TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

October 4 2019, 00:05
Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.

The CH-101 ultrasonic ToF sensor module (MOD-CH101) contains a CH-101 sensor on a small printed circuit board (PCB) with flat flexible connector (FFC), and acoustic housing on top that enables an omnidirectional beam pattern of the output. It is designed to allow rapid integration into product enclosures, prototyping and small-scale production for a wide range of applications, including AR/VR, smart home technology, drones and robotics, connected devices, mobile and wearable technology, and automotive. The CH-101 sensor module connects directly into the SmartSonic developer evaluation kit (DK-CH101) for initial product evaluation using the SonicLink software, which can also be used by customers to develop embedded algorithms for specific applications.

Available now through distribution partners, all the supporting software and documentation is available within the Developers Corner section of the TDK website, which includes:
- SmartSonic evaluation kit software, SonicLink, & documentation
- SonicLink quick start guide
- SmartSonic evaluation kit user’s guide
- Application notes such as mechanical integration & handling/assembly guides
- Driver/API documentation
“Our MEMS-based ultrasonic sensing technology offers multiple advantages over more traditional infrared proximity and ToF sensors. These include lower power consumption by several orders of magnitude, range measurement accuracy that is not affected by ambient light conditions such as direct sunlight, the ability to sense any color object as well as windows and glass doors, a wide and customizable field of view (FoV), and 100 times lower range noise,” says Michelle Kiang, CEO, Chirp Microsystems, a TDK Group Company. “The SmartSonic ultrasonic sensing platform is easy to use and enables fast prototyping and flexible customer design options for a broad range of use-case scenarios, such as range-finding, presence/proximity sensing, obstacle-detection/avoidance and object position-tracking.”

The SmartSonic evaluation kit and MEMS-based ultrasonic sensor modules are in mass production and available through distribution throughout North America and worldwide through Avnet, Components Distribution, DigiKey, Mouser Electronics and Symmetry.

TDK Corporation is a leading electronics company based in Tokyo, Japan, with products marketed under the brands TDK, Chirp, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. |
related items