All items in category Electronics Corner
Samsung Introduces Industry’s First All-in-One Power ICs Optimized for Wireless Earbuds
by audioXpress Staff

Samsung Introduces Industry’s First All-in-One Power ICs Optimized for Wireless Earbuds

Showing its importance to the CE industry as one of the world's largest advanced semiconductor manufacturers, Samsung Electronics announced the first all-in-one power management integrated circuits (PMIC), MUA01 and MUB01, optimized for True Wireless Stereo (TWS) devices. The new Samsung PMICs integrate multiple discrete components in one chip to make room for longer battery life and more efficient designs in today’s true wireless earbuds and other very low power designs.
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CEVA Announces DSP and Voice Neural Networks Integration for Power-Efficient Edge Processors
by audioXpress Staff

CEVA Announces DSP and Voice Neural Networks Integration for Power-Efficient Edge Processors

CEVA announced that its CEVA-BX DSP cores and WhisPro speech recognition software now also support TensorFlow Lite for Microcontrollers, a production ready, cross-platform framework for deploying tiny machine learning on power-efficient processors in edge devices. WhisPro is CEVA's speech recognition software for voice wake words and custom command models. TensorFlow Lite for Microcontrollers is a solution from Google for implementing machine learning at the edge, already optimized and available for CEVA-BX DSP cores.
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Rohde & Schwarz Enables New Sub-THz Ultra Wideband Signal Analysis and Measurement Applications
by Cristina Costa

Rohde & Schwarz Enables New Sub-THz Ultra Wideband Signal Analysis and Measurement Applications

Rohde & Schwarz is paving the way for research in the terahertz frequency range by demonstrating multi gigabit data transmission in the D-Band at 140 GHz. The German test and measurement specialist announced its R&S FSW high-end signal and spectrum analyzers with optional internal 4 GHz, 6.4 GHz and 8.3 GHz analysis bandwidth, providing unmatched dynamic range and sensitivity. This new hardware option will be available soon from Rohde & Schwarz and will enable key new applications, including amplifier pre-distortion tests.
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Efficient Power Conversion Releases New GaN IC Family for High Performance Class-D Designs
by audioXpress Staff

Efficient Power Conversion Releases New GaN IC Family for High Performance Class-D Designs

Efficient Power Conversion (EPC) introduced the first of a new integrated circuit (IC) product family offering higher performance and smaller solution size for high power density applications including DC-DC conversion, motor drive, and Class-D audio amplifiers. EPC announced an 80 V, 12.5 A power stage integrated circuit designed for 48 V DC-DC conversion. The EPC2152 is a single-chip driver plus eGaN FET half-bridge power stage using EPC’s proprietary GaN IC technology.
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Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms
by audioXpress Staff

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

CEVA announced that Ambiq Micro has licensed CEVA’s RivieraWaves Bluetooth low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity. CEVA’s Bluetooth low energy (BLE) IP is already powering Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC), used in applications requiring intelligence everywhere, from wearables to animal trackers to smart home devices.
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STMicroelectronics Announces New-Generation Class-D Audio Amplifier IC Developed in Cooperation with Alps Alpine
by audioXpress Staff

STMicroelectronics Announces New-Generation Class-D Audio Amplifier IC Developed in Cooperation with Alps Alpine

STMicroelectronics announced the new FDA901 class-D audio amplifier IC, a new design that incorporates the world-class audio expertise of Japanese manufacturer of car audio equipment, Alps Alpine. The new ST chip aims to contribute to the creation of multi-function, high-fidelity car audio systems that fuse the high efficiency of class-D amplifiers with the high-quality sound of ST’s class-AB amplifiers.
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FTDI Launches Dual & Quad Channel USB-to-UART/MPSSE Bridge ICs with Built-in Type-C/PD Controllers
by Cristina Costa

FTDI Launches Dual & Quad Channel USB-to-UART/MPSSE Bridge ICs with Built-in Type-C/PD Controllers

At the forefront of embedded connectivity innovations, FTDI Chip’s latest series of multi-channel USB interface ICs have the capacity to deal with next generation power requirements, as larger items of hardware start to make use of the protocol. Available in both 2-channel (FT2233HP) and 4-channel (FT4233HP) versions, the new Hi-Speed (480Mbits/s) devices have serial UART (RS232, RS422 or RS485) and MPSSE (JTAG, I2C, SPI or Bit-Bang) interfacing capabilities.
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ESS Expands its USB DAC Portfolio with New ES9260 Low-Power Solution
by audioXpress Staff

ESS Expands its USB DAC Portfolio with New ES9260 Low-Power Solution

ESS Technology announced the ES9260, a new USB DAC solution with integrated PLL and regulator, optimized for low-power consumption. Intended for use in USB-C headsets and audio adaptors that demand high-quality sound and long play times, the new SoC offers lower power consumption than existing solutions while still delivering the highest-quality sound in its class.
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ReDrivers from Diodes Incorporated Boost Signal Quality of High-Speed USB 3.2, 10Gbps Interfaces
by Cristina Costa

ReDrivers from Diodes Incorporated Boost Signal Quality of High-Speed USB 3.2, 10Gbps Interfaces

Diodes introduced a series of USB ReDrivers for application in industrial, embedded, and consumer electronics products. The PI3EQX1004E and PI3EQX1002E are USB 3.2 compliant, 5Gbps to 10Gbps, 2-Port/1-Port, linear ReDrivers. The devices are backwards compatible with USB 3.1 Gen 1, 5Gbps and offer ultra-small and thin package types to reduce PCB size and total BOM cost. They have adjustable linear equalization, output swing, and flat gain to optimize performance over a variety of physical media by reducing intersymbol interference.
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ON Semiconductor Announces Innovative New USB-C Power Delivery 3.0 Controllers
by Cristina Costa

ON Semiconductor Announces Innovative New USB-C Power Delivery 3.0 Controllers

ON Semiconductor announced a pair of novel devices that are fully compliant with the USB-C Power Delivery (PD) 3.0 standard. New USB-C PD 3.0 Devices provide an advanced solution for power adapter and battery charger applications. The FAN6390 adaptive charging controller brings ease of integration of the USB-C PD 3.0 programmable power supply (PPS) standard into systems, while the NCP12601 is a highly integrated multi-mode flyback controller for rugged, high-performance, offline power supplies such as adapters.
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