All items tagged with ultra-low power (35)

GreenWaves Ramps Up Production of GAP9 Hearables Platform

March 9, 2023 by Joao Martins

GreenWaves Ramps Up Production of GAP9 Hearables Platform

GreenWaves Technologies, a fabless semiconductor company based in Grenoble, France, has received the funding needed to support the production of its second-generation GAP9 processor. As demonstrated at CES 2023, this advanced AI processor revolutionizes the next generation of true wireless earbuds, hearables, and connected devices with ultra-low latency noise cancellation, neural network-based background elimination and 3D sound.

Infineon Announces AIROC CYW43022 Wi-Fi 5 and Bluetooth Combo for Low Power Designs

March 6, 2023 by Cristina Costa

Infineon Announces AIROC CYW43022 Wi-Fi 5 and Bluetooth Combo for Low Power Designs

Infineon Technologies announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth 5.3 combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products. The CYW43022 ultra-low power architecture delivers industry-leading performance, with up to a 65 percent reduction in power usage during "deep sleep," significantly extending battery life for applications in connected smart home devices and wearables.

Syntiant Launches NDP115 Neural Decision Processor for Always-On Speech and Sensor-Fusion

February 14, 2023 by Joao Martins

Syntiant Launches NDP115 Neural Decision Processor for Always-On Speech and Sensor-Fusion

It was one of the key audio-related demonstrations at the Syntiant suite during CES 2023, and the new NDP115 Neural Decision Processor is now positioned as a key strategic platform for new compact, ultra-low-power designs with always-on voice and sensor fusion applications. The newest addition to Syntiant's family of special purpose silicon is built using the company’s Syntiant Core 2 inference engine that can run multiple neural network loads at under 1mW.

Exeger and E-Peas Partner to Create Energy Harvesting Solutions for Connected Devices

December 21, 2022 by audioXpress Staff

Exeger and E-Peas Partner to Create Energy Harvesting Solutions for Connected Devices

Exeger, the Swedish company behind the revolutionary solar cell technology Powerfoyle, announced a partnership with Belgium-based Ultra Low Power Management semiconductor company e-peas. Experts in ultra-low power, high efficiency Power Management Integrated Circuits (PMICs) for energy harvesting, e-peas' Ambient Energy Manager (AEM) products portfolio, combined with the complete Energy Harvesting ecosystem provide clear benefits to many industry segments such as consumer electronics.

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs

November 15, 2022 by audioXpress Staff

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs

CEVA announced the availability of its WhisPro speech recognition and control software to support designs using the Texas Instruments (TI) SimpleLink Wi-Fi CC3235x wireless MCU family, bringing ultra-low power, robust voice user interface to connected devices. The WhisPro Software Development Kit (SDK) allows full project customization, including choice of wake words and voice commands, and runs entirely on-device, without the need for a network connection.

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

November 9, 2022 by audioXpress Staff

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

MediaTek launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe. Most importantly for the audio industry, this new solution will bring Bluetooth LE Audio support to many smartphones in 2023.

NGK Showcases Ultra-Thin EnerCera Batteries for Connected Devices and Powerfoyle-Based Position Tracker at electronica 2022

November 9, 2022 by Joao Martins

NGK Showcases Ultra-Thin EnerCera Batteries for Connected Devices and Powerfoyle-Based Position Tracker at electronica 2022

NGK Insulators will participate in electronica 2022 from November 15-18, in Munich, Germany for the first time. The Japanese multinational will use the opportunity to showcase its latest solar powered indoor/outdoor position tracker using Exeger's Powerfoyle technology, together with its latest EnerCera thin and flexible ceramic batteries, ideal for wearable and small connected devices, including headphones and portable audio applications.

USound New High-Performing ASIC Linear Audio Amplifier Boosts the Battery Life of TWS and Hearing Aids

October 24, 2022 by Joao Martins

USound New High-Performing ASIC Linear Audio Amplifier Boosts the Battery Life of TWS and Hearing Aids

Austrian MEMS speaker pioneer USound continues to pursue the integration of its patented drivers in solutions that are ready for manufacturers to use. Following the release of a complete audio module for true wireless earbuds and hearing aids, the company now announced the launch of a new ASIC linear audio amplifier, Tarvos 1.0 UC-P3010, purposely designed to drive USound MEMS speakers. This new audio amplifier also boosts the battery life, meeting or exceeding current market requirements.

Exeger and Atmosic Technologies Partner to Create Energy Harvesting Solutions

September 12, 2022 by Joao Martins

Exeger and Atmosic Technologies Partner to Create Energy Harvesting Solutions

Exeger, the innovative Swedish company that created a unique solar cell flexible membrane that converts all forms of light into electrical energy continues to establish strategic partnerships and expand its proof-of-concept use cases. Exeger and US-based semiconductor company Atmosic Technologies are now working together to create attractive energy harvesting solutions for connected devices. Meanwhile, Exeger attended the IBC show in Amsterdam, to demonstrate a new TV remote control from Omni Remotes that will remain perpetually charged.

NFC Forum Defines Card Emulation Device Class Specification for Low-Cost Wearable Solutions

September 6, 2022 by Joao Martins

NFC Forum Defines Card Emulation Device Class Specification for Low-Cost Wearable Solutions

The NFC Forum unveiled a new NFC Device Class specification that provides device manufacturers and OEMs with a miniature, low-cost, sustainable solution for wireless wearable devices. The Card Emulation (CE) Device class is the first of its kind answering an industry need for wearable devices that provide basic functionality and longer battery life in a tiny footprint while maintaining interoperability with the current NFC ecosystem.

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