All items in category Electronics Corner
Smallest Low-Power Wireless Power Receiver for In-Case TWS Charging
by Cristina Costa

Smallest Low-Power Wireless Power Receiver for In-Case TWS Charging

Integrated Device Technology (IDT), a wholly owned subsidiary of Renesas Electronics Corporation, announced the availability of its new P9222-R wireless power receiver, the industry’s smallest and optimized for wireless charging cases used to charge true wireless stereo (TWS) earbuds, hearing aids and other small, battery-powered consumer devices. Unlike other available solutions, the P9222-R is cost-optimized, highly efficient, feature rich and proven in high-volume applications with major consumer electronics manufacturers.
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Infineon Expands CoolGaN Portfolio with New Device Tailored for Premium Audio Systems
by audioXpress Staff

Infineon Expands CoolGaN Portfolio with New Device Tailored for Premium Audio Systems

Infineon Technologies broadened its CoolGaN series with two new devices: the CoolGaN 400 V and the CoolGaN 600 V. Gallium nitride (GaN) offers fundamental advantages over silicon, with outstanding specific dynamic on-state resistance and smaller capacitances compared to silicon MOSFETs. The new CoolGaN 400 V device will appeal to audio product designers looking for a premium solution for home or professional Class D amplifiers.
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Skyworks Connectivity Modules Powering Next Generation Wi-Fi 6 Applications
by audioXpress Staff

Skyworks Connectivity Modules Powering Next Generation Wi-Fi 6 Applications

Skyworks Solutions announced that its advanced connectivity solutions are powering next generation Wi-Fi 6 (802.11ax) devices from the world’s leading connected home and mesh network providers, including Arris, Asus, D-Link, Netgear, Ruckus and TP-Link. Specifically, Skyworks’ modules are being leveraged in all of the latest best-selling Wi-Fi 6 routers.
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Cypress Introduces New ACG1F USB-C Controller for High-Volume Segments
by audioXpress Staff

Cypress Introduces New ACG1F USB-C Controller for High-Volume Segments

Cypress Semiconductor announced its latest USB-C controller, ACG1F. Designed for mainstream and entry-level notebooks and desktop PCs, the new ACG1F is a cost-effective single-port USB-C controller used for systems which need to convert legacy USB Type-A ports to USB Type-C ports. This means that Windows laptops and notebooks will finally be able to transition to USB-C connectors following Apple's traditional market lead.
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Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support
by Joao Martins

Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support

Microchip introduced the new BM83 SoC, a Bluetooth 5.0 certified dual-mode audio module that contains an on-board Bluetooth stack and audio profiles and supports 24-bit/96kHz high-resolution audio formats to enable high-fidelity wireless audio, including support for Sony’s high fidelity LDAC codec. The combined solution is intended for both new speaker and headphone designs, offering differentiated features.
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NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications
by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.
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TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors
by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.
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New ams TMD2635 Proximity Sensor Module Enhances Smaller True Wireless Earbud Designs
by audioXpress Staff

New ams TMD2635 Proximity Sensor Module Enhances Smaller True Wireless Earbud Designs

Austrian sensor specialist ams announced the world’s smallest 2-in-1 IR proximity sensor module, paving the way to smaller, lighter, and always-available True Wireless Stereo (TWS) earbuds. The ultra-small package of the new ams TMD2635 module measures just 1mm3, and enables ear detection triggers to help extend battery life between charges. Two TMD2635 modules can be used in tandem to enable touchless gesture controls.
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Senseg Introduces World’s First Flexible Actuators Manufactured with Roll-To-Roll Technology
by Cristina Costa

Senseg Introduces World’s First Flexible Actuators Manufactured with Roll-To-Roll Technology

Senseg, a leading manufacturer of electrostatic sensors based in Finland, announced that it has created a new category of flexible electronics by launching a family of roll-to-roll manufactured actuators for use in traditional flat actuator applications as well as for new applications, such as wearables, soft robotics, VR/AR devices, and interior integrated sensors. Called Senseg ELFIAC (for Elastomeric Film Actuator), the new product will deliver large-scale manufacturable actuators that are far less expensive to produce than comparable traditional actuators (such as piezos) and use cheaper, non-toxic materials.
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Microchip Simplifies Power Delivery (PD) in Growing USB Type-C Charging Market
by audioXpress Staff

Microchip Simplifies Power Delivery (PD) in Growing USB Type-C Charging Market

USB Type-C has become increasingly popular, and with the introduction of Power Delivery (PD), it is now possible to charge more types of devices – and charge faster – than ever before. To remove the traditional complexity and high costs associated with implementing USB Type-C, Microchip Technology announced two new USB 3.1 solutions that simplify USB Type-C PD for a range of applications.
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