Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio
Waves Unveils Nx Speakers 3D Audio Technology at CES 2020
Sonarworks Enables Personalized Audio, Perfected for Any Device, with SoundID
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    Panasonic Shows Strong True Wireless Ambitions at CES 2020
    Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio
    Shure Unveils New AONIC Line of Wireless Noise-Cancelling Headphones and True Wireless Earphones at CES 2020
    Libre Wireless Technologies Introduces New Universal Wireless Audio Streaming and Multiroom Audio End Point
    Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs
    Synopsys Announces Bluetooth LE Audio LC3 Codec for ARC Processor
    Selective Noise Cancellation with ams AS3460 Digital Augmented Hearing Chip for True Wireless Earbuds Demonstrated at CES 2020