On-Device Voice Interfaces Driving Growth in MEMS and ECM Microphone Market

According to SAR Insight & Consulting, the market for MEMS and ECM microphones continues to see strong growth, with ten billion units shipped in 2020. This was driven by two main factors: increased use of voice interfaces and multiple microphones per device, according to SAR’s latest report “MEMS Microphones Focus: Market Growth, Mic Type, Input Type, SNR, Volume, Performance Density.” With the emergence of TWS, earbuds and headphones are now the second largest market.

InvenSense, a TDK Group company, announced a comprehensive portfolio of new technology solutions during the 2021 Consumer Electronics Showcase. Among the expanded MEMS portfolio, the new T5838 SmartSound MEMS microphone offers a low power mode of just 130uAmps and a high-quality mode of 330uAmps, while supporting a dynamic range of 68dN SNR and 133dB AOP at 20kHz bandwidth. Optimized for smartphones, microphone arrays, smart speakers, and headsets, the T5838 supports configurable wake-on-sound at power levels as low as 20 µA.

Dr. Peter G. Hartwell, Chief Technology Officer at InvenSense, a TDK group company, has been named a 2019 inductee into the SEMI-MEMS & Sensors Industry Group (MSIG) Hall of Fame for his outstanding contributions to MSIG and well-known industry activity.. The recognition honors those who inspire a sense of mission, purpose and dedication that drives the MEMS and sensors industry forward.

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.