All items in category Electronics Corner
Electrocomponents Introduces OKdo E1 Single Board Computer for Low-Cost Development of Connected Devices
by audioXpress Staff

Electrocomponents Introduces OKdo E1 Single Board Computer for Low-Cost Development of Connected Devices

OKdo, the new brand that is now part of the Electrocomponents Group (RS, Allied, DesignSpark), introduced its first own-branded single board computer (SBC), the E1. The E1 board features an NXP LPC55S69 microcontroller, which offers a high-performance, secure low-cost entry to the development of connected devices, and represents the start of the next phase in the company's evolution towards providing an accessible range of software, hardware, services and solutions.
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Diodes Launches Active Switch with ReDriver to Support HDMI 2.1 Standard
by Cristina Costa

Diodes Launches Active Switch with ReDriver to Support HDMI 2.1 Standard

Diodes announced the PI3HDX12221, an HDMI 2.1 active switch with linear ReDriver that enables manufacturers of TVs, PCs, gaming consoles, and set-top boxes to adopt the latest 12Gbps HDMI standard. The device supports dual inputs with a signal cleaning function that enables extending channel lengths. Optimizing function integration into a single package reduces system BOM and power consumption, particularly when compared to an equivalent discrete solution.
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Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications
by audioXpress Staff

Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications

According to data from the GSMA, the world will see 3.2 billion cellular Internet-of-Things (IoT) connections in 2024. That is, billions of connected devices of all types in homes, companies, and cities. Qualcomm Technologies is already a leading supplier of wireless connectivity chipsets and they now announced a breakthrough new product to drive the growth of cellular IoT: the Qualcomm 212 LTE IoT Modem, introduced as the world’s most power-efficient single-mode NB2 (NB-IoT) chipset.
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Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables
by audioXpress Staff

Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables

Designers of compact consumer devices like hearables can now slash solution size by half and extend battery life by 20 percent with the MAX77654 single inductor, multiple output (SIMO) power management IC (PMIC) from Maxim Integrated Products. The breakthrough new SIMO technology replaces traditional power management architectures for the most demanding designs in wearables and personal audio devices, reducing BOM count by up to 40 percent, with 23 percent lower BOM cost compared to discrete solutions.
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USB Type-C Linear Mux/DeMux ReDriver with Integrated USB-C Detector from Diodes Restores Signal Integrity and Reduces Latency
by audioXpress Staff

USB Type-C Linear Mux/DeMux ReDriver with Integrated USB-C Detector from Diodes Restores Signal Integrity and Reduces Latency

Diodes announced the PI3EQX10612/PI3EQX10312 2-port 10Gbps linear ReDriver devices with integrated USB-C detection for equipment implementing a USB Type-C interface. Offering 1:2/2:1 mux/demux functionality, the ReDrivers can be used to extend the reach of USB signals running across rigid or flexible PCBs in gaming consoles, laptops, desktop computers, tablets, and other consumer applications.
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Samsung Introduces Industry’s First All-in-One Power ICs Optimized for Wireless Earbuds
by audioXpress Staff

Samsung Introduces Industry’s First All-in-One Power ICs Optimized for Wireless Earbuds

Showing its importance to the CE industry as one of the world's largest advanced semiconductor manufacturers, Samsung Electronics announced the first all-in-one power management integrated circuits (PMIC), MUA01 and MUB01, optimized for True Wireless Stereo (TWS) devices. The new Samsung PMICs integrate multiple discrete components in one chip to make room for longer battery life and more efficient designs in today’s true wireless earbuds and other very low power designs.
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CEVA Announces DSP and Voice Neural Networks Integration for Power-Efficient Edge Processors
by audioXpress Staff

CEVA Announces DSP and Voice Neural Networks Integration for Power-Efficient Edge Processors

CEVA announced that its CEVA-BX DSP cores and WhisPro speech recognition software now also support TensorFlow Lite for Microcontrollers, a production ready, cross-platform framework for deploying tiny machine learning on power-efficient processors in edge devices. WhisPro is CEVA's speech recognition software for voice wake words and custom command models. TensorFlow Lite for Microcontrollers is a solution from Google for implementing machine learning at the edge, already optimized and available for CEVA-BX DSP cores.
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Rohde & Schwarz Enables New Sub-THz Ultra Wideband Signal Analysis and Measurement Applications
by Cristina Costa

Rohde & Schwarz Enables New Sub-THz Ultra Wideband Signal Analysis and Measurement Applications

Rohde & Schwarz is paving the way for research in the terahertz frequency range by demonstrating multi gigabit data transmission in the D-Band at 140 GHz. The German test and measurement specialist announced its R&S FSW high-end signal and spectrum analyzers with optional internal 4 GHz, 6.4 GHz and 8.3 GHz analysis bandwidth, providing unmatched dynamic range and sensitivity. This new hardware option will be available soon from Rohde & Schwarz and will enable key new applications, including amplifier pre-distortion tests.
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Efficient Power Conversion Releases New GaN IC Family for High Performance Class-D Designs
by audioXpress Staff

Efficient Power Conversion Releases New GaN IC Family for High Performance Class-D Designs

Efficient Power Conversion (EPC) introduced the first of a new integrated circuit (IC) product family offering higher performance and smaller solution size for high power density applications including DC-DC conversion, motor drive, and Class-D audio amplifiers. EPC announced an 80 V, 12.5 A power stage integrated circuit designed for 48 V DC-DC conversion. The EPC2152 is a single-chip driver plus eGaN FET half-bridge power stage using EPC’s proprietary GaN IC technology.
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Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms
by audioXpress Staff

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

CEVA announced that Ambiq Micro has licensed CEVA’s RivieraWaves Bluetooth low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity. CEVA’s Bluetooth low energy (BLE) IP is already powering Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC), used in applications requiring intelligence everywhere, from wearables to animal trackers to smart home devices.
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