All items tagged with embedded development (115)

Syntiant and Sensory Demonstrate First Ultra-Low-Power Multi-Language Voice Solution At The Edge

January 9, 2020 by audioXpress Staff

Syntiant and Sensory Demonstrate First Ultra-Low-Power Multi-Language Voice Solution At The Edge

At CES 2020, Syntiant announced a partnership with Sensory, combining the expertise and technologies in AI and speech recognition at the Edge, to deliver a deep learning, multi-lingual voice interface for battery-powered devices. The combined solution merges Sensory’s larger, higher-performance TrulyHandsfree wake word engine and voice control with Syntiant’s microwatt-power Neural Decision Processors (NDPs), bringing low-latency, real-time inference to edge devices.

Sonos Announces Acquisition of Snips to Expand Voice Efforts

November 20, 2019 by Joao Martins

Sonos Announces Acquisition of Snips to Expand Voice Efforts

Sonos announced the acquisition of Snips, a French company that provides embedded voice assistants and interfaces for connected devices that run locally and offline. The acquisition adds a talented group of employees and strategic IP to Sonos. Following the company's presentation at CES 2019, Snips received a Best of Innovation Awards in the Embedded Technology category. Snips will enable Sonos to design speech-enabled devices that can operate offline and to market them faster without sacrificing its own brand identity.

Avnet Unveils MaaXBoard for Low-Cost Embedded Computing and Edge AI Development

November 14, 2019 by Cristina Costa

Avnet Unveils MaaXBoard for Low-Cost Embedded Computing and Edge AI Development

Avnet is now offering a single board computer which allows developers to focus more on the software side of their projects. The new MaaXBoard is a low-cost, production-ready qualified platform, based on the NXP i.MX 8M applications processor, ideal for embedded computing and applications that leverage AI at the edge. It supports design engineers and end-users seeking to create automation, multimedia, AI and smart home applications with reduced cost and time-to-market.

CTA Confirms First CES 2020 Innovation Awards Announcements

November 11, 2019 by Joao Martins

CTA Confirms First CES 2020 Innovation Awards Announcements

The Consumer Technology Association (CTA) officially kicked off CES season with traditional CES Unveiled events in New York, Paris and Amsterdam. Attendees to these invitation-only celebrations heard exclusive CES announcements and experienced emerging tech trends that will dominate the CES 2020 show floor Jan. 7-10 in Las Vegas, Nevada. More importantly, these events kicked off the annual CES 2020 Innovation Awards announcements, which will be expanded and confirmed until the Las Vegas show opens in January.

Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support

October 8, 2019 by Joao Martins

Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support

Microchip introduced the new BM83 SoC, a Bluetooth 5.0 certified dual-mode audio module that contains an on-board Bluetooth stack and audio profiles and supports 24-bit/96kHz high-resolution audio formats to enable high-fidelity wireless audio, including support for Sony’s high fidelity LDAC codec. The combined solution is intended for both new speaker and headphone designs, offering differentiated features.

Chirp and Linkplay Partner To Create Audio-Based Connectivity Solutions for Consumer Products

October 3, 2019 by audioXpress Staff

Chirp and Linkplay Partner To Create Audio-Based Connectivity Solutions for Consumer Products

Combining the capabilities of embedded data-over-sound with Wi-Fi audio technology, Chirp and Linkplay Technology have delivered a software-defined connectivity solution which removes any device set up, pairing or configuration requirements. Leveraging Chirp’s ultrasonic audio protocol, smart-enabled devices integrated with Linkplay’s Wi-Fi Audio modules enables seamless, secure network provisioning for consumer applications in close proximity, without the need for additional hardware.

DSP Concepts and CEVA Partner to Streamline Audio/Voice DSP Software Development for High-End Sound Applications

July 19, 2019 by audioXpress Staff

DSP Concepts and CEVA Partner to Streamline Audio/Voice DSP Software Development for High-End Sound Applications

CEVA and DSP Concepts announced that DSP Concepts’ industry-leading Audio Weaver tools and TalkTo voice front-end now support the CEVA-X2 and CEVA-BX family of DSPs. Audio Weaver is already being used by a number of companies who are leveraging the design tool to develop advanced audio and voice applications for their CEVA DSP based designs.

Denso Ten and Cinemo Cooperate to Address Next Generation Automotive Infotainment Systems

June 7, 2019 by audioXpress Staff

Denso Ten and Cinemo Cooperate to Address Next Generation Automotive Infotainment Systems

Created at the end of 2008 and headquartered in Germany, Cinemo GmbH is a leading developer of automotive infotainment embedded solutions with a focus on performance, high-quality, support and service. The company announced that Denso Ten, an internationally recognized manufacturer of car navigation, infotainment, and communication systems will continue their collaboration with Cinemo on projects that set a benchmark in smart integration to enhance the quality of car head units and provide impressive multimedia and connected freedom to Denso Ten infotainment systems.

Audinate Unveils New Dante-As-Software Products for Manufacturers and Developers

June 6, 2019 by Joao Martins

Audinate Unveils New Dante-As-Software Products for Manufacturers and Developers

Supporting the AV industry’s shift from purpose-built hardware to software-based solutions running on standardized hardware, Audinate announced two new software-based Dante networking products. Dante Embedded Platform enables manufacturers to add full Dante functionality in software running on Linux for x86 and ARM processors. The Dante Application Library allows software developers to seamlessly integrate Dante functionality directly into their PC & Mac applications. Early confirmed adopters include QSC, Zoom, and Analog Devices.

Lattice Semiconductor Introduces New Development Kit for Low Power, Embedded AI Applications

May 31, 2019 by Cristina Costa

Lattice Semiconductor Introduces New Development Kit for Low Power, Embedded AI Applications

Lattice Semiconductor announced the availability of the HM01B0 UPduino Shield, a comprehensive development kit for implementing Artificial Intelligence (AI) computing in devices using vision and sound as sensory inputs. This rapid prototyping board, in the Arduino form factor, includes components designers need to quickly develop always-on, low power smart IoT and connected devices. This new development kit consists of a Lattice iCE40 UltraPlus FPGA-based Upduino 2.0 board and a Himax HM01B0 image sensor module.

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