All items in category Electronics Corner
Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor
by audioXpress Staff

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

DSP processing software specialist firm, Alango has been working to port the company's Voice Enhancement Package (VEP) to the NXP i.MX RT600 cross-over processor family, which is optimized for 32-bit immersive audio applications combining a high-performance Cadence Tensilica Hi-Fi 4 audio DSP core with a next-generation Cortex-M33 core. VEP is a set of Alango proprietary far-field voice enhancement technologies developed to improve human to machine interaction in a variety of applications.
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New TI Burr-Brown Audio Quad-Channel ADC Captures Voice at Four Time Larger Distances
by audioXpress Staff

New TI Burr-Brown Audio Quad-Channel ADC Captures Voice at Four Time Larger Distances

No more yelling at smart speakers. Texas Instruments (TI) introduced a new audio analog-to-digital converter (ADC) capable of capturing clear audio up to four times farther away than competing devices. The new TI Burr-Brown TLV320ADC5140 audio ADC enables far-field voice capture and achieves a 120-dB dynamic range for clear, high-fidelity audio in smart home applications. The TLV320ADC5140 is the industry’s smallest quad-channel audio ADC with this level of performance.
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Qualcomm Introduces New Amazon Alexa Development Kit for Affordable Smart Home Products
by audioXpress Staff

Qualcomm Introduces New Amazon Alexa Development Kit for Affordable Smart Home Products

Qualcomm Technologies, a subsidiary of Qualcomm, announced a new development kit based on the Qualcomm QCA4020 multimode SoC that is qualified by Amazon’s Alexa Voice Service (AVS) for AWS IoT Core connected devices. The new Qualcomm Home Hub 100 kit supports Alexa Voice Service using a microcontroller (MCU) and Real-Time Operating System (RTOS) with Multimode Connectivity and adds to Qualcomm's’ line up of voice enabling products including kits that can allow OEMs to easily integrate Alexa into smart speakers and hearables.
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Smallest Low-Power Wireless Power Receiver for In-Case TWS Charging
by Cristina Costa

Smallest Low-Power Wireless Power Receiver for In-Case TWS Charging

Integrated Device Technology (IDT), a wholly owned subsidiary of Renesas Electronics Corporation, announced the availability of its new P9222-R wireless power receiver, the industry’s smallest and optimized for wireless charging cases used to charge true wireless stereo (TWS) earbuds, hearing aids and other small, battery-powered consumer devices. Unlike other available solutions, the P9222-R is cost-optimized, highly efficient, feature rich and proven in high-volume applications with major consumer electronics manufacturers.
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Infineon Expands CoolGaN Portfolio with New Device Tailored for Premium Audio Systems
by audioXpress Staff

Infineon Expands CoolGaN Portfolio with New Device Tailored for Premium Audio Systems

Infineon Technologies broadened its CoolGaN series with two new devices: the CoolGaN 400 V and the CoolGaN 600 V. Gallium nitride (GaN) offers fundamental advantages over silicon, with outstanding specific dynamic on-state resistance and smaller capacitances compared to silicon MOSFETs. The new CoolGaN 400 V device will appeal to audio product designers looking for a premium solution for home or professional Class D amplifiers.
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Skyworks Connectivity Modules Powering Next Generation Wi-Fi 6 Applications
by audioXpress Staff

Skyworks Connectivity Modules Powering Next Generation Wi-Fi 6 Applications

Skyworks Solutions announced that its advanced connectivity solutions are powering next generation Wi-Fi 6 (802.11ax) devices from the world’s leading connected home and mesh network providers, including Arris, Asus, D-Link, Netgear, Ruckus and TP-Link. Specifically, Skyworks’ modules are being leveraged in all of the latest best-selling Wi-Fi 6 routers.
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Cypress Introduces New ACG1F USB-C Controller for High-Volume Segments
by audioXpress Staff

Cypress Introduces New ACG1F USB-C Controller for High-Volume Segments

Cypress Semiconductor announced its latest USB-C controller, ACG1F. Designed for mainstream and entry-level notebooks and desktop PCs, the new ACG1F is a cost-effective single-port USB-C controller used for systems which need to convert legacy USB Type-A ports to USB Type-C ports. This means that Windows laptops and notebooks will finally be able to transition to USB-C connectors following Apple's traditional market lead.
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Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support
by Joao Martins

Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support

Microchip introduced the new BM83 SoC, a Bluetooth 5.0 certified dual-mode audio module that contains an on-board Bluetooth stack and audio profiles and supports 24-bit/96kHz high-resolution audio formats to enable high-fidelity wireless audio, including support for Sony’s high fidelity LDAC codec. The combined solution is intended for both new speaker and headphone designs, offering differentiated features.
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NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications
by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.
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TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors
by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.
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