![](https://cdn.xingosoftware.com/audioxpress/images/fetch/dpr_1,w_765,h_574,c_fit/https%3A%2F%2Faudioxpress.com%2Fassets%2Fupload%2Fimages%2F1%2F20180228094248_CEVA-MWC2018-P2270211Web.jpg)
Many devices, including smartphones, headsets and wearables encounter significant challenges when it comes to speaker design. The requirement for increasingly smaller micro speakers and the power constrains in these devices severely limits the sound quality possible using conventional D-class amplifiers. Dynamic Speaker Management (DSM) running on the CEVA-TeakLite-4, together with Maxim's boosted IV sense Class D speaker amplifiers overcomes these challenges, delivering a much richer sound experience with 2.5x louder sound and 2 octaves deeper bass versus conventional Class D amplifiers. During MWC 2018, CEVA confirmed that the DSM optimized software implementation running on CEVA-TeakLite-4 is already integrated into a smartphone SoC from a Tier-1 smartphone OEM.
"At Maxim, we are constantly pushing the boundaries of the sound quality possible from micro speakers, creating louder and richer listening experiences for our customers," says Jonathan Chien, managing director and general manager of Audio Solutions at Maxim. "DSM on the CEVA-TeakLite-4 DSP is already proven with a tier-1 smartphone OEM, and offers an exceptional solution for any speaker-constrained and power-sensitive mobile device."
"Consumers increasingly expect powerful sound from their mobile devices, despite the incredible small form factor & power budget constraints of smartphones, wearables and alike," says Moshe Sheier, director of strategic marketing at CEVA. "The combination of Maxim's DSM technology and our ultra-low-power CEVA-TeakLite-4 audio/voice DSP provides rich, powerful sound from even the smallest of micro speakers, without compromising reliability and power efficiency of the device."
![](https://cdn.xingosoftware.com/audioxpress/images/fetch/dpr_1,w_765,h_574,c_fit/https%3A%2F%2Faudioxpress.com%2Fassets%2Fupload%2Fimages%2F1%2F20180307105742_MWC2018-CEVA-P2270221Web.jpg)
Voice Activation
During MWC 2018 in Barcelona, CEVA also announced the availability of the Nuance AI-powered wake-up and voice activation technology suite on the CEVA-TeakLite family of DSPs. Nuance's voice activation can be easily integrated into any embedded system design, from always-listening smartphones and IoT devices to smart home personal assistants, allowing users to speak to these devices without pressing a button to activate the assistant. Tier-1 smartphone OEMs are already integrating this solution, which will be debuted in Spring 2018.
"At Nuance, we're at the leading edge of the conversational AI revolution, making it possible for people and machines to communicate naturally and seamlessly," says Kenneth Harper, vice president of emerging solutions at Nuance. "When it comes to low-power embedded systems, the CEVA-TeakLite DSPs offer incredibly low standby power consumption for our market-leading voice activation technology, and also the processing power to run additional voice algorithms for further differentiation."
"The combination of our ultra-low-power audio/voice DSP and Nuance's optimized voice activation technology makes for a highly efficient, always-on solution for the emerging voice-enabled market," adds Moshe Sheier. "The benefits of voice-enabled smart devices are undoubted, and Nuance voice activation technology combined with CEVA-TeakLite is ideal for power-sensitive battery-operated devices such as smartphones, headsets and the IoT."
www.maximintegrated.com | www.nuance.com
www.ceva-dsp.com