All items tagged with Murata (10)

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

December 26, 2022 by Joao Martins

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

Syntiant is heading to CES 2023 with an exciting range of announcements and presentations of end-to-end edge AI solutions for always-on applications. The company will unveil a new reference design created in partnership with Telink that will enable ODMs and OEMs to easily and quickly deploy complete, ultra-low-power, deep learning voice processing applications in remote controls. Another major announcement is the launch of the Murata Type2DA neural decision processor module for edge AI audio and sensor applications.

Syntiant Introduces NDP102 Neural Decision Processor for Edge AI Sensor Applications

September 16, 2021 by audioXpress Staff

Syntiant Introduces NDP102 Neural Decision Processor for Edge AI Sensor Applications

Syntiant, a provider of deep learning solutions making edge AI a reality for always-on applications in battery-powered devices, announced its new Syntiant NDP102 Neural Decision Processor (NDP) for sensor applications that delivers 100x improvement in efficiency and performance compared to current MCU-based offerings. The fourth edge AI chip from the Californian company enables highly accurate inference performance at industry leading low power consumption.

World’s Smallest UWB and BLE Low-Power Module for Connected Devices

September 3, 2021 by Cristina Costa

World’s Smallest UWB and BLE Low-Power Module for Connected Devices

Murata has launched the world’s smallest ultra-wideband (UWB) module – measuring just 10.5 mm × 8.3 mm × 1.44 mm – that combines elevated levels of accuracy and reliability with low-power to ensure compact and battery-driven connected devices operate as efficiently and cost-effectively as possible. Using short-range radio frequency (RF) technology, the Type 2AB UWB + Bluetooth low-energy (BLE) connectivity module can be used in a wide variety of applications where precise detection is essential.

NXP Development Tools Support New Ultra-Wideband Applications With iPhone and Apple Watch

June 7, 2021 by Cristina Costa

NXP Development Tools Support New Ultra-Wideband Applications With iPhone and Apple Watch

NXP Semiconductors has announced that it now offers beta Ultra-Wideband (UWB) development tools from its NXP Trimension portfolio that interoperate with the U1 chip in supported Apple products. The beta development tools will allow developers to kick-start the design of innovative applications that interact with UWB enabled Apple products including iPhone and Apple Watch, unleashing the ability to create more precise, directionally aware app experiences.

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

April 9, 2021 by Cristina Costa

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.

Murata Develops Compact Multilayer Ceramic Capacitor

June 5, 2020 by audioXpress Staff

Murata Develops Compact Multilayer Ceramic Capacitor

Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M multi-layer ceramic capacitor, which the company claims is the world’s first to feature a maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020. Applications can be valuable in wearables devices and compact audio players, among many other products that require large numbers of more compact capacitors.

Murata Announces Lowest Power Wi-Fi and Bluetooth 5 Combo Module for Portable Audio Applications

March 27, 2019 by audioXpress Staff

Murata Announces Lowest Power Wi-Fi and Bluetooth 5 Combo Module for Portable Audio Applications

Murata has collaborated with Cypress Semiconductor to develop the Type 1LV (CYW43012) solution that the company states is the lowest power, small form factor Wi-Fi and Bluetooth module currently available. This product improves battery life in wearables, smart home products, and portable audio applications. When comparing Type 1LV (CYW43012) to the previous Type 1DX (CYW4343W) solution, power usage is approximately 54 percent lower in DTIM 1, 60 percent in DTIM 3, up to 50 percent for 2.4 GHz RX, and 28 percent for 2.4 GHz TX.

MEMS for Mobile Devices: Global Market Report 2017-2021

March 14, 2018 by audioXpress Staff

MEMS for Mobile Devices: Global Market Report 2017-2021

ResearchAndMarkets.com just announced a new market report focusing on the "Global MEMS Market for Mobile Devices 2017-2021." According to the research firm, the global MEMS market for mobile devices is set to grow at a CAGR of 10.55% during the period 2017-2021. The report has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years, and includes a discussion of the key vendors operating in this market.

Arduino Unveils Two New Development Boards for Low Power Connected Devices

October 3, 2017 by audioXpress Staff

Arduino Unveils Two New Development Boards for Low Power Connected Devices

Arduino has unveiled the new Arduino MKR WAN 1300 (LoRa) and the Arduino MKR GSM 1400, two new boards that are designed to offer a practical and cost-effective solution for developers, enabling them to quickly add connectivity to their battery-powered applications. Designed to make connectivity seamless, the two latest Arduino boards deliver embedded LoRa and GSM wireless standards, enabling quick development of devices and applications.

Beta Layout Receives UL Certification for PCBs with Embedded RFID

July 28, 2015 by audioXpress Staff

Beta Layout Receives UL Certification for PCBs with Embedded RFID

Magic-PCB is an identification solution for the electronic industry from Beta Layout. This unique system for identifying PCBs and electronic devices is fast, copy-proof, reliable and virtually indestructible. This embedded RFID technology is now certified according to the US safety standards for Electronic products.