All items in category Electronics Corner
Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products
by audioXpress Staff

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

Nordic Semiconductor announced the nRF52805 Bluetooth 5.2 System-on-Chip (SoC), the seventh addition to its popular and proven nRF52 Series. The new nRF52805 SoC offers Bluetooth LE high-throughput 2 Mbps and enhanced Channel Selection Algorithm #2 for improved coexistence, and 2.4 GHz proprietary protocols for cost-constrained applications. This SoC is an ideal Bluetooth LE solution for high-volume, compact wireless applications.
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Murata Develops Compact Multilayer Ceramic Capacitor
by audioXpress Staff

Murata Develops Compact Multilayer Ceramic Capacitor

Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M multi-layer ceramic capacitor, which the company claims is the world’s first to feature a maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020. Applications can be valuable in wearables devices and compact audio players, among many other products that require large numbers of more compact capacitors.
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Semtech Introduces New RClamp Device for Safeguarding USB Type-C Interfaces
by Cristina Costa

Semtech Introduces New RClamp Device for Safeguarding USB Type-C Interfaces

Semtech Corporation announced the latest addition to its RClamp platform. The RClamp3371ZC exceeds industry immunity standards for electrostatic discharge (ESD) protection robustness while only presenting 250 femtofarads of maximum loading capacitance. Engineered as a low clamping, ultra-low capacitance transient voltage suppression (TVS) device, the RClamp3371ZC is an ideal solution for safeguarding high speed interfaces, such as USB Type-C, from common ESD threats.
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Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2
by audioXpress Staff

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

Qualcomm Technologies, launched a flagship portfolio of mobile connectivity systems that represent the most advanced Wi-Fi 6E offerings of their kind. Building upon the company's existing Wi-Fi 6 and Bluetooth audio solutions, the new Qualcomm FastConnect 6900 and Qualcomm FastConnect 6700 systems feature the fastest available Wi-Fi speeds in the industry (up to 3.6 Gbps) on a mobile Wi-Fi offering, low latency and the latest Bluetooth 5.2 advancements delivering improved audio experiences for classic and emerging LE Audio use cases.
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Cirrus Logic Launches Advanced Haptic and Sensing IC Solutions for Richer, Immersive User Experiences
by audioXpress Staff

Cirrus Logic Launches Advanced Haptic and Sensing IC Solutions for Richer, Immersive User Experiences

With the goal of elevating the user experience for a wide range of consumer devices, Cirrus Logic is leveraging its low-power, low-latency mixed-signal processing technology to develop an advanced product portfolio of haptic and sensing integrated circuits (ICs) that enable increased functionality and sleek buttonless designs for smartphones, PCs, wearables, gaming, virtual reality and automotive applications. Cirrus Logic’s haptic products and sophisticated haptic feedback technology enable sleeker, more robust end products with fewer mechanical controls for new responsive and immersive user experiences.
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Pico Technology Extends Range of PC-Based Mixed Signal Oscilloscopes
by audioXpress Staff

Pico Technology Extends Range of PC-Based Mixed Signal Oscilloscopes

Pico Technology announced the further development of its PicoScope 6000E Series oscilloscopes with the launch of three new 4-channel models, each of which can be configured with 16 optional digital channels. With bandwidths of 300 or 500 MHz, 8-bit or 8/10/12-bit Flexible Resolution and up to 4 GS deep capture memory, these products enhance the existing PicoScope 6000E portfolio, adding to the 8-channel models that were introduced earlier in the year.
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Automotive-Compliant ReDriver from Diodes Enables DisplayPort via USB Type-C
by Cristina Costa

Automotive-Compliant ReDriver from Diodes Enables DisplayPort via USB Type-C

Diodes Incorporated announced the industry's first automotive AEC-Q100 grade 3 qualified 10Gbps USB-C DisplayPort Alternate (DP-Alt) mode linear ReDriver integrated circuit. The DP-Alt mode allows the transfer of DisplayPort signals through a USB Type-C connector. Supporting 8.1Gbps DP1.4 and the 10Gbps USB 3.2 specifications, the PI3DPX1207Q provides a transparent, protocol-agnostic ReDriver capability for a range of automotive applications including infotainment systems and cluster display panels.
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Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Solutions
by audioXpress Staff

Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Solutions

Microchip Technology is determined to meet the growing need for power-efficient inferencing in edge applications by making it easier for software developers to implement their algorithms in PolarFire field-programmable gate arrays (FPGAs). As a significant addition to its solutions portfolio in this segment, Microchip’s VectorBlox Accelerator Software Development Kit (SDK) helps developers take advantage of Microchip’s PolarFire FPGAs for creating low-power, flexible overlay-based neural network applications without learning an FPGA tool flow.
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NXP Extends Wireless MCU Family with New Devices Featuring Enhanced Bluetooth 5 Capabilities
by Cristina Costa

NXP Extends Wireless MCU Family with New Devices Featuring Enhanced Bluetooth 5 Capabilities

NXP Semiconductors announced the availability of new devices within its KW3x family of microcontrollers (MCUs). The new KW39/38/37 MCUs add Bluetooth 5.0 long-range capabilities and expanded Bluetooth advertising channels. These enhancements are made while offering seamless migration with hardware, software and tools compatibility with the previous generation of devices, KW34/35/36. The new wireless MCU solutions allow developers to address emerging use cases within automotive applications.
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Next-Generation AVR DA Microcontroller Family From Microchip Enables Real-Time Control, Connectivity and HMI Applications
by audioXpress Staff

Next-Generation AVR DA Microcontroller Family From Microchip Enables Real-Time Control, Connectivity and HMI Applications

As the Internet of Things (IoT) delivers greater connectivity for industrial and home applications and as connected vehicles enhance cabin and operational features, higher-performance microcontrollers are required for better real-time control as well as to enable enhanced human machine interface applications. Microchip Technology announced its next generation AVR DA family of microcontrollers (MCUs) – its first Functional Safety Ready AVR MCU family with Peripheral Touch Controller (PTC).
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