Murata Announces Lowest Power Wi-Fi and Bluetooth 5 Combo Module for Portable Audio Applications

March 27 2019, 00:35
Murata Announces Lowest Power Wi-Fi and Bluetooth 5 Combo Module for Portable Audio Applications
Murata Announces Lowest Power Wi-Fi and Bluetooth 5 Combo Module for Portable Audio Applications
Murata has collaborated with Cypress Semiconductor to develop the Type 1LV (CYW43012) solution that the company states is the lowest power, small form factor Wi-Fi and Bluetooth module currently available. This product improves battery life in wearables, smart home products, and portable audio applications. When comparing Type 1LV (CYW43012) to the previous Type 1DX (CYW4343W) solution, power usage is approximately 54 percent lower in DTIM 1, 60 percent in DTIM 3, up to 50 percent for 2.4 GHz RX, and 28 percent for 2.4 GHz TX.

Based on the Cypress CYW43012 combo chipset, the ultra-small dual-band Wi-Fi 11a/b/g/n/ (11ac Friendly) +Bluetooth 5.0 BR/EDR/LE module provides data transference rates up to 78Mbps on Wi-Fi and 3Mbps on Bluetooth, also supporting 2Mbps BLE. The WLAN section supports SDIO v2.0 SDR25 interface and the Bluetooth section supports high-speed 4-wire UART interface and PCM for audio data. The Type 1LV supports a broad range of popular processors including PSoC6, i.MX RT, STM32, i.MX, and IP Camera platforms, as well as Linux and RTOS based applications.

The Type 1LV uses highly sophisticated and enhanced hardware mechanisms and algorithms to ensure that Wi-Fi and Bluetooth coexistence is optimized for maximum performance. An embedded IPv6 network stack can be used to keep the host processor in sleep mode while maintaining network connections. The module also supports BLE 2Mbps, LE Secure Connections, LE Privacy 1.2, and LE Data Packet Length Extension. The device operates seamlessly in dual-band networks with increased energy efficiency and enhanced security providing optimal performance in Wi-Fi 5 networks. 
 
Performance comparison between Type 1LV (CYW43012) and previous Type 1DX (CYW4343W) - VBAT 3.6V and VDDIO 1.8V at +25°C
Performance comparison between Type 1LV (CYW43012) and previous Type 1DX (CYW4343W) - VBAT 3.6V and VDDIO 1.8V at +25°C

The new Type 1LV module is packaged in an impressively small shielded form factor that facilitates integration into size- and power-sensitive applications such as IoT applications, handheld wireless system, gateway and more. The module size is 10.0mm(L) x 7.2mm(W) x 1.4mm(H). It will have a reference antennae design for FCC/IC certifications and CE conducted test to provide a lower development cost and faster time to market.

Teaming with Cypress allowed Murata to leverage the companies' combined expertise in delivering advanced solutions that combine Murata's proprietary packaging and miniaturization technologies. With this lowest Wi-Fi power module, hopes to motivate developers to create a new class of wireless products that were previously designated for Bluetooth only.
https://wireless.murata.com/type-1lv.html
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