All items tagged with ultra-low power (35)

Bose to Launch New Wireless Earbuds Powered by Qualcomm S5 Audio SoC

September 2, 2022 by Joao Martins

Bose to Launch New Wireless Earbuds Powered by Qualcomm S5 Audio SoC

At IFA 2022 in Berlin, Qualcomm Technologies and Bose highlighted their continued collaboration during Cristiano Amon’s opening keynote. Bose is integrating Qualcomm wireless voice and music platforms across their portfolio of premium earbuds, headphones, speakers and soundbars. Qualcomm also confirmed that the new Bose QuietComfort Earbuds II, which are scheduled to be unveiled September 7, will be Powered by the new Qualcomm S5 Sound Platform.

August 30, 2022 by Joao Martins

Exeger Establishes Partnerships to Improve Efficiency of Its Powerfoyle Energy-Harvesting Technology

Exeger, the innovative Swedish technology company behind the revolutionary solar cell technology Powerfoyle, announced its partnership with Switzerland-based semiconductor manufacturer EM Microelectronic to develop boost-converter solutions that can expand the efficiency of energy-harvesting applications. In early 2022, Exeger had already announced a partnership with NGK to use EnerCera thin and flexible batteries combined with Powerfoyle technology.

Nordic Semiconductor Announces Its First Wi-Fi Chip

August 19, 2022 by Cristina Costa

Nordic Semiconductor Announces Its First Wi-Fi Chip

Following the acquisition of the Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group in 2020, Nordic Semiconductor announced its entry into the Wi-Fi wireless market with the introduction of the nRF7002, an ultra-low power, dual-band Wi-Fi 6 companion IC. The launch enables Nordic Semiconductor to offer all three of the world’s most popular wireless connectivity technologies: Bluetooth, Wi-Fi, and cellular, paving the way for new market opportunities.

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

July 21, 2022 by Cristina Costa

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

Dolphin Design, an advanced chip design company and leading specialist in Edge Computing and AI platforms, and Big Fish Semiconductor have entered into a long-term partnership. Big Fish Semiconductor’s U2 BLE 5.2 Audio AI SoC (TSMC 40nm uLP process ultra-low power audio chip), now in mass fabrication, is the first outcome of this partnership. The high-performance recording capabilities of the U2 BLE 5.2 Audio AI SoC are made possible by Dolphin Design's 24-bit delta-sigma audio ADC, which combines superior audio performance, small area and ultra-low power consumption.

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

June 22, 2022 by audioXpress Staff

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

Texas Instruments expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of typical competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is priced to start as low as $0.79, making it affordable for engineers to add Bluetooth LE connectivity to more products.

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

February 25, 2022 by audioXpress Staff

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

Renesas Electronics announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth Low Energy (LE) low-power, near-field communication standard. The new technologies also achieve a smaller mounting area and better power efficiency. Renesas presented these technologies at International Solid-State Circuits Conference 2022 (ISSCC 2022), held between February 20 and 24 in San Francisco.

TDK Expands SmartSound Family of Performance MEMS Microphones and Introduces New MEMS Microphone with SoundWire at CES 2022

January 11, 2022 by audioXpress Staff

TDK Expands SmartSound Family of Performance MEMS Microphones and Introduces New MEMS Microphone with SoundWire at CES 2022

TDK introduced new digital MEMS microphones as part of its SmartSound family of products for mobile, TWS, and other consumer devices, providing advanced feature sets in small package footprints. The T5848 offers the highest dynamic range with I2S direct audio connectivity to a wide variety of SoCs, MCUs and IoT processors. And TDK also introduced the T5828 MEMS microphone with MIPI SoundWire functionality, adding 68dBA SNR and Acoustic Activity Detect features with always-on ultra-low power mode.

Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications

January 7, 2022 by Joao Martins

Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications

Syntiant, the company focused on making edge AI a reality for always-on applications, announced a new reference design that will enable ODMs and OEMs to easily and quickly deploy ultra-low-power, edge AI voice processing applications in true wireless earbuds. The solution enables multi-lingual custom wake words and speech commands, supported by data training and modeling, providing a complete, end-to-end solution for edge AI processing.

Sounds Great Unveils Motion Microchip and Semiconductor Dynamic Speakers at CES 2022

January 4, 2022 by Joao Martins

Sounds Great Unveils Motion Microchip and Semiconductor Dynamic Speakers at CES 2022

Taiwan-based semiconductor design house Sounds Great is unveiling prototypes of its Motion Microchip and Semiconductor Dynamic Speaker (SDS) solutions at CES 2022 in Las Vegas. The company's technology is the smallest speaker solution of its type, and will be presented as a 1.5x1.5mm single driver or an SDS array, enabling applications from earphones to stereo reproduction in consumer devices. In its second year at CES, the company shows a promising speaker concept with large potential for ultra low-power designs.

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