All items tagged with ultra-low power (48)

Innatera Unveils Pulsar Neuromorphic Processor at Computex 2025

May 27, 2025 by Kirsten Campbell

Innatera Unveils Pulsar Neuromorphic Processor at Computex 2025

Following earlier demonstrations at multiple industry trade shows, including Mobile World Congress and electronica Munich, Innatera has now launched its first mass-produced neuromorphic processor at Computex 2025 in Taiwan. Powered by spiking neural networks and designed to deliver real-time intelligence at ultra-low power, on-device, the Innatera Pulsar processor unlocks a new era of real-time processing of sensor data, including microphones, exactly where it’s generated.

Semtech Develops New Ultra-Low Power Radio for Sonova Hearing-Aids

May 12, 2025 by Joao Martins

Semtech Develops New Ultra-Low Power Radio for Sonova Hearing-Aids

Sonova, the Swiss group of companies specialized in hearing aids and hearing care, as well as the manufacturer of consumer audio products under the licensed Sennheiser brand, selected Semtech Corporation, a California-based semiconductor manufacturer of high-performance connectivity products, as a technology partner to create a new ultra-small and ultra-low power 2.4GHz wireless radio and power management IC.

NewSound Unveils OTC Hearing Aids with AI Acceleration by Femtosense

March 28, 2025 by Joao Martins

NewSound Unveils OTC Hearing Aids with AI Acceleration by Femtosense

NewSound launched its first truly AI-driven over-the-counter (OTC) hearing aids, powered by Femtosense’s AI Acceleration. With over two decades of expertise, the Chinese hearing aids innovator understood the power of the Femtosense Sparse Processing Unit 001 (SPU-001) for hearing assistance. This purely on-device processor allowed NewSound to launch its first affordable, accessible hearing aids based on Speech Enhancement technology from the Californian company.

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

March 11, 2025 by Joao Martins

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

Synaptics has extended its Veros Triple Combo connectivity portfolio with the launch of the latest SYN461x family of ultra-low-power Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0, Bluetooth LE Audio with Auracast, and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for embedded applications in Edge AI connected devices, the Veros SYN461x family is optimized for system integration, size, and rapid time to market.

STMicroelectronics Reveals New STM32 Ultra-Low Power MCUs and Wireless Microcontrollers

March 5, 2025 by Joao Martins

STMicroelectronics Reveals New STM32 Ultra-Low Power MCUs and Wireless Microcontrollers

STMicroelectronics has introduced new STM32U3 microcontrollers (MCUs) with power-saving innovations that ease deployment of smart connected devices, especially in remote locations. The company has also unveiled the next generation of its STM32 power-efficient short-range wireless microcontrollers that simplify connecting consumer and industrial devices. The two new MCUs leverage near-threshold chip design to set a record performance-per-watt efficiency benchmark.

Airoha Technology Launches Flagship Wireless AI Audio SoC

December 30, 2024 by Joao Martins

Airoha Technology Launches Flagship Wireless AI Audio SoC

Airoha Technology announced the launch of a new flagship wireless audio chip with integrated AI processing. The AB1595 chip integrates essential functions that currently require multiple chips into one single system-on-chip (SoC). The announcement follows a recent press conference where the MediaTek subsidiary confirmed its intention to lead the market as a Bluetooth audio supplier and to outgrow the industry with AI-powered solutions in 2025.

PIMIC and ZillTek Launch Integrated Edge AI and Microphone Noise Cancellation Solution

December 23, 2024 by Joao Martins

PIMIC and ZillTek Launch Integrated Edge AI and Microphone Noise Cancellation Solution

PIMIC, a new company working on ultra-low-power AI technology, unveiled the Clarity NC100, a Deep Neural Network (DNN)-based Environmental Noise Cancellation (ENC) chip that sets a new benchmark for performance and edge AI compute efficiency. Working in partnership with Taiwan-based MEMS microphone developer ZillTek, at CES 2025 the Californian company will present an integrated edge AI chip and digital microphone designed to address noise cancellation challenges in a single package.

AONDevices and Atmosic Technologies Unveil Always-On Smart Remote Control Platform

December 11, 2024 by Joao Martins

AONDevices and Atmosic Technologies Unveil Always-On Smart Remote Control Platform

A remote control that doesn’t require replacing batteries is something that we all want. But what about an ultra-low power, OEM-ready design that combines voice AI, sound detection and even speaker identification? And still doesn’t require changing batteries? That’s what AONDevices, a leading ultra-low-power, high-accuracy edge AI developer, and Atmosic Technologies, the company specializing in ultra-low-power wireless platforms, will showcase at CES 2025.

Enabling Lossless Spatial Audio in Wireless Headphones Using Integrated Wi-Fi

November 13, 2024 by Joao Martins

Enabling Lossless Spatial Audio in Wireless Headphones Using Integrated Wi-Fi

InnoPhase IoT, a semiconductor company specializing in ultra-low power Wi-Fi, and GreenWaves Technologies, the company pioneering ultra-low power AI and DSP processors for hearables and connected devices, announced the development of a lossless audio reference design for Wi-Fi headphones. In collaboration with Danish pioneer IDUN Audio, InnoPhase and GreenWaves have created a platform that enables Spatial Audio for hearables and headphones with extended range and long battery life.

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

August 14, 2024 by Cristina Costa

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.

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