Cadence confirmed that it licensed reference code from Fraunhofer IIS to enable availability of LC3 in conjunction with the initial LE Audio launch, allowing audio manufacturers to immediately benefit from latest performance enhancements enabled by new Bluetooth audio mode, including longer battery life, improved connectivity and multi-user sharing.
“Consumer demand for a wide range of Bluetooth audio-based products from headphones and TWS earbuds to portable speakers continues to explode. We are excited that our contributions to LC3 help deliver higher quality and more robust experiences,“ says Marc Gayer, head of business department in the audio and multimedia division of Fraunhofer IIS. “We worked early on in the development of the codec to ensure that LC3 would run extremely efficiently on the Cadence Tensilica HiFi Audio DSP architecture, which translates to extended battery life for consumers.”
“The fact that the LC3 codec can provide very high-quality audio even at low bitrates makes it a key feature of the upcoming LE Audio standard,” says Mark Powell, executive director of the Bluetooth Special Interest Group (SIG). “We are pleased to see member companies working on implementations of the LC3 codec optimized for various processor architectures.”
“Fraunhofer continues to prove that it is an innovative leader in the world of audio/voice codecs with its critical contributions to the new LC3 standard,” says Gerard Andrews, director of audio/voice IP marketing at Cadence. “By working closely with Fraunhofer throughout the development of this audio codec, we are able to offer a highly optimized, ultra-low power implementation on the HiFi architecture in concert with the announcement of LE Audio. This is an example of how we’re continuing to enhance our best-in-class HiFi technology to deliver performance excellence for our customers’ audio and voice implementations.”
Tensilica HiFi DSPs are the most widely licensed audio/voice/AI speech processors. Part of the broad Cadence IP portfolio, they enable SoC design in support of Cadence’s Intelligent System Design strategy, which helps manufacturers develop differentiated products — from chips to boards to intelligent systems — in multiple market segments.