Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

May 29 2020, 00:30
Qualcomm Technologies, launched a flagship portfolio of mobile connectivity systems that represent the most advanced Wi-Fi 6E offerings of their kind. Building upon the company's existing Wi-Fi 6 and Bluetooth audio solutions, the new Qualcomm FastConnect 6900 and Qualcomm FastConnect 6700 systems feature the fastest available Wi-Fi speeds in the industry (up to 3.6 Gbps) on a mobile Wi-Fi offering, low latency and the latest Bluetooth 5.2 advancements delivering improved audio experiences for classic and emerging LE Audio use cases.
 

“With the introduction of the FastConnect 6900 and 6700 solutions, Qualcomm Technologies is redefining the mobile experience by extending the power of Wi-Fi 6 into the 6 GHz band and advancing wireless audio with cutting-edge integrated Bluetooth 5.2 features,” says Dino Bekis, vice president and general manager, mobile and compute connectivity, Qualcomm Technologies. “These innovations enable us to further break away from the pack and deliver a connectivity portfolio optimized to accelerate global adoption across multiple smartphone tiers.”

"Wi-Fi 6E delivers an unprecedented improvement in capacity to meet the rapid growth of connected devices and data demand. The introduction of supporting chipsets so soon after the FCC ruling ensures customers will see the benefits quickly and is an indicator of both Qualcomm Technologies’ investment and broad industry collaboration," says Geoff Blaber, vice president, research, Americas, CCS Insights.

"Wi-Fi Alliance members have mobilized around 6 GHz in an unprecedented way, and we’re excited to see Wi-Fi 6E solutions rapidly coming to market with the availability of new unlicensed spectrum in the U.S.," says Kevin Robinson, Senior VP of Marketing, Wi-Fi Alliance. "Solutions like these from Qualcomm will help users fully experience Wi-Fi in 6 GHz and quickly benefit from faster speeds, higher capacity, and lower latency applications."

Next-Generation Wi-Fi 6E for Mobile and Computing 
The new Qualcomm portfolio extends advanced Wi-Fi 6 feature implementations into the 6 GHz band. Using a 14nm process node, combined with advanced power-management architecture the new chips provide up to 50 percent improvement in power efficiency, compared to previous generation solutions.

Driving this performance for both FastConnect systems are differentiated features such as Qualcomm 4K QAM (2.4, 5, 6 GHz) – an industry first implementation of this advanced modulation technique can extend the maximum QAM rate, across any supported band, from 1K to 4K for enhanced gaming and ultra HD streaming. 160 MHz channels support in both 5 and 6GHz bands, dramatically expanding throughput while reducing congestion.

The FastConnect 6900 chip delivers an extra boost of performance through an additional feature implementation of 4-stream Dual Band Simultaneous (DBS) with multi-band (including 6 GHz) capabilities.

6 GHz dramatically expands Wi-Fi capacity by adding up to 1200 MHz of additional spectrum, more than doubling the number of pathways currently available for sending and receiving data. Dual band 160 MHz supports up to seven additional non-overlapping channels in the 6 GHz band, in addition to 160 MHz channels available in the 5 GHz band. The technology deploys high-performance uplink / downlink MU-MIMO and OFDMA mobile technologies across all available bands. New Wi-Fi 6 Uplink MU-MIMO capability can increase network capacity by more than 2.5x. A new class of low latency and high speed for emerging mobile applications, providing the foundation for explosive growth in mobile gaming and XR application.
 

Bluetooth 5.2 with Advanced Audio
Both FastConnect 6900 and 6700 support the latest Bluetooth 5.2 specification with the latest audio advancements for greatly improved wireless experiences. The Qualcomm Bluetooth 5.2 implementation includes a second Bluetooth antenna with intelligent switching capabilities, overcoming common signal shadowing issues for unparalleled Bluetooth reliability and range.

Both chips are engineered to address emerging LE Audio experiences such as multi-point audio sharing and broadcast audio, enabling multiple audio connections simultaneously. The systems also offer Qualcomm aptX Adaptive supporting wire-equivalent audio (up to 96kHz) and Qualcomm aptX Voice providing super-wideband quality calls. When paired with the premium features of Qualcomm QCC5141, QCC5144, QCC3046 and QCC3040 Audio SoCs, developers can expect robust, premium audio quality with low power consumption.
https://www.qualcomm.com
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