FastConnect 7900 is a compact 6nm chip, packing all-new AI-optimized Wi-Fi 7 built for extreme power efficiency. Although its core highlight will be the comprehensive proximity awareness capabilities using Wi-Fi Ranging, Bluetooth Channel Sounding, and UWB, this next-generation device is a whole lot more. Adding to its technical prowess, the new FastConnect 7900 chip leverages a new class of RF front-end modules, and next-generation implementation of High Band Simultaneous technology, a key Wi-Fi 7 era innovation at the heart of multi-device experiences and foundational to Qualcomm Expanded Personal Area Network (XPAN) and Snapdragon Seamless experiences. HBS and HBS Multi-Link delivers multiple links of 5 and/or 6GHz, an approach also at the core of XPAN and Snapdragon Seamless technologies.
And of course, FastConnect 7900 paves the way for very interesting audio experiences with support for the new Qualcomm XPAN and the Snapdragon Sound Technology Suite. With these technologies, high-bitrate music streaming can be delivered over Wi-Fi at ultra-low power, from 96kHz scaling up to 192kHz, with whole home, building, and campus coverage. Qualcomm XPAN can also support high-quality audio, and HBS utilizes two simultaneous high-band connections to ensure the very best audio experiences with robustness.
There’s also Bluetooth 5.4, spatial audio, and ANT+ support, Bluetooth LE Audio for personal audio sharing and broadcast for listeners to share streams or join others, multi-stream audio support for true wireless earbuds, and all including support for the complete Qualcomm aptX audio codec family, including Qualcomm aptX Adaptive, Qualcomm aptX Voice, and Qualcomm aptX Lossless. Product designers will also take note of all the audio processing tools that come with Snapdragon Sound technology, including for Low latency Gaming modes with Voice back-channel, and high quality stereo recording.
As it is now mandatory, the new FastConnect 7900 chip from Qualcomm also leverages artificial intelligence, exploring AI-optimized performance to manage Wi-Fi 7, Bluetooth, and UWB technologies in a single chip, and adapting to specific use cases and environments by optimizing power consumption, network latency and throughput, including proximity control over UWB, which is going to be one of the greatest use cases in smart home and home audio applications.
“FastConnect 7900 is a technological feat, leveraging AI to raise the bar and deliver leading Wi-Fi 7 and Bluetooth capabilities while integrating Ultra Wideband all on a single 6nm chip,” explains Javier del Prado, vice president and general manager for mobile connectivity, Qualcomm Technologies. “Building on the legacy of our first-gen Wi-Fi 7 offering found in millions of devices today, FastConnect 7900 creates a new way to connect. The system brings next-level capabilities across AI, proximity, and multi-device experiences into the devices we love most.”
FastConnect 7900 is expected to launch commercially in the second half of 2024 and more details will be released to registered developers and partners. For now the new FastConnect 7900 was immediately praised by mobile devices manufacturers at MWC 2024 in Barcelona. ASUS, Honor, Motorola, nubia, Oppo, Vivo, and Xiaoxiao all confirmed support for the new platform.
www.qualcomm.com
