All items in category Industry News
CEVA Expands TeakLite Family Audio Applications with Maxim's Dynamic Speaker Management and Nuance Voice Activation Technologies
by Joao Martins

CEVA Expands TeakLite Family Audio Applications with Maxim's Dynamic Speaker Management and Nuance Voice Activation Technologies

During Mobile World Congress 2018, CEVA announced the availability of Dynamic Speaker Management (DSM) software from Maxim Integrated Products for its CEVA-TeakLite-4 family of ultra-low power audio/voice DSPs, allowing for much louder and richer sound on smartphones, wearables and headsets. CEVA also confirmed that Nuance Voice Activation technology is now available for the CEVA-TeakLite family of DSPs, offering improved performance and power efficiency for mobile devices and smart home applications.
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Deezer Expands Voice Activation With Amazon Alexa
by audioXpress Staff

Deezer Expands Voice Activation With Amazon Alexa

Deezer confirmed that it rolling out voice recognition support with Amazon Alexa, making at-home listening even more accessible. Deezer music streaming for Amazon Alexa is supported on Alexa devices and will be available in all territories where Deezer and Alexa are supported, including the US, UK and Germany through a gradual rollout. Deezer will be available on all devices that support Alexa such as Sonos One, Ultimate Ears, and others.
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Calling all Music Lovers to Audio Expo North America 2018!
by audioXpress Staff

Calling all Music Lovers to Audio Expo North America 2018!

AXPONA will take place April 13-15, 2018, at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, IL. This year AXPONA will offer attendees three jam-packed days of incredible sounds, technology, and presentations. Now in its ninth year, AXPONA is the defining high-end audio show in the United States — catering to dealers, distributors, and manufacturers, as well as music-loving consumers. AXPONA’s new state-of-the-art venue will feature an expanded Exhibit Hall, new Record Shop, and Master Class Theater.
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Embedded World 2018 Confirms Record Attendance and Exhibitors Growth
by audioXpress Staff

Embedded World 2018 Confirms Record Attendance and Exhibitors Growth

In its closing report, NürnbergMesse confirmed that the 2018 edition of Embedded World - 26 - 28 February 2019, Nuremberg, Germany, has established a new record for the trade-show. Confirming more trade visitors, exhibitors and space, as well as a record 2.000 participants and speakers attending the annual conference sessions, Embedded World 2018 provided a clear sign of a positive momentum in all market segments for embedded electronics applications, with particular emphasis on IoT, industrial connected solutions and automotive.
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Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems
by Joao Martins

Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems

Following earlier demonstrations at CES 2018, Qualcomm introduced a series of new platforms, SoC and development kits targeting new advanced audio applications and smart speakers, including the support of key wireless technologies, voice and cloud ecosystems. Solutions include its Smart Audio Platform optimized for smart speakers, a 6-microphone far field voice platform qualified for Amazon AVS, Dolby Audio implementations for wireless speakers and much more.
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STMicroelectronics and USound Demonstrate MEMS Speaker Headphones at MWC 2018
by Joao Martins

STMicroelectronics and USound Demonstrate MEMS Speaker Headphones at MWC 2018

Expanding on the first presentation of USound’s technology at Mobile World Congress a year ago, in 2018 STMicroelectronics hosted a working product demonstration of a in-earphone using only one single MEMS speaker driver per side, as well as a spatial audio demo using 14 drivers on over-ear headphones, proving the technology’s full potential. MEMS speakers developed by USound and manufactured by STMicroelectronics combine minuscule size, low profile, and high efficiency, enabling multiple wearable form factors.
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Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio
by Joao Martins

Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio

Global communications equipment provider Huawei has entered into a worldwide patent license agreement with the renowned developer of audio and media technologies, Fraunhofer IIS, for Fraunhofer’s MPEG-4 Audio patent portfolio. The license agreement addresses past and future use of Fraunhofer’s MPEG-4 Audio patent portfolio in Huawei’s products. The patents cover compression formats for perceptual coding of audio signals, including some variations of Advanced Audio Coding (AAC), and other audio/speech coding formats and tools.
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TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems
by audioXpress Staff

TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems

TDK Corporation announced that it has reached an agreement with Chirp Microsystems, a pioneer in high-performance ultrasonic sensing, headquartered in Berkeley, California. With the acquisition, Chirp becomes a wholly owned subsidiary of TDK, enhancing its existing technology in fingerprint sensors, MEMS sensors, and Piezoelectric transducer product lines. “TDK aims to be the leader in the ultrasonic MEMS sensors and solutions market,” says Shigenao Ishiguro, TDK’s President and CEO.
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Social Music Platform BandLab Technologies Buys What's Left of Cakewalk
by Joao Martins

Social Music Platform BandLab Technologies Buys What's Left of Cakewalk

In the middle of all the turmoil around the rumors of the collapse of Gibson Brands, there's some sort of good news for musicians and many home and project studios. Following the hard-to-understand news, back in November 2017, that Gibson was closing Cakewalk - the first clear sign that the group was facing serious financial troubles - there is now a confirmation that not everything is lost for users of Cakewalk's products. Singapore-based BandLab Technologies confirmed the acquisition of Cakewalk Inc. remaining assets.
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QuickLogic Collaborates with Shenzhen Horn Audio Company to Develop Bluetooth Headset Reference Design with Alexa Support
by audioXpress Staff

QuickLogic Collaborates with Shenzhen Horn Audio Company to Develop Bluetooth Headset Reference Design with Alexa Support

QuickLogic Corporation announced it has partnered with Shenzhen Horn Audio Co., Ltd. to deliver a Bluetooth-enabled headset reference design supporting Amazon Alexa Voice Services (AVS) for both Apple and Android smartphones and tablets. Based on QuickLogic's EOS S3 Voice and Sensor Processing Platform, the new reference design features advanced always-on and always-listening voice processing capabilities with the industry's lowest power consumption.
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