All items in category Electronics Corner
New Firmware for XMOS XVF3510 Voice Processor Supports USB Accessory Devices and Integrated Solutions Development
by Cristina Costa

New Firmware for XMOS XVF3510 Voice Processor Supports USB Accessory Devices and Integrated Solutions Development

XMOS announced new firmware variants, supporting USB and built-in applications, of its XVF3510 voice processor, further opening the door to voice-enabled smart product development. The two variants — XVF3510-UA for USB accessory devices, and XVF3510-INT for built-in solutions — incorporate purpose-designed algorithms that ensure a clear voice stream is captured from across the room, even in noisy environments and with audio streaming from the device itself.
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AKM Develops Ultra-Low Power Intelligent System Wakeup ADC With Integrated Acoustic Activity Analyzer
by audioXpress Staff

AKM Develops Ultra-Low Power Intelligent System Wakeup ADC With Integrated Acoustic Activity Analyzer

Asahi Kasei Microdevices Corporation (AKM) has developed the AK5706, a high-performance 24-bit stereo A/D converter (ADC) with an integrated Acoustic Activity Analyzer (AAA) wakeup solution consuming only 30μA, audio buffer, and support for digital and high-SNR microphones. Designed for systems that must listen for specific types of audio activity while consuming very low power, the AK5706 is ideal for products such as speech recognition systems, as well as security and smart home devices.
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Keysight Introduces Complete USB4 Test Solutions to Optimize New Designs and Ensure Standard Compliance
by audioXpress Staff

Keysight Introduces Complete USB4 Test Solutions to Optimize New Designs and Ensure Standard Compliance

With the IT, mobile and consumer electronics industries focused on the transition towards a common interface and power solutions based on the new universal USB Type-C connector, gradually developers are starting to update their designs to the latest USB4 specification. To support those efforts, Keysight Technologies announced new USB4 solutions that maximize the performance of USB designs and ensure compliance with the USB standard to deliver accuracy and high signal fidelity.
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TDK Announces T3902 Lowest-Power PDM MEMS Microphone
by audioXpress Staff

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

TDK Corporation introduced the InvenSense T3902, which the company touts as the world’s lowest power Pulse Density Modulation (PDM) microphone for consumer devices. The new T3902 offers a high SNR of 64.5 dB, and high Acoustic Overload Point (AOP) of 120 dB in a very small package, optimized for mobile devices, wearables, headsets, TV remotes and more, supporting far-field communications, enabling clear audio capture in loud conditions, and ideal for voice recognition.
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STMicroelectronics Extends USB Fast Charging over USB-C with USB-IF-Certified Embedded Development Board
by audioXpress Staff

STMicroelectronics Extends USB Fast Charging over USB-C with USB-IF-Certified Embedded Development Board

STMicroelectronics is facilitating modernization of battery-powered products to capture the advantages of the latest USB Power Delivery (USB PD) technology including faster charging and easy reuse of USB-C chargers and cables. The company's latest USB-IF-certified solution provides solid reference for end-product certification, while promoting reuse and reliable interoperability for existing USB-C fast chargers and cables with USB Power Delivery support.
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Sound Semiconductor Expands IC Range with New Single and Dual VCA Chips
by audioXpress Staff

Sound Semiconductor Expands IC Range with New Single and Dual VCA Chips

Sound Semiconductor announced single and dual channel VCA additions to its product lineup, the ProCircuit SSI2161 and FatKeys SSI2162.The ICs are part of a family of affordable high-performance VCAs from the company, now offering a single, dual and quad versions. The SSI2164 offers four VCAs in a compact SOP package with lowest cost-per VCA, while the new SSI2162 is a versatile building block for high-performance audio applications, and the single-channel SSI2161 provides lowest noise.
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Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products
by audioXpress Staff

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

Nordic Semiconductor announced the nRF52805 Bluetooth 5.2 System-on-Chip (SoC), the seventh addition to its popular and proven nRF52 Series. The new nRF52805 SoC offers Bluetooth LE high-throughput 2 Mbps and enhanced Channel Selection Algorithm #2 for improved coexistence, and 2.4 GHz proprietary protocols for cost-constrained applications. This SoC is an ideal Bluetooth LE solution for high-volume, compact wireless applications.
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Murata Develops Compact Multilayer Ceramic Capacitor
by audioXpress Staff

Murata Develops Compact Multilayer Ceramic Capacitor

Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M multi-layer ceramic capacitor, which the company claims is the world’s first to feature a maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020. Applications can be valuable in wearables devices and compact audio players, among many other products that require large numbers of more compact capacitors.
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Semtech Introduces New RClamp Device for Safeguarding USB Type-C Interfaces
by Cristina Costa

Semtech Introduces New RClamp Device for Safeguarding USB Type-C Interfaces

Semtech Corporation announced the latest addition to its RClamp platform. The RClamp3371ZC exceeds industry immunity standards for electrostatic discharge (ESD) protection robustness while only presenting 250 femtofarads of maximum loading capacitance. Engineered as a low clamping, ultra-low capacitance transient voltage suppression (TVS) device, the RClamp3371ZC is an ideal solution for safeguarding high speed interfaces, such as USB Type-C, from common ESD threats.
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Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2
by audioXpress Staff

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

Qualcomm Technologies, launched a flagship portfolio of mobile connectivity systems that represent the most advanced Wi-Fi 6E offerings of their kind. Building upon the company's existing Wi-Fi 6 and Bluetooth audio solutions, the new Qualcomm FastConnect 6900 and Qualcomm FastConnect 6700 systems feature the fastest available Wi-Fi speeds in the industry (up to 3.6 Gbps) on a mobile Wi-Fi offering, low latency and the latest Bluetooth 5.2 advancements delivering improved audio experiences for classic and emerging LE Audio use cases.
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