All items tagged with voice recognition (313)
Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor
November 13, 2019 by audioXpress Staff

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

DSP processing software specialist firm, Alango has been working to port the company's Voice Enhancement Package (VEP) to the NXP i.MX RT600 cross-over processor family, which is optimized for 32-bit immersive audio applications combining a high-performance Cadence Tensilica Hi-Fi 4 audio DSP core with a next-generation Cortex-M33 core. VEP is a set of Alango proprietary far-field voice enhancement technologies developed to improve human to machine interaction in a variety of applications.
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New TI Burr-Brown Audio Quad-Channel ADC Captures Voice at Four Time Larger Distances
November 5, 2019 by audioXpress Staff

New TI Burr-Brown Audio Quad-Channel ADC Captures Voice at Four Time Larger Distances

No more yelling at smart speakers. Texas Instruments (TI) introduced a new audio analog-to-digital converter (ADC) capable of capturing clear audio up to four times farther away than competing devices. The new TI Burr-Brown TLV320ADC5140 audio ADC enables far-field voice capture and achieves a 120-dB dynamic range for clear, high-fidelity audio in smart home applications. The TLV320ADC5140 is the industry’s smallest quad-channel audio ADC with this level of performance.
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XMOS VocalFusion 2-Mic Dev Kit for Alexa Voice Service Qualified by Amazon
October 29, 2019 by audioXpress Staff

XMOS VocalFusion 2-Mic Dev Kit for Alexa Voice Service Qualified by Amazon

Amazon has qualified the VocalFusion 2-mic dev kit for Alexa Voice Services launched by XMOS for smart TVs and set-top boxes in July 2019. The qualification highlights the opportunity for manufacturers to build Amazon Alexa voice capabilities into their products more easily and cost effectively than ever before. Amazon highlights the product’s engineering innovation, enabling lower cost voice capabilities with all the performance of a 4-mic solution, and paving the way for mass market implementation of far-field applications.
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Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility
October 21, 2019 by audioXpress Staff

Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility

Sonion, the manufacturer of components and solutions for hearing aids and in-ear headphones, announced that it is now a member of the Qualcomm Extension Program and will offer the Sonion Voice Pick Up Bone Sensor on the Qualcomm Ultra-Low Power QCC5100 Bluetooth SoC series in Q1 2020. The combination will allow other audio manufacturers to implement reliable voice quality and voice recognition applications that are not hindered by surrounding noise.
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Waves Unveils New Audio Testing Labs in Taipei
October 7, 2019 by audioXpress Staff

Waves Unveils New Audio Testing Labs in Taipei

Waves is opening a new state-of-the-art audio and voice testing labs at the company's Taipei location, establishing a commitment to support the growing market for voice-enabled connected devices. The new facilities include 4 ETSI testing labs and one custom designed anechoic chamber for precision acoustic measurements. The labs are designed for testing voice communication and automatic speech recognition technologies for smart speakers and other mobile devices.
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NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications
October 4, 2019 by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.
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XMOS Secures $19M Funding to Accelerate Global Growth and Support Development in Voice Interfaces
October 1, 2019 by audioXpress Staff

XMOS Secures $19M Funding to Accelerate Global Growth and Support Development in Voice Interfaces

XMOS, a Bristol-based technology company, specialising in voice-processing, edge-AI and connected devices, announced the completion of a new $19 million financing round — fueling the company’s global growth, consolidating its technical leadership in far-field voice interfaces and developing a new product roadmap for the artificial intelligence of things (AIoT). The funds will also enable an expanded global footprint — including new staff in its Hong Kong office.
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Amazon Announces Voice Interoperability Initiative with Leading Technology Companies
September 26, 2019 by audioXpress Staff

Amazon Announces Voice Interoperability Initiative with Leading Technology Companies

Amazon, Baidu, Sony, BMW, Microsoft, Bose, Tencent, Orange, Salesforce, Harman, Logitech, Verizon, Sonos, Spotify, Sound United, and more are joining forces to promote choice by supporting multiple, interoperable voice services on a single device. The idea is to offer multiple, simultaneous wake words, so users can access multiple voice services by simply saying the corresponding wake word – from Alexa and Cortana to Orange’s Djingo, Salesforce’s Einstein, and more.
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Smart Speaker Market to Reach 92 Million Units Shipped in 2019
September 18, 2019 by audioXpress Staff

Smart Speaker Market to Reach 92 Million Units Shipped in 2019

The smart speaker market will grow by 35% this year, according to SAR Insight & Consulting’s Latest Digital Assistant Platform Forecast DATAbase, with shipments reaching 92 million. Amazon remains the market leader, but its smart speaker market share has declined and now represents approximately a third (33%) of the total volume anticipated in 2019. Total voice software unit shipments are expected to increase significantly to 2024.
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DSP Concepts TalkTo Audio Voice Capture Technology Enables New Exciting Products at IFA 2019
September 11, 2019 by audioXpress Staff

DSP Concepts TalkTo Audio Voice Capture Technology Enables New Exciting Products at IFA 2019

Audio processing embedded software provider DSP Concepts announced that it has delivered the industry’s most advanced voice user interface and audio playback technology, resulting in Braun Audio shipping the industry’s first multichannel product with hands-free, far-field voice control for Google Assistant. As anticipated, Braun’s return to the premium audio market was recently confirmed at IFA 2019, resulting from a collaboration with DSP Concepts, Pure, StreamUnlimited, and Karl-Heinz Fink.
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