Dirac Introduces Spatial Audio Solution for Direct Chipset Integration Into Next-Generation Wireless Headphones
Swedish digital audio pioneer Dirac announced that its latest spatial audio solution, which leverages the company's patented Dynamic HRTF technology, is now available for direct integration into the digital signal processors (DSP) of Bluetooth wireless headphones. The solution is now compatible with chipsets from Qualcomm, BES, and MediaTek and allows headphone manufacturers to deliver spatial audio to consumers, independent of playback devices or media players.