Chip MAVID Solution is Now Amazon AWS IoT Core Certified

Libre Wireless Technologies, the embedded wireless audio and voice/AI development platform company, announced that its MAVID low power mic-to-cloud edge computing solution expanded its unique RTOS platform to include new SDK releases. The company's flexible SDK for connected devices now features Amazon AWS IoT Core certification and leverages the responsive Free RTOS OS, combined in a scalable feature rich platform. The new development environment offers unique connectivity and libraries for manufacturers and ODMs developing on Libre Wireless's MAVID platform.

XMOS and Plumerai Partner To Bring Binarized Neural Networks to the Edge

April 2, 2020 by audioXpress Staff

XMOS and Plumerai Partner To Bring Binarized Neural Networks to the Edge

British technology companies XMOS and Plumerai have agreed a new strategic partnership that will support the development of binarized neural network (BNN) capabilities that enable AI to be embedded in a wide range of everyday devices efficiently at low power and at low cost. XMOS and Plumerai will bring together their deep learning expertise across chip design and algorithms in a binarized neural network capability, advancing the deployment of intelligence at the edge.

Bragi and CEVA Collaborate to Drive New Class of Hearable and Personal Audio Devices

March 17, 2020 by Joao Martins

Bragi and CEVA Collaborate to Drive New Class of Hearable and Personal Audio Devices

CEVA, the leading licensor of wireless connectivity and smart sensing technologies, and Bragi GmbH, the hearables pioneer from Munich, Germany, announced a strategic collaboration to drive a new class of hearable devices where the user experience is customizable via the industry’s first hearable app store and the new Bragi 4 operating system. Target devices include headsets, hearing aids, True Wireless Stereo (TWS) earbuds and a host of other smart audio devices for the consumer and the smart home.

Syntiant and Sensory Demonstrate First Ultra-Low-Power Multi-Language Voice Solution At The Edge

January 9, 2020 by audioXpress Staff

Syntiant and Sensory Demonstrate First Ultra-Low-Power Multi-Language Voice Solution At The Edge

At CES 2020, Syntiant announced a partnership with Sensory, combining the expertise and technologies in AI and speech recognition at the Edge, to deliver a deep learning, multi-lingual voice interface for battery-powered devices. The combined solution merges Sensory’s larger, higher-performance TrulyHandsfree wake word engine and voice control with Syntiant’s microwatt-power Neural Decision Processors (NDPs), bringing low-latency, real-time inference to edge devices.

Sonos Announces Acquisition of Snips to Expand Voice Efforts

November 20, 2019 by Joao Martins

Sonos Announces Acquisition of Snips to Expand Voice Efforts

Sonos announced the acquisition of Snips, a French company that provides embedded voice assistants and interfaces for connected devices that run locally and offline. The acquisition adds a talented group of employees and strategic IP to Sonos. Following the company's presentation at CES 2019, Snips received a Best of Innovation Awards in the Embedded Technology category. Snips will enable Sonos to design speech-enabled devices that can operate offline and to market them faster without sacrificing its own brand identity.

Avnet Unveils MaaXBoard for Low-Cost Embedded Computing and Edge AI Development

November 14, 2019 by Cristina Costa

Avnet Unveils MaaXBoard for Low-Cost Embedded Computing and Edge AI Development

Avnet is now offering a single board computer which allows developers to focus more on the software side of their projects. The new MaaXBoard is a low-cost, production-ready qualified platform, based on the NXP i.MX 8M applications processor, ideal for embedded computing and applications that leverage AI at the edge. It supports design engineers and end-users seeking to create automation, multimedia, AI and smart home applications with reduced cost and time-to-market.

CTA Confirms First CES 2020 Innovation Awards Announcements

November 11, 2019 by Joao Martins

CTA Confirms First CES 2020 Innovation Awards Announcements

The Consumer Technology Association (CTA) officially kicked off CES season with traditional CES Unveiled events in New York, Paris and Amsterdam. Attendees to these invitation-only celebrations heard exclusive CES announcements and experienced emerging tech trends that will dominate the CES 2020 show floor Jan. 7-10 in Las Vegas, Nevada. More importantly, these events kicked off the annual CES 2020 Innovation Awards announcements, which will be expanded and confirmed until the Las Vegas show opens in January.

Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support

October 8, 2019 by Joao Martins

Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support

Microchip introduced the new BM83 SoC, a Bluetooth 5.0 certified dual-mode audio module that contains an on-board Bluetooth stack and audio profiles and supports 24-bit/96kHz high-resolution audio formats to enable high-fidelity wireless audio, including support for Sony’s high fidelity LDAC codec. The combined solution is intended for both new speaker and headphone designs, offering differentiated features.

Chirp and Linkplay Partner To Create Audio-Based Connectivity Solutions for Consumer Products

October 3, 2019 by audioXpress Staff

Chirp and Linkplay Partner To Create Audio-Based Connectivity Solutions for Consumer Products

Combining the capabilities of embedded data-over-sound with Wi-Fi audio technology, Chirp and Linkplay Technology have delivered a software-defined connectivity solution which removes any device set up, pairing or configuration requirements. Leveraging Chirp’s ultrasonic audio protocol, smart-enabled devices integrated with Linkplay’s Wi-Fi Audio modules enables seamless, secure network provisioning for consumer applications in close proximity, without the need for additional hardware.

DSP Concepts and CEVA Partner to Streamline Audio/Voice DSP Software Development for High-End Sound Applications

July 19, 2019 by audioXpress Staff

DSP Concepts and CEVA Partner to Streamline Audio/Voice DSP Software Development for High-End Sound Applications

CEVA and DSP Concepts announced that DSP Concepts’ industry-leading Audio Weaver tools and TalkTo voice front-end now support the CEVA-X2 and CEVA-BX family of DSPs. Audio Weaver is already being used by a number of companies who are leveraging the design tool to develop advanced audio and voice applications for their CEVA DSP based designs.

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