All items in category Industry News
Sivantos and Widex Successfully Complete Merger and Create WS Audiology
by audioXpress Staff

Sivantos and Widex Successfully Complete Merger and Create WS Audiology

Following approval by the European Commission earlier in February 2019, EQT funds, owners of Sivantos Pte. Ltd. (“Sivantos”), and the Tøpholm and Westermann families, owners of Widex A/S (“Widex”), announced the successful completion of the business combination between Sivantos and Widex. The newly created company will operate under the name WS Audiology and be headquartered in Lynge, Denmark and Singapore.
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Fluent.ai Demonstrates Embedded Single Engine Multi-WakeWord and Speech Commands Recognition Solution for Micro-CPU Architectures
by audioXpress Staff

Fluent.ai Demonstrates Embedded Single Engine Multi-WakeWord and Speech Commands Recognition Solution for Micro-CPU Architectures

Fluent.ai, the speech recognition provider offering fully embeddable speech recognition solutions in any language, announced the release of its ultra low-power voice control solution for embedded platforms such as Cortex M4F processors. This breakthrough new solution delivers, using a single engine, multiple wakewords in parallel and up to 50 multilingual commands with variable phrasing on a footprint equivalent to 50 MHz CPU, 128KB of RAM, and 550 KB of flash storage - a quantum leap over currently available software solutions.
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Dirac Research Debuts Dirac Distortion Control, Enabling Cleaner Audio From Mobile Devices at MWC19
by audioXpress Staff

Dirac Research Debuts Dirac Distortion Control, Enabling Cleaner Audio From Mobile Devices at MWC19

Dirac Research announced the debut of Dirac Distortion Control, a patent-pending audio solution that reduces audible distortion in smartphones, tablets, laptops and all-in-one PCs with minimal impact on volume. The company introduced Dirac Distortion Control to the mobile market at MWC19 in Barcelona with a demo experience developed to showcase the next-generation of mobile audio performance in partnership with leading micro-speaker manufacturer AAC Technologies.
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Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers
by audioXpress Staff

Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers

Qualcomm Technologies International, a subsidiary of Qualcomm Incorporated, showcased at MWC 2019 in Barcelona the most recent wireless earbuds and hearables using the latest Qualcomm QCC5100 and QCC302x series, ultra-low power Bluetooth audio SoCs. Now available in more than 10 products, Qualcomm is finding increased traction from audio, mobile and consumer electronics manufacturers for these SoCs, allowing for a robust, low-latency and high-quality wireless audio experiences, in compact, feature-rich wireless earbuds, headsets and speakers.
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Bragi Offers New Technology Suite and Reference Design for Consumer and Professional Hearables
by audioXpress Staff

Bragi Offers New Technology Suite and Reference Design for Consumer and Professional Hearables

Bragi, the company which can rightfully claim to be the creators of the world’s first Hearable, is unveiling the next-generation of its technology suite and is to introduce it at MWC 2019. As previously announced, Bragi is now developing ultra-efficient artificial intelligence and edge computing technologies for ultra-low power devices that intends to make available to other manufacturers. At MWC 2019, the German company will disclose details of the new platform as a reference design for professional Hearables.
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DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture
by audioXpress Staff

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

DSP Group and Snips, the European pioneer in embedded voice recognition software, announced a technology partnership which combines Snips’ voice software with DSP Group’s Ultra Low Energy (ULE) system-on-chip (SoC) and modules. According to the announcement, this combination of software and hardware running over the ULE network extends the reach of natural voice-controlled edge devices and could become a natural choice for multi-room smart home and smart building applications.
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Dirac Debuts Latest Version of Dirac 3D Audio at MWC19
by audioXpress Staff

Dirac Debuts Latest Version of Dirac 3D Audio at MWC19

At MWC19, Dirac Research announced the debut of its latest version of Dirac 3D Audio for mobile devices, headphones and VR/AR headsets. Using patent-pending Dynamic HRTFs (head-related transfer functions), Dirac 3D Audio enables positional audio reproduction with one degree of resolution in all three dimensions, and offers an unparalleled level of 360-degree audio immersion on mobile devices, ideal for on-the-go gaming and videos.
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HEAD acoustics Launches Acoustic Environment for Realistic Noise and Reverberation Measurements
by audioXpress Staff

HEAD acoustics Launches Acoustic Environment for Realistic Noise and Reverberation Measurements

Users of mobile phones, voice-operated smart home devices or hands-free terminals have to deal with different background noises and room reverberation that impair their user experience. Therefore, realistic performance tests of communication devices do not only need to consider background noise but also reverberation. HEAD acoustics launches 3PASS reverb for this purpose, a software option for its background noise simulation systems 3PASS lab and 3PASS flex.
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Xperi Corporation to Showcase Latest DTS Audio Technologies at MWC 2019
by audioXpress Staff

Xperi Corporation to Showcase Latest DTS Audio Technologies at MWC 2019

Xperi Corporation will showcase its latest mobile imaging, audio and semiconductor solutions from its brands, FotoNation, DTS and Invensas at MWC 2019 (February 25-28), in Barcelona. Xperi will showcase DTS audio solutions specifically targeted at the gaming market, including DTS Headphone:X 2.0 (for Gaming Headphones); DTS:X Ultra (for Windows and Android); DTS:X Game Audio; and DTS:X Premium.
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Listen Offers ETSI Standard Background Noise Generation System
by audioXpress Staff

Listen Offers ETSI Standard Background Noise Generation System

Listen has launched the ETSI standard background noise generation module, a SoundCheck test sequence which calibrates a 4.1 speaker array to conform with the ETSI ES 202 396-1 Standard. This provides an equalized, calibrated playback solution to stress devices in a standardized and repeatable way. With a purchase price of just $5,000 for the test sequence, this offers an extremely economical alternative to a conventional $20,000+ stand-alone background noise generation system.
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