Better Acoustics, Better Designs in audioXpress August 2024!

Better Acoustics, Better Designs in audioXpress August 2024!
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Audio Amplification Meets Product Development in audioXpress July 2024

Audio Amplification Meets Product Development in audioXpress July 2024
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The Audio Voice - Weekly Newsletter for audioXpress and Voice Coil Communities

The Audio Voice - Weekly Newsletter for audioXpress and Voice Coil Communities
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Aiming for Better Loudspeaker Designs in Voice Coil July 2024

Aiming for Better Loudspeaker Designs in Voice Coil July 2024
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Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers
by audioXpress Staff

Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers

Swedish digital audio processing pioneer Dirac and leading multinational chipset maker BES announced a partnership to pre-integrate the Dirac Virtuo and Dirac Opteo software onto BES chipsets to be used by leading headphone manufacturers to deliver optimized performance in any headphone type. The announcement was made at CES 2023, where it was confirmed that boAt, Monoprice, and Sudio are the first headphone brands to leverage these Dirac-enabled BES chipsets in their devices.
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Test Bench: The W4-2356 4" Full Range from Tang Band (TB) Speaker
by Vance Dickason

Test Bench: The W4-2356 4" Full Range from Tang Band (TB) Speaker

The intriguing W4-2356 driver from Tang Band Speaker (TB Speaker) is built on a proprietary and patented injection-molded polymer four-spoke frame that allows the voice coil not to be centered in the 4" injection-molded polypropylene cone, but offset by about half inch. The aim for this original off-axis design, is to defeat concentric cone modes, a well-known source of coloration in round voice coil transducers. This article was originally published in Voice Coil, September 2022.
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Practical Test & Measurement: The Benefits of Using Structure-Borne Sound in Headset Signal Processing
by Hans W. Gierlich

Practical Test & Measurement: The Benefits of Using Structure-Borne Sound in Headset Signal Processing

This article looks at the practical test and measurement of bone conduction technology, as used in product development for headsets and in-ear devices. It showcases new possibilities for manufacturers to better evaluate device performance, since no appropriate test equipment and methods were commercially available until now. The approach, complements a Head-and-Torso Simulator (HATS) with an actuator capable of generating structure-borne sound in the artificial ear. This way, a realistic simulation of the human structure-borne voice signal for in-ear headsets is possible.. This article was originally published in audioXpress, January 2023.
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    The Return of the Apple HomePod, Now with UWB, Matter, Bluetooth 5 and... Spatial Audio
    by Joao Martins

    The Return of the Apple HomePod, Now with UWB, Matter, Bluetooth 5 and... Spatial Audio

    Following a surprise announcement of new M2 silicon for its MacBook Pro and Mac mini models, Apple surprised us even more with the announcement of the return of the infamous HomePod. Now packed full of innovations, more sensors, improved Siri features like the HomePod mini, and Matter-compatible smart home capabilities, the new HomePod returns with the same form factor, but now with updated Bluetooth 5 technology, UWB, Airplay 2, and the same smart, adaptive listening experience.
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    Infineon Announces Partner Ecosystem for Latest MERUS Multilevel Class-D Audio Amplifier Technology
    by audioXpress Staff

    Infineon Announces Partner Ecosystem for Latest MERUS Multilevel Class-D Audio Amplifier Technology

    Infineon Technologies recently introduced its latest generation of MERUS multilevel Class-D audio amplifiers, and now the company announced new ecosystem partners that are ready to support interested developers and manufacturers with their design-in efforts. Partnering with the experts, the company aims to boost the adoption of these new amplifiers with a unique Class D modulation of up to 5 different output voltage levels.
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    The Audio Engineering Society Welcomes Bruce Olson as President
    by Audio Engineering_Society

    The Audio Engineering Society Welcomes Bruce Olson as President

    The AES welcomed Bruce Olson as President for 2023, the Society’s 75th anniversary year. Olson, whose term of service began on January 1, is an AES Fellow whose decades of active service to the Society have helped shape international audio standards and practices, while he has further contributed to the Society as a Governor and Chair, Treasurer, and committee member of his local AES section.
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    xMEMS Announces Montara Plus 2nd Generation High-Sensitivity Solid-State MEMS Drivers for Hi-Res Audiophile-Grade IEMs
    by Joao Martins

    xMEMS Announces Montara Plus 2nd Generation High-Sensitivity Solid-State MEMS Drivers for Hi-Res Audiophile-Grade IEMs

    xMEMS Labs introduced Montara Plus, its 2nd generation high-res full-range (20Hz to 40KHz) monolithic MEMS micro speaker. At just 64mm3, Montara Plus delivers 120dB SPL at 1kHz. Matching the new Montara Plus, targeting the high end market, xMEMS announced a partnership with iFi Audio and Singularity Audio, which will be launch partners for DAC/amp and IEMs respectively.
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    Harman Unveiled Innovative Automotive Audio Solutions to Bolster In-Vehicle Experience and Safety
    by Joao Martins

    Harman Unveiled Innovative Automotive Audio Solutions to Bolster In-Vehicle Experience and Safety

    As the "automotive technology company and subsidiary of Samsung Electronics," Harman was one of the busiest companies at CES 2023. Among the many automotive systems, Harman announced its new Sound and Vibration Sensor and External Microphone products to enhance the audio experience inside and outside the vehicle. It also launched Harman Ready on Demand, a software platform and marketplace that allows users to download and activate new audio features.
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    Audient Expands EVO Range with SP8 With 8-Channel Smart Mic Preamp
    by audioXpress Staff

    Audient Expands EVO Range with SP8 With 8-Channel Smart Mic Preamp

    Audient expanded its EVO range of USB-C audio interfaces with the EVO SP8 8-Channel Smart Mic Preamp ada AD/DA converter, a compact unit combining 8 microphone/line inputs, 8 line outputs, and two ADAT I/O connections, allowing it to handle multi-mic recording sessions with ease. Building upon its successful EVO range of audio recording equipment, Audient designed the EVO SP8 to expand the possibilities of its EVO audio interface range for bigger multitrack sessions.
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    High End 2023 Munich Audio Show to Break Past Records
    by audioXpress Staff

    High End 2023 Munich Audio Show to Break Past Records

    The Munich High End audio show plays an essential role as one the most important marketplaces for the audio industry. The 40th edition of the show, May 18-21, promises to break all records. Following the registration deadline for exhibitors, the High End Society reported increasing demand for the international audio show. The 2023 edition will see the second edition of the IPS – International Parts + Supply B2B section now taking place on all four days of the High End show, and supported by the ALTI Association.
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