All items tagged with embedded development (122)
New USBXpress Controller from Silicon Labs Simplifies USB Connectivity for Embedded Designs
August 11, 2016 by Cristina Costa

New USBXpress Controller from Silicon Labs Simplifies USB Connectivity for Embedded Designs

Silicon Labs has added a smaller, lower-power member to its family of USBXpress bridge devices, providing a simpler, faster way to add Universal Serial Bus (USB) connectivity to new and legacy embedded designs. Silicon Labs’ new CP2102N USB controller eliminates complex, time-consuming firmware development and provides advanced functionality in QFN packages as small as 3 mm x 3 mm. The CP2102N device simplifies USB-to-UART connectivity and speeds time to market for a wide range of portable, power-sensitive and space-constrained applications.
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XMOS appoints Mark Lippett as President and CEO
July 20, 2016 by audioXpress Staff

XMOS appoints Mark Lippett as President and CEO

Prominent provider of voice-enabled controllers and music connectivity ICs, XMOS Ltd., has announced the appointment of Mark Lippett as President and Chief Executive Officer. Lippett, a 10-year veteran of XMOS, previously held VP Engineering and COO roles within the business. Prior to XMOS, he served as CTO of Ignios, and held engineering and marketing roles at Texas Instruments, Lucent and Madge Networks. Outgoing CEO, Nigel Toon, has assumed the role of Chairman of the Board of Directors.
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Microchip Introduces New Low Power PIC32 Family With Core Independent Peripherals
June 28, 2016 by audioXpress Staff

Microchip Introduces New Low Power PIC32 Family With Core Independent Peripherals

For applications demanding low power and longer battery life in automation, remote controls and wearable devices, the new Microchip PIC32MM MCU family has sleep modes down to 500 nA. Applications with space constraints will benefit also from the small 4x4mm package options. The PIC32MM devices include core independent peripherals, designed to offload the CPU for lower power and flexible system design, such as Configurable Logic Cells (CLC) and Multiple-output Capture Compare PWMs (MCCPs) which help enable sensorless BLDC motor control applications.
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TIDAL Certifies StreamUnlimited’s StreamSDK Development Platform
December 18, 2015 by audioXpress Staff

TIDAL Certifies StreamUnlimited’s StreamSDK Development Platform

StreamUnlimited, a provider of software solutions and development modules for connected audio products, announced TIDAL has certified StreamSDK, its streaming and multi-room audio integration solution, as an approved product module for companies who incorporate the service into its products. TIDAL’s certification will allow audio manufacturers to bring products to market much easier and faster.
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Libre Wireless Technologies Advances Wireless Audio and Embedded Wireless Solutions
October 21, 2015 by audioXpress Staff

Libre Wireless Technologies Advances Wireless Audio and Embedded Wireless Solutions

At the Hong Kong Electronic Fair, Libre Wireless Technologies announced new Wi-Fi Audio Streaming Module Solutions incorporating Google Cast for Audio and the availability of the LibreSync Wi-Fi media streaming platform with advanced “Dynamic Direct Multinode Streaming” technology (DDMS).
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Microchip Expands High-Performance 32-bit MCU Family With Integrated Floating Point Unit Series
September 18, 2015 by audioXpress Staff

Microchip Expands High-Performance 32-bit MCU Family With Integrated Floating Point Unit Series

Microchip is now offering the new PIC32MZ family of 32-bit MCUs as an ideal foundation for high-end and next-generation applications, including wireless audio projects. The new 48-member series supports an extensive DSP instruction set and integrates 2MB Flash, 18 MSPS 12-bit ADC, FPU, Crypto Engine, Hi-Speed USB, 10/100 Ethernet, CAN and rich peripheral options.
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Microchip Boosts USB-C Connector Revolution With Introduction of Cost-Effective Controller
September 11, 2015 by audioXpress Staff

Microchip Boosts USB-C Connector Revolution With Introduction of Cost-Effective Controller

Microchip just announced its new UTC2000 Controller to enable simple and quick implementation of the new USB-C reversible-plug connector for all kinds of USB devices and USB cabling in a wide range of applications. A new USB-C Evaluation Kit is also available, enabling designers to convert a traditional USB connector to type C for both UFP and DFP.
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MSC Technologies Integrates Low-Power 6th Generation Intel Core Processors on COM Express Modules
September 8, 2015 by audioXpress Staff

MSC Technologies Integrates Low-Power 6th Generation Intel Core Processors on COM Express Modules

MSC Technologies has launched the MSC C6C-SLU Type 6 COM Express module family, which is based on the latest 6th Generation Intel Core U Series processors, a complete low-power chipset in one multi-chip package with integrated graphics controller. An efficient and compact solution for embedded systems, including home automation applications.
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Coveloz Launches Networked Pro Audio SoC FPGA Development Kit for AVB and AES67 Applications
March 18, 2015 by audioXpress Staff

Coveloz Launches Networked Pro Audio SoC FPGA Development Kit for AVB and AES67 Applications

Coveloz, a Canadian company specializing on embedded development and applications for programmable time-sensitive network solutions, announced availability of a new development board for designers of professional networked audio and audio processing applications. The company offers solutions for both IEEE-AVB and AES67 Audio Transport, media clock distribution over Ethernet and professional audio processing.
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CSR expands dual-mode BlueCore platform with turnkey SoC for Bluetooth modules and embedded systems
March 3, 2015 by audioXpress Staff

CSR expands dual-mode BlueCore platform with turnkey SoC for Bluetooth modules and embedded systems

CSRs highly integrated Bluetooth Smart Ready compliant CSRB5348 offers significant BOM savings while speeding time to market for multiple applications. The new dual-mode BlueCore platform offers a powerful set of classic and low-energy features in a highly integrated package, making it ideal for module manufacturers looking to speed time to market.
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